Global Epoxy Molding Compounds (EMC) for Semiconductor Market Research Report, Competitive, Technology and Forecast Analysis 2025-2032
Description
Market Overview
According to DIResearch＇s in-depth investigation and research, the global Epoxy Molding Compounds (EMC) for Semiconductor market size will reach 2,945.34 Million USD in 2025 and is projected to reach 4,097.65 Million USD by 2032, with a CAGR of 4.83% (2025-2032). Notably, the China Epoxy Molding Compounds (EMC) for Semiconductor market has changed rapidly in the past few years. By 2025, China＇s market size is expected to be Million USD, representing approximately % of the global market share.
Research Summary
Epoxy molding compounds (EMC) for semiconductors are advanced materials used to encapsulate and protect semiconductor devices from physical damage, environmental stress, and chemical corrosion. Comprising primarily of epoxy resin, curing agents, fillers, and various performance-enhancing additives, EMCs offer excellent mechanical strength, thermal stability, and electrical insulation. In semiconductor manufacturing, these compounds are injected into molds containing integrated circuits (ICs) or other microelectronic components, then cured to form a robust, protective shell. This encapsulation process is essential for safeguarding delicate electronic components from moisture, dust, mechanical shocks, and vibrations, ensuring the reliability and durability of devices in applications such as consumer electronics, automotive systems, industrial equipment, and communication technologies.
The major global manufacturers of Epoxy Molding Compounds (EMC) for Semiconductor include Kyocera, KCC, Sumitomo Bakelite, SHOWA DENKO MATERIALS, Chang Chun Group, Hysol Huawei Electronics, Panasonic, Samsung SDI, Eternal Materials, Jiangsu Zhongpeng New Material, Shin-Etsu Chemical, Hexion, Nepes, Tianjin Kaihua Insulating Material, HHCK, Scienchem, Beijing Sino-tech Electronic Material, etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.
This report studies the market size, price trends and future development prospects of Epoxy Molding Compounds (EMC) for Semiconductor. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Epoxy Molding Compounds (EMC) for Semiconductor market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.
The regions and countries in the report include US, Germany, Japan, China, France, UK, South Korea, Canada, Italy, Russia, Mexico, Brazil, India, Vietnam, Thailand, South Africa and other regions, covering the Epoxy Molding Compounds (EMC) for Semiconductor market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Epoxy Molding Compounds (EMC) for Semiconductor industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of Epoxy Molding Compounds (EMC) for Semiconductor Include:
Kyocera
KCC
Sumitomo Bakelite
SHOWA DENKO MATERIALS
Chang Chun Group
Hysol Huawei Electronics
Panasonic
Samsung SDI
Eternal Materials
Jiangsu Zhongpeng New Material
Shin-Etsu Chemical
Hexion
Nepes
Tianjin Kaihua Insulating Material
HHCK
Scienchem
Beijing Sino-tech Electronic Material
Epoxy Molding Compounds (EMC) for Semiconductor Product Segment Include:
Normal Epoxy Molding Compound
Green Epoxy Molding Compound
Epoxy Molding Compounds (EMC) for Semiconductor Product Application Include:
Lead Frame Package
Area Alley Package
Electronic Control Unit (ECU)
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trend
Chapter 2: Global Epoxy Molding Compounds (EMC) for Semiconductor Capacity and Production Analysis
Chapter 3: Global Epoxy Molding Compounds (EMC) for Semiconductor Industry PESTEL Analysis
Chapter 4: Global Epoxy Molding Compounds (EMC) for Semiconductor Industry Porter's Five Forces Analysis
Chapter 5: Global Epoxy Molding Compounds (EMC) for Semiconductor Major Regional Market Size (Sales, Revenue, Price) and Forecast Analysis
Chapter 6: Global Epoxy Molding Compounds (EMC) for Semiconductor Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)
Chapter 7: Global Epoxy Molding Compounds (EMC) for Semiconductor Sales, Revenue, Price and Forecast by Product Type
Chapter 8: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)
Chapter 9: Industrial Chain Analysis, Epoxy Molding Compounds (EMC) for Semiconductor Different Application Market Analysis (Sales and Revenue), Sales Channel Analysis
Chapter 10: Research Findings and Conclusion
Chapter 11: Methodology and Data Sources
According to DIResearch＇s in-depth investigation and research, the global Epoxy Molding Compounds (EMC) for Semiconductor market size will reach 2,945.34 Million USD in 2025 and is projected to reach 4,097.65 Million USD by 2032, with a CAGR of 4.83% (2025-2032). Notably, the China Epoxy Molding Compounds (EMC) for Semiconductor market has changed rapidly in the past few years. By 2025, China＇s market size is expected to be Million USD, representing approximately % of the global market share.
