Global IC Advanced Packaging Equipment Market Research Report, Competitive, Technology and Forecast Analysis 2025-2032

Market Overview

According to DIResearch＇s in-depth investigation and research, the global IC Advanced Packaging Equipment market size will reach 9,092.40 Million USD in 2025 and is projected to reach 16,922.45 Million USD by 2032, with a CAGR of 9.28% (2025-2032). Notably, the China IC Advanced Packaging Equipment market has changed rapidly in the past few years. By 2025, China＇s market size is expected to be  Million USD, representing approximately  % of the global market share.

Research Summary

IC (Integrated Circuit) advanced packaging equipment refers to specialized machinery used in the semiconductor manufacturing process to encapsulate and assemble integrated circuits in a compact and efficient manner. This equipment is crucial for the final stage of IC fabrication, where the semiconductor die is mounted and connected within a protective package. Advanced packaging techniques include technologies like 3D stacking, wafer-level packaging, and system-in-package (SiP) to enhance performance, miniaturize components, and improve energy efficiency. IC advanced packaging equipment involves processes such as die bonding, wire bonding, encapsulation, and testing. These technologies play a vital role in meeting the demands of modern electronic devices for increased functionality and reduced form factor, enabling the production of more powerful and compact integrated circuits used in a wide range of applications.

The major global  manufacturers of IC Advanced Packaging Equipment include ASM Pacific, Applied Material, Advantest, Kulicke&Soffa, DISCO, Tokyo Seimitsu, BESI, Hitachi, Teradyne, Hanmi, Toray Engineering, Shinkawa, TOWA, COHU Semiconductor, SUSS Microtec, etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.

This report studies the market size, price trends and future development prospects of IC Advanced Packaging Equipment. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global IC Advanced Packaging Equipment market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.

The regions and countries in the report include US, Germany, Japan, China, France, UK, South Korea, Canada, Italy, Russia, Mexico, Brazil, India, Vietnam, Thailand, South Africa and other regions, covering the IC Advanced Packaging Equipment market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of IC Advanced Packaging Equipment industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.    

The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.

Global Key Manufacturers of IC Advanced Packaging Equipment Include:

ASM Pacific

Applied Material

Advantest

Kulicke&Soffa

DISCO

Tokyo Seimitsu

BESI

Hitachi

Teradyne

Hanmi

Toray Engineering

Shinkawa

TOWA

COHU Semiconductor

SUSS Microtec

IC Advanced Packaging Equipment Product Segment Include:

Cutting Equipment

Solid Crystal Devices

Welding Equipment

Testing Equipment

Others

IC Advanced Packaging Equipment Product Application Include:

Automotive Electronics

Consumer Electronics

Other

Chapter Scope

Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trend

Chapter 2: Global IC Advanced Packaging Equipment Industry PESTEL Analysis

Chapter 3: Global IC Advanced Packaging Equipment Industry Porter's Five Forces Analysis

Chapter 4: Global IC Advanced Packaging Equipment Major Regional Market Size (Sales, Revenue, Price) and Forecast Analysis

Chapter 5: Global IC Advanced Packaging Equipment Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)

Chapter 6: Global IC Advanced Packaging Equipment Sales, Revenue, Price and Forecast by Product Type

Chapter 7: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)

Chapter 8: Industrial Chain Analysis, IC Advanced Packaging Equipment Different Application Market Analysis (Sales and Revenue), Sales Channel Analysis

Chapter 9: Research Findings and Conclusion

Chapter 10: Methodology and Data Sources Show more