
Global 3D TSV And 2.5D Market Report and Forecast 2024-2032
Description
Global 3D TSV And 2.5D Market Report and Forecast 2024-2032
Market Outlook
According to the report by Expert Market Research (EMR), the global 3D TSV and 2.5D market size reached a value of around USD 57.98 billion in 2023. Aided by the significant developments in sectors such as consumer electronics, automotive, and healthcare, which require more efficient and compact integrated circuits (ICs), the market is projected to grow at a CAGR of 8.8% between 2024 and 2032 to reach a value of nearly USD 123.86 billion by 2032.
3D TSV and 2.5D technologies are pivotal in the evolution of semiconductor packaging and integration. 3D TSV involves vertical interconnections passing through silicon wafers or dies to connect stacked chips, leading to higher component density and improved performance. Meanwhile, 2.5D technology uses interposers (typically silicon) to enable the interconnection of multiple dies on a single substrate, which facilitates better electrical performance than traditional packaging methods. These technologies enable the production of smaller, faster, and more energy-efficient devices and are instrumental in the development of complex applications such as artificial intelligence, big data analytics, and advanced driver-assistance systems (ADAS).
One of the most significant advancements aiding the 3D TSV and 2.5D market growth is the development of hybrid bonding technology. This technique involves directly bonding wafers or dies without the need for solder, leading to better electrical connectivity and reduced thermal issues. Hybrid bonding allows for finer pitches and smaller form factors, which are crucial for applications requiring high-density integration, such as advanced sensors and high-performance computing systems. The adoption of this technology is set to increase as it supports the production of more compact and efficient devices.
As per the 3D TSV and 2.5D market analysis, silicon interposers play a crucial role in 2.5D technology, acting as a bridge between the high-density stacked ICs and the main circuit board. Innovations in this area include the development of interposers with higher routing densities and improved electrical performance, which facilitate the integration of more functionalities within a single package. As the complexity of electronic devices increases, the demand for advanced silicon interposers that can support a larger number of connections and higher speeds continues to grow.
Artificial intelligence is starting to play a crucial role in optimising the manufacturing processes of 3D TSV and 2.5D technologies. As per the 3D TSV and 2.5D market outlook, AI algorithms can predict equipment maintenance needs, optimise production workflows, and enhance quality control measures. Furthermore, AI is being integrated within the devices themselves, enabling smarter electronics that can process data at the edge, reducing latency and improving efficiency in applications like mobile devices and autonomous vehicles.
As devices become smaller and more powerful, managing heat generation becomes increasingly challenging. Innovations in thermal management solutions are crucial for the continued advancement of 3D TSV and 2.5D technologies, boosting the 3D TSV and 2.5D market growth. This includes the development of new materials and structures that can dissipate heat more effectively and the integration of cooling solutions directly into the chip architecture. Effective thermal management ensures device reliability and performance, particularly in high-stake applications such as automotive and aerospace sectors.
There is a growing trend towards adopting more sustainable and environmentally friendly manufacturing processes within the semiconductor sector, which can also aid the 3D TSV and 2.5D market expansion. This involves reducing the use of toxic chemicals, minimising waste, and recycling materials wherever possible. Manufacturers are also exploring the use of greener alternatives for critical materials and are investing in technologies that require less energy consumption.
As the global landscape of electronics continues to evolve, so do the regulatory standards that govern the production and disposal of electronic devices. Compliance with international standards and regulations, such as RoHS (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals), is becoming increasingly important. These regulations influence the development and adoption of new technologies and materials, which boost the 3D TSV and 2.5D market development.
Market Segmentation
The market can be divided based on packaging type, end use, and region.
Market Breakup by Packaging Type
- 2.5D Interposer
- 3D SoC
- 3D Stacked Memory
- CIS with TSV
- Others
- Consumer Electronics
- Automotive
- High Performance Computing (HPC) and Networking
- Others
- North America
- Europe
- Asia Pacific
- Latin America
- Middle East and Africa
The EMR report looks into the market shares, plant turnarounds, capacities, investments, and mergers and acquisitions, among other major developments, of the leading companies operating in the global 3D TSV and 2.5D market. Some of the major players explored in the report by Expert Market Research are as follows:
- Samsung Electronics Co. Ltd
- Toshiba Corp.
- ASE Group
- Amkor Technology, Inc.
- Jiangsu Changing Electronics Technology Co. Ltd
- United Microelectronics Corporation
- ACM Research, Inc.
- Powertech Technology Inc.
- Other
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*We at Expert Market Research always strive to provide you with the latest information. The numbers in the article are only indicative and may be different from the actual report.