Research Summary
Epoxy molding compounds (EMC) for semiconductors are advanced materials used to encapsulate and protect semiconductor devices from physical damage, environmental stress, and chemical corrosion. Comprising primarily of epoxy resin, curing agents, fillers, and various performance-enhancing additives, EMCs offer excellent mechanical strength, thermal stability, and electrical insulation. In semiconductor manufacturing, these compounds are injected into molds containing integrated circuits (ICs) or other microelectronic components, then cured to form a robust, protective shell. This encapsulation process is essential for safeguarding delicate electronic components from moisture, dust, mechanical shocks, and vibrations, ensuring the reliability and durability of devices in applications such as consumer electronics, automotive systems, industrial equipment, and communication technologies.
The major global manufacturers of Epoxy Molding Compounds (EMC) for Semiconductor include Kyocera, KCC, Sumitomo Bakelite, SHOWA DENKO MATERIALS, Chang Chun Group, Hysol Huawei Electronics, Panasonic, Samsung SDI, Eternal Materials, Jiangsu Zhongpeng New Material, Shin-Etsu Chemical, Hexion, Nepes, Tianjin Kaihua Insulating Material, HHCK, Scienchem, Beijing Sino-tech Electronic Material, etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.
This report studies the market size, price trends and future development prospects of Epoxy Molding Compounds (EMC) for Semiconductor. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Epoxy Molding Compounds (EMC) for Semiconductor market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.
The regions and countries in the report include US, Germany, Japan, China, France, UK, South Korea, Canada, Italy, Russia, Mexico, Brazil, India, Vietnam, Thailand, South Africa and other regions, covering the Epoxy Molding Compounds (EMC) for Semiconductor market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Epoxy Molding Compounds (EMC) for Semiconductor industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of Epoxy Molding Compounds (EMC) for Semiconductor Include:
Kyocera
KCC
Sumitomo Bakelite
SHOWA DENKO MATERIALS
Chang Chun Group
Hysol Huawei Electronics
Panasonic
Samsung SDI
Eternal Materials
Jiangsu Zhongpeng New Material
Shin-Etsu Chemical
Hexion
Nepes
Tianjin Kaihua Insulating Material
HHCK
Scienchem
Beijing Sino-tech Electronic Material
Epoxy Molding Compounds (EMC) for Semiconductor Product Segment Include:
Normal Epoxy Molding Compound
Green Epoxy Molding Compound
Epoxy Molding Compounds (EMC) for Semiconductor Product Application Include:
Lead Frame Package
Area Alley Package
Electronic Control Unit (ECU)
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trend
Chapter 2: Global Epoxy Molding Compounds (EMC) for Semiconductor Capacity and Production Analysis
Chapter 3: Global Epoxy Molding Compounds (EMC) for Semiconductor Industry PESTEL Analysis
Chapter 4: Global Epoxy Molding Compounds (EMC) for Semiconductor Industry Porter's Five Forces Analysis
Chapter 5: Global Epoxy Molding Compounds (EMC) for Semiconductor Major Regional Market Size (Sales, Revenue, Price) and Forecast Analysis
Chapter 6: Global Epoxy Molding Compounds (EMC) for Semiconductor Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)
Chapter 7: Global Epoxy Molding Compounds (EMC) for Semiconductor Sales, Revenue, Price and Forecast by Product Type
Chapter 8: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)
Chapter 9: Industrial Chain Analysis, Epoxy Molding Compounds (EMC) for Semiconductor Different Application Market Analysis (Sales and Revenue), Sales Channel Analysis
