Global Thermally Conductive Adhesive Market Research Report, Competitive, Technology and Forecast Analysis 2025-2032

Market Overview

According to DIResearch＇s in-depth investigation and research, the global Thermally Conductive Adhesive market size will reach  Million USD in 2025 and is projected to reach  Million USD by 2032, with a CAGR of  % (2025-2032). Notably, the China Thermally Conductive Adhesive market has changed rapidly in the past few years. By 2025, China＇s market size is expected to be  Million USD, representing approximately  % of the global market share.

Research Summary

Thermally conductive adhesive is a specialized adhesive designed to not only bond materials together but also enhance the thermal conductivity between them. This type of adhesive is formulated with thermally conductive fillers, such as ceramic particles or metal oxides, to improve heat transfer across the bonded interface. Thermally conductive adhesives are commonly used in electronic applications, such as attaching heat sinks to electronic components or bonding semiconductor devices to substrates. The adhesive creates a strong bond while simultaneously facilitating the efficient dissipation of heat, helping to prevent overheating and ensuring optimal performance of electronic devices. This type of adhesive is particularly valuable in applications where traditional mechanical fastening methods may not be suitable, providing an effective solution for thermal management in compact and heat-sensitive electronic systems.

The major global  manufacturers of Thermally Conductive Adhesive include Shin-Etsu, WACKER, CSI Chemical, Dow Corning, Momentive, Henkel, Parker Hannifin, etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.

This report studies the market size, price trends and future development prospects of Thermally Conductive Adhesive. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Thermally Conductive Adhesive market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.

The regions and countries in the report include US, Germany, Japan, China, France, UK, South Korea, Canada, Italy, Russia, Mexico, Brazil, India, Vietnam, Thailand, South Africa and other regions, covering the Thermally Conductive Adhesive market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Thermally Conductive Adhesive industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.    

The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.

Global Key Manufacturers of Thermally Conductive Adhesive Include:

Shin-Etsu

WACKER

CSI Chemical

Dow Corning

Momentive

Henkel

Parker Hannifin

Thermally Conductive Adhesive Product Segment Include:
0-5 W/mK
Above 5 W/mK

Thermally Conductive Adhesive Product Application Include:

Telecommunications Equipment

Automotive Electronics

Consumer Electronics

Household Appliances

Power and Industrialization

Medical Equipment

Other

Chapter Scope

Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trend

Chapter 2: Global Thermally Conductive Adhesive Capacity and Production Analysis

Chapter 3: Global Thermally Conductive Adhesive Industry PESTEL Analysis

Chapter 4: Global Thermally Conductive Adhesive Industry Porter's Five Forces Analysis

Chapter 5: Global Thermally Conductive Adhesive Major Regional Market Size (Sales, Revenue, Price) and Forecast Analysis

Chapter 6: Global Thermally Conductive Adhesive Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)

Chapter 7: Global Thermally Conductive Adhesive Sales, Revenue, Price and Forecast by Product Type

Chapter 8: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)

Chapter 9: Industrial Chain Analysis, Thermally Conductive Adhesive Different Application Market Analysis (Sales and Revenue), Sales Channel Analysis

Chapter 10: Research Findings and Conclusion

Chapter 11: Methodology and Data Sources Show more