Table of Contents
214 Pages
- 1 Preface
- 2 Report Coverage – Key Segmentation and Scope
- 3 Report Description
- 3.1 Market Definition and Outlook
- 3.2 Properties and Applications
- 3.3 Market Analysis
- 3.4 Key Players
- 4 Key Assumptions
- 5 Executive Summary
- 5.1 Overview
- 5.2 Key Drivers
- 5.3 Key Developments
- 5.4 Competitive Structure
- 5.5 Key Industrial Trends
- 6 Market Snapshot
- 6.1 Global
- 6.2 Regional
- 7 Opportunities and Challenges in the Market
- 8 Global 3D TSV And 2.5D Market Analysis
- 8.1 Key Industry Highlights
- 8.2 Global 3D TSV And 2.5D Historical Market (2018-2023)
- 8.3 Global 3D TSV And 2.5D Market Forecast (2024-2032)
- 8.4 Global 3D TSV And 2.5D Market by Packaging Type
- 8.4.1 2.5D Interposer
- 8.4.1.1 Historical Trend (2018-2023)
- 8.4.1.2 Forecast Trend (2024-2032)
- 8.4.2 3D SoC
- 8.4.2.1 Historical Trend (2018-2023)
- 8.4.2.2 Forecast Trend (2024-2032)
- 8.4.3 3D Stacked Memory
- 8.4.3.1 Historical Trend (2018-2023)
- 8.4.3.2 Forecast Trend (2024-2032)
- 8.4.4 CIS with TSV
- 8.4.4.1 Historical Trend (2018-2023)
- 8.4.4.2 Forecast Trend (2024-2032)
- 8.4.5 Others
- 8.5 Global 3D TSV And 2.5D Market by End Use
- 8.5.1 Consumer Electronics
- 8.5.1.1 Historical Trend (2018-2023)
- 8.5.1.2 Forecast Trend (2024-2032)
- 8.5.2 Automotive
- 8.5.2.1 Historical Trend (2018-2023)
- 8.5.2.2 Forecast Trend (2024-2032)
- 8.5.3 High Performance Computing (HPC) and Networking
- 8.5.3.1 Historical Trend (2018-2023)
- 8.5.3.2 Forecast Trend (2024-2032)
- 8.5.4 Others
- 8.6 Global 3D TSV And 2.5D Market by Region
- 8.6.1 North America
- 8.6.1.1 Historical Trend (2018-2023)
- 8.6.1.2 Forecast Trend (2024-2032)
- 8.6.2 Europe
- 8.6.2.1 Historical Trend (2018-2023)
- 8.6.2.2 Forecast Trend (2024-2032)
- 8.6.3 Asia Pacific
- 8.6.3.1 Historical Trend (2018-2023)
- 8.6.3.2 Forecast Trend (2024-2032)
- 8.6.4 Latin America
- 8.6.4.1 Historical Trend (2018-2023)
- 8.6.4.2 Forecast Trend (2024-2032)
- 8.6.5 Middle East and Africa
- 8.6.5.1 Historical Trend (2018-2023)
- 8.6.5.2 Forecast Trend (2024-2032)
- 9 North America 3D TSV And 2.5D Market Analysis
- 9.1 United States of America
- 9.1.1 Historical Trend (2018-2023)
- 9.1.2 Forecast Trend (2024-2032)
- 9.2 Canada
- 9.2.1 Historical Trend (2018-2023)
- 9.2.2 Forecast Trend (2024-2032)
- 10 Europe 3D TSV And 2.5D Market Analysis
- 10.1 United Kingdom
- 10.1.1 Historical Trend (2018-2023)
- 10.1.2 Forecast Trend (2024-2032)
- 10.2 Germany
- 10.2.1 Historical Trend (2018-2023)
- 10.2.2 Forecast Trend (2024-2032)
- 10.3 France
- 10.3.1 Historical Trend (2018-2023)
- 10.3.2 Forecast Trend (2024-2032)
- 10.4 Italy
- 10.4.1 Historical Trend (2018-2023)
- 10.4.2 Forecast Trend (2024-2032)
- 10.5 Others
- 11 Asia Pacific 3D TSV And 2.5D Market Analysis
- 11.1 China
- 11.1.1 Historical Trend (2018-2023)
- 11.1.2 Forecast Trend (2024-2032)
- 11.2 Japan
- 11.2.1 Historical Trend (2018-2023)
- 11.2.2 Forecast Trend (2024-2032)
- 11.3 India
- 11.3.1 Historical Trend (2018-2023)
- 11.3.2 Forecast Trend (2024-2032)
- 11.4 ASEAN
- 11.4.1 Historical Trend (2018-2023)
- 11.4.2 Forecast Trend (2024-2032)
- 11.5 Australia
- 11.5.1 Historical Trend (2018-2023)
- 11.5.2 Forecast Trend (2024-2032)
- 11.6 Others
- 12 Latin America 3D TSV And 2.5D Market Analysis
- 12.1 Brazil
- 12.1.1 Historical Trend (2018-2023)
- 12.1.2 Forecast Trend (2024-2032)
- 12.2 Argentina
- 12.2.1 Historical Trend (2018-2023)
- 12.2.2 Forecast Trend (2024-2032)
- 12.3 Mexico
- 12.3.1 Historical Trend (2018-2023)
- 12.3.2 Forecast Trend (2024-2032)
- 12.4 Others
- 13 Middle East and Africa 3D TSV And 2.5D Market Analysis
- 13.1 Saudi Arabia
- 13.1.1 Historical Trend (2018-2023)
- 13.1.2 Forecast Trend (2024-2032)
- 13.2 United Arab Emirates
- 13.2.1 Historical Trend (2018-2023)
- 13.2.2 Forecast Trend (2024-2032)
- 13.3 Nigeria
- 13.3.1 Historical Trend (2018-2023)
- 13.3.2 Forecast Trend (2024-2032)
- 13.4 South Africa
- 13.4.1 Historical Trend (2018-2023)
- 13.4.2 Forecast Trend (2024-2032)
- 13.5 Others
- 14 Market Dynamics
- 14.1 SWOT Analysis
- 14.1.1 Strengths
- 14.1.2 Weaknesses
- 14.1.3 Opportunities
- 14.1.4 Threats
- 14.2 Porter’s Five Forces Analysis
- 14.2.1 Supplier’s Power
- 14.2.2 Buyer’s Power
- 14.2.3 Threat of New Entrants
- 14.2.4 Degree of Rivalry
- 14.2.5 Threat of Substitutes
- 14.3 Key Indicators for Demand
- 14.4 Key Indicators for Price
- 15 Competitive Landscape
- 15.1 Market Structure
- 15.2 Company Profiles
- 15.2.1 Samsung Electronics Co. Ltd
- 15.2.1.1 Company Overview
- 15.2.1.2 Product Portfolio
- 15.2.1.3 Demographic Reach and Achievements
- 15.2.1.4 Certifications
- 15.2.2 Toshiba Corp.
