Global Solder Paste Inspection (SPI) System Market Research Report, Competitive, Technology and Forecast Analysis 2025-2032

Market Overview

According to DIResearch＇s in-depth investigation and research, the global Solder Paste Inspection (SPI) System market size will reach 383.71 Million USD in 2025 and is projected to reach 668.34 Million USD by 2032, with a CAGR of 8.25% (2025-2032). Notably, the China Solder Paste Inspection (SPI) System market has changed rapidly in the past few years. By 2025, China＇s market size is expected to be  Million USD, representing approximately  % of the global market share.

Research Summary

A Solder Paste Inspection (SPI) system is an advanced automated technology used in the electronics manufacturing industry to evaluate the quality and consistency of solder paste deposits on printed circuit boards (PCBs). These systems utilize 3D optical imaging to measure critical parameters such as the height, volume, and surface area of the solder paste applied to each pad, ensuring that it meets the precise specifications required for reliable soldering of surface-mounted components. SPI systems detect issues like insufficient or excessive paste, misalignment, and voids, which can lead to defects in the final product. By providing real-time feedback and data, SPI systems play a crucial role in maintaining high standards of quality control, minimizing rework, and preventing costly defects in the manufacturing process.

The major global  manufacturers of Solder Paste Inspection (SPI) System include Koh Young, Test Research, Inc (TRI), CKD Corporation, CyberOptics Corporation, MIRTEC CO., LTD., PARMI Corp, Viscom AG, ViTrox, Mycronic (Vi TECHNOLOGY), MEK Marantz Electronics, Pemtron, SAKI Corporation, Caltex Scientific, ASC International, Jet Technology, Sinic-Tek Vision Technology, Shenzhen JT Automation Equipment, Shenzhen ZhenHuaXing, JUTZE Intelligence Technology, Shenzhen Chonvo Intelligence, etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.

This report studies the market size, price trends and future development prospects of Solder Paste Inspection (SPI) System. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Solder Paste Inspection (SPI) System market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.

The regions and countries in the report include US, Germany, Japan, China, France, UK, South Korea, Canada, Italy, Russia, Mexico, Brazil, India, Vietnam, Thailand, South Africa and other regions, covering the Solder Paste Inspection (SPI) System market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Solder Paste Inspection (SPI) System industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.    

The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.

Global Key Manufacturers of Solder Paste Inspection (SPI) System Include:

Koh Young

Test Research, Inc (TRI)

CKD Corporation

CyberOptics Corporation

MIRTEC CO., LTD.

PARMI Corp

Viscom AG

ViTrox

Mycronic (Vi TECHNOLOGY)

MEK Marantz Electronics

Pemtron

SAKI Corporation

Caltex Scientific

ASC International

Jet Technology

Sinic-Tek Vision Technology

Shenzhen JT Automation Equipment

Shenzhen ZhenHuaXing

JUTZE Intelligence Technology

Shenzhen Chonvo Intelligence

Solder Paste Inspection (SPI) System Product Segment Include:

In-line SPI System

Off-line SPI System

Solder Paste Inspection (SPI) System Product Application Include:

Automotive Electronics

Consumer Electronics

Industrials

Others

Chapter Scope

Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trend

Chapter 2: Global Solder Paste Inspection (SPI) System Industry PESTEL Analysis

Chapter 3: Global Solder Paste Inspection (SPI) System Industry Porter's Five Forces Analysis

Chapter 4: Global Solder Paste Inspection (SPI) System Major Regional Market Size (Sales, Revenue, Price) and Forecast Analysis

Chapter 5: Global Solder Paste Inspection (SPI) System Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)

Chapter 6: Global Solder Paste Inspection (SPI) System Sales, Revenue, Price and Forecast by Product Type

Chapter 7: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)

Chapter 8: Industrial Chain Analysis, Solder Paste Inspection (SPI) System Different Application Market Analysis (Sales and Revenue), Sales Channel Analysis

Chapter 9: Research Findings and Conclusion

Chapter 10: Methodology and Data Sources