Global Wafer Thinning Equipment Market Research Report, Competitive, Technology and Forecast Analysis 2025-2032

Market Overview

According to DIResearch＇s in-depth investigation and research, the global Wafer Thinning Equipment market size will reach 1,179.01 Million USD in 2025 and is projected to reach 1,926.93 Million USD by 2032, with a CAGR of 7.27% (2025-2032). Notably, the China Wafer Thinning Equipment market has changed rapidly in the past few years. By 2025, China＇s market size is expected to be  Million USD, representing approximately  % of the global market share.

Research Summary

Wafer thinning equipment refers to machinery and tools used in the process of reducing the thickness of semiconductor wafers to achieve the desired specifications for semiconductor device fabrication. This process, known as wafer thinning or backgrinding, is typically performed after semiconductor devices have been fabricated on the wafer and before the individual chips are separated and packaged. Wafer thinning equipment includes specialized machines such as wafer grinders, chemical mechanical planarization (CMP) systems, and polishing machines. These machines utilize precision grinding wheels, abrasive slurries, or chemical etchants to remove material from the backside of the wafer, gradually reducing its thickness while maintaining uniformity and flatness. Wafer thinning equipment is critical in semiconductor manufacturing, as it enables the production of thinner wafers with precise thickness control, which is essential for achieving high-performance semiconductor devices and increasing the yield of integrated circuits.

The major global  manufacturers of Wafer Thinning Equipment include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Shenzhen Fangda, Hunan Yujing Machine Industrial, SpeedFam, Hauhaiqingke, etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.

This report studies the market size, price trends and future development prospects of Wafer Thinning Equipment. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Wafer Thinning Equipment market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.

The regions and countries in the report include US, Germany, Japan, China, France, UK, South Korea, Canada, Italy, Russia, Mexico, Brazil, India, Vietnam, Thailand, South Africa and other regions, covering the Wafer Thinning Equipment market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Wafer Thinning Equipment industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.    

The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.

Global Key Manufacturers of Wafer Thinning Equipment Include:

Disco

TOKYO SEIMITSU

G&N

Okamoto Semiconductor Equipment Division

CETC

Koyo Machinery

Revasum

WAIDA MFG

Shenzhen Fangda

Hunan Yujing Machine Industrial

SpeedFam

Hauhaiqingke

Wafer Thinning Equipment Product Segment Include:

Fully Automatic Equipment

Semi-Automatic Equipment

Wafer Thinning Equipment Product Application Include:

200mm Wafer

300mm Wafer

Others

Chapter Scope

Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trend

Chapter 2: Global Wafer Thinning Equipment Industry PESTEL Analysis

Chapter 3: Global Wafer Thinning Equipment Industry Porter's Five Forces Analysis

Chapter 4: Global Wafer Thinning Equipment Major Regional Market Size (Sales, Revenue, Price) and Forecast Analysis

Chapter 5: Global Wafer Thinning Equipment Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)

Chapter 6: Global Wafer Thinning Equipment Sales, Revenue, Price and Forecast by Product Type

Chapter 7: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)

Chapter 8: Industrial Chain Analysis, Wafer Thinning Equipment Different Application Market Analysis (Sales and Revenue), Sales Channel Analysis

Chapter 9: Research Findings and Conclusion

Chapter 10: Methodology and Data Sources Show more