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Semiconductor and IC Packaging Material Market Size, Share, and Analysis, By Type (Organic Substrate, Bonding Wires, Lead frames, Encapsulation Resins, Ceramic Packages, Die Attach Materials, Solder Balls, and Others), By Packaging Technology ((SOP), (GA)

Publisher Fatpos Global
Published Nov 01, 2024
Length 495 Pages
SKU # FAGL19607291

Description

Semiconductor and IC Packaging Material Market Size, Share, and Analysis, By Type (Organic Substrate, Bonding Wires, Lead frames, Encapsulation Resins, Ceramic Packages, Die Attach Materials, Solder Balls, and Others), By Packaging Technology ((SOP), (GA), (QFN), (DFN), and Others), By End-User (Consumer Electronics, Automotive, Aerospace & Defense, IT & Telecommunication, Healthcare, and Others), By Region (North America, Europe, Asia-Pacific, and Rest of the World), And Regional Forecast 2024-2034

PRODUCT OVERVIEW

Semiconductor and IC Packaging Material Market is projected to exhibit a Compound Annual Growth Rate (CAGR) of 9.4% during the forecast span from 2024 to 2034. In 2023, the market size was assessed at USD 32.4 billion and is projected to reach USD 86.7 billion by the completion of 2034.

Packaging materials for semiconductors and integrated circuits are an important part of the production of electronic devices. These components function as protective casings for the fragile semiconductor chip and offer physical support and heat regulation. They aim to protect the chips from elements like moisture, dust, and physical pressure. In addition, packaging materials consist of ceramic packages, plastic packages, and advanced materials such as silicon and glass. They include parts such as lead frames and interconnects that help establish electrical links between the chip and the external circuitry. Furthermore, the correct choice and use of these materials are important for ensuring the dependability and effectiveness of semiconductor devices in different industries such as computing, telecommunications, automotive, and consumer electronics.

MARKET HIGHLIGHTS

Semiconductor and IC Packaging Material Market is expected to reach USD 86.7 billion during the forecast period, due to the growing need for advanced electronic devices and the reduction in the size of components. The continuous development of semiconductor technology has resulted in a high demand for advanced packaging materials that can support smaller sizes. Additionally, important factors are influencing this market such as the adoption of wafer-level packaging methods, the innovation of eco-friendly and halogen-free materials, and the integration of thermal interface materials for efficient heat dispersion. Furthermore, major companies in this industry are consistently putting money into research and development to bring new materials and methods that can boost the dependability of the device, along with decreasing packaging dimensions.

Semiconductor and IC Packaging Material Market Segments:
  • By Types
  • Organic substrate
  • Bonding wires
  • Lead-frames
  • Encapsulation resins
  • Ceramic packages
  • Die to attach materials
  • Other
  • By Packaging Technology
  • Small Outline Package (SOP)
  • Grid Array (GA)
  • Dual Flat No-Leads (DFN)
  • Quad Flat Package (QFP)
  • Dual In-Line Package (DIP)
  • Others
  • By End-User
  • Consumer Electronics
  • Automotive
  • Aerospace & Defense
  • IT & Telecommunication
  • Healthcare
  • Others
MARKET DYNAMICS

Growth Drivers

Rapid Advances in Technology is a Significant Growth Driver

Growing Trend towards Size Reduction and the Need for Better Performance in Electronic Devices