Chapter 10: Research Findings and Conclusion
Chapter 11: Methodology and Data Sources
Table of Contents
165 Pages
- 1 Epoxy Molding Compounds (EMC) for Semiconductor Market Overview
- 1.1 Product Definition and Statistical Scope
- 1.2 Epoxy Molding Compounds (EMC) for Semiconductor Product by Type
- 1.2.1 Normal Epoxy Molding Compound
- 1.2.2 Green Epoxy Molding Compound
- 1.3 Epoxy Molding Compounds (EMC) for Semiconductor Product by Application
- 1.3.1 Lead Frame Package
- 1.3.2 Area Alley Package
- 1.3.3 Electronic Control Unit (ECU)
- 1.4 Global Epoxy Molding Compounds (EMC) for Semiconductor Market Revenue and Sales Analysis
- 1.4.1 Global Epoxy Molding Compounds (EMC) for Semiconductor Revenue Market Size Analysis (2020-2032)
- 1.4.2 Global Epoxy Molding Compounds (EMC) for Semiconductor Sales Market Sales Analysis (2020-2032)
- 1.4.3 Global Epoxy Molding Compounds (EMC) for Semiconductor Market Sales Price Trend Analysis (2020-2032)
- 1.5 Epoxy Molding Compounds (EMC) for Semiconductor Market Development Status and Trends
- 1.5.1 Epoxy Molding Compounds (EMC) for Semiconductor Industry Development Status Analysis
- 1.5.2 Epoxy Molding Compounds (EMC) for Semiconductor Industry Development Trends Analysis
- 2 Global Epoxy Molding Compounds (EMC) for Semiconductor Capacity and Production Analysis
- 2.1 Global Epoxy Molding Compounds (EMC) for Semiconductor Capacity, Production and Utilization (2020-2032)
- 2.2 Global Epoxy Molding Compounds (EMC) for Semiconductor Production Growth Trend by Region: 2024 VS 2025 VS 2032
- 2.3 Global Epoxy Molding Compounds (EMC) for Semiconductor Production by Region
- 2.3.1 Global Epoxy Molding Compounds (EMC) for Semiconductor Production by Region (2020-2025)
- 2.3.2 Global Epoxy Molding Compounds (EMC) for Semiconductor Production Forecast by Region (2026-2032)
- 2.3.3 Global Epoxy Molding Compounds (EMC) for Semiconductor Production Market Share by Region (2020-2032)
- 3 Epoxy Molding Compounds (EMC) for Semiconductor Market PESTEL Analysis
- 3.1 Political Factors Analysis
- 3.2 Economic Factors Analysis
- 3.3 Social Factors Analysis
- 3.4 Technological Factors Analysis
- 3.5 Environmental Factors Analysis
- 3.6 Legal Factors Analysis
- 4 Epoxy Molding Compounds (EMC) for Semiconductor Market Porter's Five Forces Analysis
- 4.1 Competitive Rivalry
- 4.2 Threat of New Entrants
- 4.3 Bargaining Power of Suppliers
- 4.4 Bargaining Power of Buyers
- 4.5 Threat of Substitutes
- 5 Global Epoxy Molding Compounds (EMC) for Semiconductor Market Analysis by Country
- 5.1 Global Epoxy Molding Compounds (EMC) for Semiconductor Market Size Analysis by Country: 2024 VS 2025 VS 2032
- 5.1.1 Global Epoxy Molding Compounds (EMC) for Semiconductor Revenue and Market Share by Country (2020-2025)
- 5.1.2 Global Epoxy Molding Compounds (EMC) for Semiconductor Revenue and Market Share Forecast by Country (2026-2032)
- 5.2 Global Epoxy Molding Compounds (EMC) for Semiconductor Sales Analysis by Country: 2024 VS 2025 VS 2032
- 5.2.1 Global Epoxy Molding Compounds (EMC) for Semiconductor Sales and Market Share by Country (2020-2025)
- 5.2.2 Global Epoxy Molding Compounds (EMC) for Semiconductor Sales and Market Share Forecast by Country (2026-2032)
