Global Dicing Blade Market Research Report, Competitive, Technology and Forecast Analysis 2025-2032
Description
Market Overview
According to DIResearch＇s in-depth investigation and research, the global Dicing Blade market size will reach 1,649.13 Million USD in 2025 and is projected to reach 2,244.24 Million USD by 2032, with a CAGR of 4.50% (2025-2032). Notably, the China Dicing Blade market has changed rapidly in the past few years. By 2025, China＇s market size is expected to be Million USD, representing approximately % of the global market share.
Research Summary
A dicing blade, also known as a wafer dicing blade or cutting wheel, is a thin, circular tool used in the semiconductor and electronics industries to precisely cut and separate semiconductor wafers or other brittle materials into individual integrated circuit chips or components. Typically made of materials like diamond or cubic boron nitride, the dicing blade＇s abrasive nature allows it to create clean and accurate cuts through the wafer, minimizing damage to the chips and ensuring high-quality results. Dicing blades come in various sizes and specifications to accommodate different materials and thicknesses, and they are a critical component of the semiconductor manufacturing process, enabling the efficient fabrication of microelectronic devices.
The major global manufacturers of Dicing Blade include DISCO, ADT, K&S, UKAM, Ceiba, Shanghai Sinyang Semiconductor Materials, Kinik, ITI, etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.
This report studies the market size, price trends and future development prospects of Dicing Blade. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Dicing Blade market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.
The regions and countries in the report include US, Germany, Japan, China, France, UK, South Korea, Canada, Italy, Russia, Mexico, Brazil, India, Vietnam, Thailand, South Africa and other regions, covering the Dicing Blade market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Dicing Blade industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of Dicing Blade Include:
DISCO
ADT
K&S
UKAM
Ceiba
Shanghai Sinyang Semiconductor Materials
Kinik
ITI
Dicing Blade Product Segment Include:
Hub Dicing Blades
Hubless Dicing Blades
Others
Dicing Blade Product Application Include:
Semiconductors
Glass
Ceramics
Crystals
Other
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trend
Chapter 2: Global Dicing Blade Industry PESTEL Analysis
Chapter 3: Global Dicing Blade Industry Porter's Five Forces Analysis
Chapter 4: Global Dicing Blade Major Regional Market Size (Sales, Revenue, Price) and Forecast Analysis
Chapter 5: Global Dicing Blade Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)
Chapter 6: Global Dicing Blade Sales, Revenue, Price and Forecast by Product Type
Chapter 7: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)
Chapter 8: Industrial Chain Analysis, Dicing Blade Different Application Market Analysis (Sales and Revenue), Sales Channel Analysis
Chapter 9: Research Findings and Conclusion
Chapter 10: Methodology and Data Sources
According to DIResearch＇s in-depth investigation and research, the global Dicing Blade market size will reach 1,649.13 Million USD in 2025 and is projected to reach 2,244.24 Million USD by 2032, with a CAGR of 4.50% (2025-2032). Notably, the China Dicing Blade market has changed rapidly in the past few years. By 2025, China＇s market size is expected to be Million USD, representing approximately % of the global market share.
Research Summary
A dicing blade, also known as a wafer dicing blade or cutting wheel, is a thin, circular tool used in the semiconductor and electronics industries to precisely cut and separate semiconductor wafers or other brittle materials into individual integrated circuit chips or components. Typically made of materials like diamond or cubic boron nitride, the dicing blade＇s abrasive nature allows it to create clean and accurate cuts through the wafer, minimizing damage to the chips and ensuring high-quality results. Dicing blades come in various sizes and specifications to accommodate different materials and thicknesses, and they are a critical component of the semiconductor manufacturing process, enabling the efficient fabrication of microelectronic devices.
The major global manufacturers of Dicing Blade include DISCO, ADT, K&S, UKAM, Ceiba, Shanghai Sinyang Semiconductor Materials, Kinik, ITI, etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.
This report studies the market size, price trends and future development prospects of Dicing Blade. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Dicing Blade market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.