Restraint

High Cost and Complexity Associated with Advanced Packaging Technologies

Key Players
  • LG Chem Ltd.
  • Jiangsu ChangJian Technology Co., Ltd.
  • Henkel AG & Co. KGaA
  • Kyocera Corporation
  • ASE
  • Siliconware Precision Industries Co., Ltd.
  • Amkor Technology
  • Texas Instruments
  • IBIDEN CO., Ltd.
  • Powertech Technology Inc.
  • Chipmos Technologies
  • Tong Hsing Electronic Industries
  • Nepes Corporation
  • Shinko Electric Industries
  • Daeduck Electronics
  • Other Prominent Players (Company Overview, Business Strategy, Key Product Offerings, Financial Performance, Key Performance Indicators, Risk Analysis, Recent Development, Regional Presence, SWOT Analysis)
Global Laboratory Temperature Control Units Market is further segmented by region into:
  • North America Market Size, Share, Trends, Opportunities, Y-o-Y Growth, CAG.R – United States and Canada
  • Latin America Market Size, Share, Trends, Opportunities, Y-o-Y Growth, CAGR – Mexico, Argentina, Brazil and Rest of Latin America
  • Europe Market Size, Share, Trends, Opportunities, Y-o-Y Growth, CAGR – United Kingdom, France, Germany, Italy, Spain, Belgium, Hungary, Luxembourg, Netherlands, Poland, NORDIC, Russia, Turkey and Rest of Europe
  • Asia Pacific Market Size, Share, Trends, Opportunities, Y-o-Y Growth, CAGR – India, China, South Korea, Japan, Malaysia, Indonesia, New Zealand, Australia and Rest of APAC
  • Middle East and Africa Market Size, Share, Trends, Opportunities, Y-o-Y Growth, CAGR – North Africa, Israel, GCC, South Africa and Rest of MENA
Reasons to Purchase this Report
  • Qualitative and quantitative analysis of the market based on segmentation involving both economic as well as non-economic factors
  • Provision of market value (USD Billion) data for each segment and sub-segment
  • Indicates the region and segment that is expected to witness the fastest growth as well as to dominate the market
  • Analysis by geography highlighting the consumption of the product/service in the region as well as indicating the factors that are affecting the market within each region
  • Competitive landscape which incorporates the market ranking of the major players, along with new service/product launches, partnerships, business expansions, and acquisitions in the past five years of companies profiled
  • Extensive company profiles comprising of company overview, company insights, product benchmarking, and SWOT analysis for the major market players
  • The current as well as the future market outlook of the industry with respect to recent developments which involve growth opportunities and drivers as well as challenges and restraints of both emerging as well as developed regions
  • Includes in-depth analysis of the market of various perspectives through Porter’s five forces analysis
  • Provides insight into the market through Value Chain
  • Market dynamics scenario, along with growth opportunities of the market in the years to come
  • 3-month post-sales analyst support.
*Please Note: The report will be delivered in 2-3 business days upon order confirmation*