- 15.2.2.1 Company Overview
- 15.2.2.2 Product Portfolio
- 15.2.2.3 Demographic Reach and Achievements
- 15.2.2.4 Certifications
- 15.2.3 ASE Group
- 15.2.3.1 Company Overview
- 15.2.3.2 Product Portfolio
- 15.2.3.3 Demographic Reach and Achievements
- 15.2.3.4 Certifications
- 15.2.4 Amkor Technology, Inc.
- 15.2.4.1 Company Overview
- 15.2.4.2 Product Portfolio
- 15.2.4.3 Demographic Reach and Achievements
- 15.2.4.4 Certifications
- 15.2.5 Jiangsu Changing Electronics Technology Co. Ltd
- 15.2.5.1 Company Overview
- 15.2.5.2 Product Portfolio
- 15.2.5.3 Demographic Reach and Achievements
- 15.2.5.4 Certifications
- 15.2.6 United Microelectronics Corporation
- 15.2.6.1 Company Overview
- 15.2.6.2 Product Portfolio
- 15.2.6.3 Demographic Reach and Achievements
- 15.2.6.4 Certifications
- 15.2.7 ACM Research, Inc.
- 15.2.7.1 Company Overview
- 15.2.7.2 Product Portfolio
- 15.2.7.3 Demographic Reach and Achievements
- 15.2.7.4 Certifications
- 15.2.8 Powertech Technology Inc.
- 15.2.8.1 Company Overview
- 15.2.8.2 Product Portfolio
- 15.2.8.3 Demographic Reach and Achievements
- 15.2.8.4 Certifications
- 15.2.9 Other
- 16 Key Trends and Developments in the Market
- List of Key Figures and Tables
- 1. Global 3D TSV And 2.5D Market: Key Industry Highlights, 2018 and 2032
- 2. Global 3D TSV And 2.5D Historical Market: Breakup by Packaging Type (USD Million), 2018-2023
- 3. Global 3D TSV And 2.5D Market Forecast: Breakup by Packaging Type (USD Million), 2024-2032
- 4. Global 3D TSV And 2.5D Historical Market: Breakup by End Use (USD Million), 2018-2023
- 5. Global 3D TSV And 2.5D Market Forecast: Breakup by End Use (USD Million), 2024-2032
- 6. Global 3D TSV And 2.5D Historical Market: Breakup by Region (USD Million), 2018-2023
- 7. Global 3D TSV And 2.5D Market Forecast: Breakup by Region (USD Million), 2024-2032
- 8. North America 3D TSV And 2.5D Historical Market: Breakup by Country (USD Million), 2018-2023
- 9. North America 3D TSV And 2.5D Market Forecast: Breakup by Country (USD Million), 2024-2032
- 10. Europe 3D TSV And 2.5D Historical Market: Breakup by Country (USD Million), 2018-2023
- 11. Europe 3D TSV And 2.5D Market Forecast: Breakup by Country (USD Million), 2024-2032
- 12. Asia Pacific 3D TSV And 2.5D Historical Market: Breakup by Country (USD Million), 2018-2023
- 13. Asia Pacific 3D TSV And 2.5D Market Forecast: Breakup by Country (USD Million), 2024-2032
- 14. Latin America 3D TSV And 2.5D Historical Market: Breakup by Country (USD Million), 2018-2023
- 15. Latin America 3D TSV And 2.5D Market Forecast: Breakup by Country (USD Million), 2024-2032
- 16. Middle East and Africa 3D TSV And 2.5D Historical Market: Breakup by Country (USD Million), 2018-2023
- 17. Middle East and Africa 3D TSV And 2.5D Market Forecast: Breakup by Country (USD Million), 2024-2032
- 18. Global 3D TSV And 2.5D Market Structure
Pricing
Currency Rates
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