- 5.3 United States Epoxy Molding Compounds (EMC) for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 5.4 Germany Epoxy Molding Compounds (EMC) for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 5.5 Japan Epoxy Molding Compounds (EMC) for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 5.6 China Epoxy Molding Compounds (EMC) for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 5.7 France Epoxy Molding Compounds (EMC) for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 5.8 U.K. Epoxy Molding Compounds (EMC) for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 5.9 South Korea Epoxy Molding Compounds (EMC) for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 5.10 Canada Epoxy Molding Compounds (EMC) for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 5.11 Italy Epoxy Molding Compounds (EMC) for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 5.12 Russia Epoxy Molding Compounds (EMC) for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 5.13 Mexico Epoxy Molding Compounds (EMC) for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 5.14 Brazil Epoxy Molding Compounds (EMC) for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 5.15 India Epoxy Molding Compounds (EMC) for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 5.16 Vietnam Epoxy Molding Compounds (EMC) for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 5.17 Thailand Epoxy Molding Compounds (EMC) for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 5.18 South Africa Epoxy Molding Compounds (EMC) for Semiconductor Market Sales, Revenue and Growth Rate (2020-2032)
- 6 Competition by Manufacturers
- 6.1 Global Epoxy Molding Compounds (EMC) for Semiconductor Market Sales, Revenue and Sales Price by Key Manufacturers (2021-2025)
- 6.1.1 Global Epoxy Molding Compounds (EMC) for Semiconductor Market Sales by Key Manufacturers (2021-2025)
- 6.1.2 Global Epoxy Molding Compounds (EMC) for Semiconductor Market Revenue by Key Manufacturers (2021-2025)
- 6.1.3 Global Epoxy Molding Compounds (EMC) for Semiconductor Average Sales Price by Manufacturers (2021-2025)
- 6.2 Epoxy Molding Compounds (EMC) for Semiconductor Competitive Landscape Analysis and Market Dynamic
- 6.2.1 Epoxy Molding Compounds (EMC) for Semiconductor Competitive Landscape Analysis
- 6.2.2 Global Key Manufacturers Headquarter and Key Area Sales
- 6.2.3 Market Dynamic
- 7 Epoxy Molding Compounds (EMC) for Semiconductor Market Analysis by Type
- 7.1 Global Epoxy Molding Compounds (EMC) for Semiconductor Market Revenue Analysis by Type
- 7.1.1 Global Epoxy Molding Compounds (EMC) for Semiconductor Market Size Analysis by Type: 2024 & 2025 & 2032
- 7.1.2 Global Epoxy Molding Compounds (EMC) for Semiconductor Revenue and Forecast Analysis by Type (2020-2032)
- 7.2 Global Epoxy Molding Compounds (EMC) for Semiconductor Market Sales and Forecast Analysis by Type (2020-2032)
- 7.3 Global Epoxy Molding Compounds (EMC) for Semiconductor Sales Price Trend Analysis by Type (2020-2032)
- 8 Key Companies Analysis
- 8.1 Kyocera
- 8.1.1 Kyocera Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 8.1.2 Kyocera Epoxy Molding Compounds (EMC) for Semiconductor Product Portfolio
- 8.1.3 Kyocera Epoxy Molding Compounds (EMC) for Semiconductor Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 8.2 KCC
- 8.2.1 KCC Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 8.2.2 KCC Epoxy Molding Compounds (EMC) for Semiconductor Product Portfolio
- 8.2.3 KCC Epoxy Molding Compounds (EMC) for Semiconductor Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 8.3 Sumitomo Bakelite
- 8.3.1 Sumitomo Bakelite Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 8.3.2 Sumitomo Bakelite Epoxy Molding Compounds (EMC) for Semiconductor Product Portfolio
- 8.3.3 Sumitomo Bakelite Epoxy Molding Compounds (EMC) for Semiconductor Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 8.4 SHOWA DENKO MATERIALS
- 8.4.1 SHOWA DENKO MATERIALS Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 8.4.2 SHOWA DENKO MATERIALS Epoxy
Pricing
Currency Rates
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