Table of Contents

495 Pages
1. Executive Summary
1.1 Regional Market Share
1.2. Business Trends
1.3 Global Semiconductor and IC Packaging Material Market: COVID-19 Outbreak
1.4 Regional Trends
1.5. Segmentation Snapshot
2. Research Methodology
2.1. Research Objective
2.2 Research Approach
2.3 Data Sourcing and Methodology
2.4. Primary Research
2.5. Secondary Research
2.5.1. Paid Sources
2.5.2 Public Sources
2.6 Market Size Estimation and Data Triangulation
3. Market Characteristics
3.1. Market Definition
3.2 Global Semiconductor and IC Packaging Material Market: COVID-19 Impact
3.3 Key Segmentations
3.4. Key Developments
3.5. Allied Industry Data
4. Global Semiconductor and IC Packaging Material Market – Industry Insights
4.1 Industry Segmentation
4.2. COVID-19 overview of world economy
4.3. Industry Ecosystem Channel Analysis
4.4. Innovation & Sustainability
5. Macroeconomic Indicators
6. Recent Developments
7 Market Dynamics
7.1. Introduction
7.2 Growth Drivers
7.3 Market Opportunities
7.4. Market Restraints
7.5 Market Trends
8. Risk Analysis
9. Market Analysis
9.1. Porter's Five Forces
9.2 PEST Analysis
9.2.1. Political
9.2.2 Economic
9.2.3 Social
9.2.4 Technological
10. Global Semiconductor and IC Packaging Material Market
10.1 Overview
10.2. Historical Analysis (2018-2022)
10.2.1. Market Size, Y-o-Y Growth (%) and Market Forecast
11 Global Semiconductor and IC Packaging Material Market Size & Forecast 202 A-203 F
11.1 Overview
11.2. Key Findings
11.3. Market Segmentation
11.3.1 By Type
11.3.1.1. Organic Substrate
11.3.1.1.1. By Value (USD Million) 202 A-203 F
11.3.1.1.2 Market Share (%) 202 A-203 F
11.3.1.1.3 Y-o-Y Growth (%) 202 A-203 F
11.3.1.2 Bonding Wires
11.3.1.2.1 By Value (USD Million) 202 A-203 F
11.3.1.2.2. Market Share (%) 202 A-203 F
11.3.1.2.3. Y-o-Y Growth (%) 202 A-203 F
11.3.1.3 Lead frames
11.3.1.3.1 By Value (USD Million) 202 A-203 F
11.3.1.3.2. Market Share (%) 202 A-203 F
11.3.1.3.3. Y-o-Y Growth (%) 202 A-203 F
11.3.1.4 Encapsulation Resins
11.3.1.4.1 By Value (USD Million) 202 A-203 F
11.3.1.4.2. Market Share (%) 202 A-203 F
11.3.1.4.3. Y-o-Y Growth (%) 202 A-203 F
11.3.1.5 Ceramic Package
11.3.1.5.1 By Value (USD Million) 202 A-203 F
11.3.1.5.2. Market Share (%) 202 A-203 F
11.3.1.5.3. Y-o-Y Growth (%) 202 A-203 F
11.3.1.6 Die attach Materials
11.3.1.6.1 By Value (USD Million) 202 A-203 F
11.3.1.6.2. Market Share (%) 202 A-203 F
11.3.1.6.3. Y-o-Y Growth (%) 202 A-203 F
11.3.1.7 Others
11.3.1.7.1 By Value (USD Million) 202 A-203 F
11.3.1.7.2. Market Share (%) 202 A-203 F
11.3.1.7.3. Y-o-Y Growth (%) 202 A-203 F
11.3.2. By Packaging Technology
11.3.2.1 Small Outline Package (SOP)
11.3.2.1.1 By Value (USD Million) 202 A-203 F
11.3.2.1.2. Market Share (%) 202 A-203 F
11.3.2.1.3. Y-o-Y Growth (%) 202 A-203 F
11.3.2.2. Grid Array (GA)
11.3.2.2.1. By Value (USD Million) 202 A-203 F
11.3.2.2.2 Market Share (%) 202 A-203 F
11.3.2.2.3 Y-o-Y Growth (%) 202 A-203 F
11.3.2.3. Dual Flat No-Leads (DFN)
11.3.2.3.1. By Value (USD Million) 202 A-203 F
11.3.2.3.2 Market Share (%) 202 A-203 F
11.3.2.3.3 Y-o-Y Growth (%) 202 A-203 F
11.3.2.4. Quad Flat Package (QFP)
11.3.2.4.1. By Value (USD Million) 202 A-203 F
11.3.2.4.2 Market Share (%) 202 A-203 F
11.3.2.4.3. Y-o-Y Growth (%) 202 A-203 F
11.3.2.5. Dual In-Line Package (DIP)
11.3.2.5.1. By Value (USD Million) 202 A-203 F
11.3.2.5.2 Market Share (%) 202 A-203 F
11.3.2.5.3 Y-o-Y Growth (%) 202 A-203 F
11.3.2.6. Others
11.3.2.6.1. By Value (USD Million) 202 A-203 F
11.3.2.6.2 Market Share (%) 202 A-203 F
11.3.2.6.3 Y-o-Y Growth (%) 202 A-203 F
11.3.3. By End-User
11.3.3.1 Consumer Electronic
11.3.3.1.1 By Value (USD Million) 202 A-203 F
11.3.3.1.2. Market Share (%) 202 A-203 F
11.3.3.1.3. Y-o-Y Growth (%) 202 A-203 F
11.3.3.2. IT & Telecommunication
11.3.3.2.1. By Value (USD Million) 202 A-203 F
11.3.3.2.2 Market Share (%) 202 A-203 F
11.3.3.2.3 Y-o-Y Growth (%) 202 A-203 F
11.3.3.3. Automotive
11.3.3.3.1. By Value (USD Million) 202 A-203 F
11.3.3.3.2 Market Share (%) 202 A-203 F
11.3.3.3.3 Y-o-Y Growth (%) 202 A-203 F
11.3.3.4. Aerospace & Defense
11.3.3.4.1. By Value (USD Million) 202 A-203 F
11.3.3.4.2. Market Share (%) 202 A-203 F
11.3.3.4.3. Y-o-Y Growth (%) 202 A-203 F
11.3.3.5. Healthcare
11.3.3.5.1. By Value (USD Million) 202 A-203 F
11.3.3.5.2 Market Share (%) 202 A-203 F
11.3.3.5.3 Y-o-Y Growth (%) 202 A-203 F
11.3.3.6. Others
11.3.3.6.1. By Value (USD Million) 202 A-203 F
11.3.3.6.2 Market Share (%) 202 A-203 F
11.3.3.6.3 Y-o-Y Growth (%) 202 A-203 F
12. North America Semiconductor and IC Packaging Material Market Size & Forecast 202 A-203 F
12.1. Overview
12.2. Key Findings
12.3. Market Segmentation
12.3.1. By Component
12.3.2 By Application
12.3.3 By End-User
12.4. Country
12.4.1. United States
12.4.2 Canada
13. Europe Semiconductor and IC Packaging Material Market Size & Forecast 202 A-203 F
13.1. Overview
13.2. Key Findings
13.3. Market Segmentation
13.3.1. By Component
13.3.2 By Application
13.3.3 By End-User
13.4. Country
13.4.1 Germany
13.4.2 United Kingdom
13.4.3 France
13.4.4. Italy
13.4.5 Spain
13.4.6 Russia
13.4.7 Rest of Europe (BENELUX, NORDIC, Hungary, Turkey & Poland)
14. Asia-Pacific Semiconductor and IC Packaging Material Market Size & Forecast 202 A-203 F
14.1 Overview
14.2. Key Findings
14.3. Market Segmentation
14.3.1. By Component
14.3.2 By Application
14.3.3 By End-User
14.4. Country
14.4.1 India
14.4.2 China
14.4.3. South Korea
14.4.4. Japan
14.4.5. Rest of APAC
15. Middle East and Africa Semiconductor and IC Packaging Material Market Size & Forecast 202 A-203 F
15.1 Overview
15.2. Key Findings
15.3. Market Segmentation
15.3.1. By Component
15.3.2 By Application
15.3.3 By End-User
15.4. Country
15.4.1 Israel
15.4.2 GCC
15.4.3 North Africa
15.4.4. South Africa
15.4.5 Rest of Middle East and Africa
16. Latin America Semiconductor and IC Packaging Material Market Size & Forecast 202 A-203 F
16.1. Overview
16.2. Key Findings
16.3. Market Segmentation
16.3.1. By Component
16.3.2 By Application
16.3.3 By End-User
16.4. Country
16.4.1 Mexico
16.4.2 Brazil
16.4.3 Rest of Latin America
17. Competitive Landscape
17.1. Company market share, 2023
17.2 Key player overview
17.3. Key stakeholders
18. Company Profiles
18.1 LG Chem Ltd.
18.1.1 Company Overview
18.1.2 Financial Overview
18.1.3 Key Product; Analysis
18.1.4 Company Assessment
18.1.4.1. Product Portfolio
18.1.4.2 Key Clients
18.1.4.3 Market Share
18.1.4.4 Recent News & Development (Last 3 Yrs.)
18.2. Jiangsu ChangJian Technology Co., Ltd.
18.3. Henkel AG & Co. KGaA
18.4 Kyocera Corporation
18.5. ASE
18.6. Siliconware Precision Industries Co., Ltd.
18.7. Amkor Technology
18.8 Texas Instruments
18.9. IBIDEN CO., Ltd.
18.10 Powertech Technology Inc.
18.11 Chipmos Technologies
18.12 Tong Hsing Electronic Industries
18.13 Nepes Corporation
18.14 Shinko Electric Industries
18.15 Daeduck Electronics
18.16. Other Prominent Players
19. Appendix
20 Consultant Recommendation

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