The regions and countries in the report include US, Germany, Japan, China, France, UK, South Korea, Canada, Italy, Russia, Mexico, Brazil, India, Vietnam, Thailand, South Africa and other regions, covering the Dicing Blade market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Dicing Blade industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of Dicing Blade Include:
DISCO
ADT
K&S
UKAM
Ceiba
Shanghai Sinyang Semiconductor Materials
Kinik
ITI
Dicing Blade Product Segment Include:
Hub Dicing Blades
Hubless Dicing Blades
Others
Dicing Blade Product Application Include:
Semiconductors
Glass
Ceramics
Crystals
Other
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trend
Chapter 2: Global Dicing Blade Industry PESTEL Analysis
Chapter 3: Global Dicing Blade Industry Porter's Five Forces Analysis
Chapter 4: Global Dicing Blade Major Regional Market Size (Sales, Revenue, Price) and Forecast Analysis
Chapter 5: Global Dicing Blade Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)
Chapter 6: Global Dicing Blade Sales, Revenue, Price and Forecast by Product Type
Chapter 7: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)
Chapter 8: Industrial Chain Analysis, Dicing Blade Different Application Market Analysis (Sales and Revenue), Sales Channel Analysis
Chapter 9: Research Findings and Conclusion
Chapter 10: Methodology and Data Sources
Table of Contents
165 Pages
- 1 Dicing Blade Market Overview
- 1.1 Product Definition and Statistical Scope
- 1.2 Dicing Blade Product by Type
- 1.2.1 Hub Dicing Blades
- 1.2.2 Hubless Dicing Blades
- 1.2.3 Others
- 1.3 Dicing Blade Product by Application
- 1.3.1 Semiconductors
- 1.3.2 Glass
- 1.3.3 Ceramics
- 1.3.4 Crystals
- 1.3.5 Other
- 1.4 Global Dicing Blade Market Revenue and Sales Analysis
- 1.4.1 Global Dicing Blade Revenue Market Size Analysis (2020-2032)
- 1.4.2 Global Dicing Blade Sales Market Size Analysis (2020-2032)
- 1.4.3 Global Dicing Blade Market Sales Price Trend Analysis (2020-2032)
- 1.5 Dicing Blade Market Development Status and Trends
- 1.5.1 Dicing Blade Industry Development Status Analysis
- 1.5.2 Dicing Blade Industry Development Trends Analysis
- 2 Dicing Blade Market PESTEL Analysis
- 2.1 Political Factors Analysis
- 2.2 Economic Factors Analysis
- 2.3 Social Factors Analysis
- 2.4 Technological Factors Analysis
- 2.5 Environmental Factors Analysis
- 2.6 Legal Factors Analysis
- 3 Dicing Blade Market Porter's Five Forces Analysis
- 3.1 Competitive Rivalry
- 3.2 Threat of New Entrants
- 3.3 Bargaining Power of Suppliers
- 3.4 Bargaining Power of Buyers
- 3.5 Threat of Substitutes
- 4 Global Dicing Blade Market Analysis by Country
- 4.1 Global Dicing Blade Market Size Analysis by Country: 2024 VS 2025 VS 2032
- 4.1.1 Global Dicing Blade Revenue and Market Share by Country (2020-2025)
- 4.1.2 Global Dicing Blade Revenue and Market Share Forecast by Country (2026-2032)
- 4.2 Global Dicing Blade Sales Analysis by Country: 2024 VS 2025 VS 2032
- 4.2.1 Global Dicing Blade Sales and Market Share by Country (2020-2025)
- 4.2.2 Global Dicing Blade Sales and Market Share Forecast by Country (2026-2032)
- 4.3 United States Dicing Blade Market Sales, Revenue and Growth Rate (2020-2032)
- 4.4 Germany Dicing Blade Market Sales, Revenue and Growth Rate (2020-2032)
- 4.5 Japan Dicing Blade Market Sales, Revenue and Growth Rate (2020-2032)
- 4.6 China Dicing Blade Market Sales, Revenue and Growth Rate (2020-2032)
- 4.7 France Dicing Blade Market Sales, Revenue and Growth Rate (2020-2032)
- 4.8 U.K. Dicing Blade Market Sales, Revenue and Growth Rate (2020-2032)
- 4.9 South Korea Dicing Blade Market Sales, Revenue and Growth Rate (2020-2032)
- 4.10 Canada Dicing Blade Market Sales, Revenue and Growth Rate (2020-2032)
- 4.11 Italy Dicing Blade Market Sales, Revenue and Growth Rate (2020-2032)
- 4.12 Russia Dicing Blade Market Sales, Revenue and Growth Rate (2020-2032)
- 4.13 Mexico Dicing Blade Market Sales, Revenue and Growth Rate (2020-2032)
- 4.14 Brazil Dicing Blade Market Sales, Revenue and Growth Rate (2020-2032)
- 4.15 India Dicing Blade Market Sales, Revenue and Growth Rate (2020-2032)
- 4.16 Vietnam Dicing Blade Market Sales, Revenue and Growth Rate (2020-2032)
- 4.17 Thailand Dicing Blade Market Sales, Revenue and Growth Rate (2020-2032)
- 4.18 South Africa Dicing Blade Market Sales, Revenue and Growth Rate (2020-2032)
- 5 Competition by Manufacturers
- 5.1 Global Dicing Blade Market Sales, Revenue and Sales Price by Key Manufacturers (2021-2025)
- 5.1.1 Global Dicing Blade Market Sales by Key Manufacturers (2021-2025)
- 5.1.2 Global Dicing Blade Market Revenue by Key Manufacturers (2021-2025)
- 5.1.3 Global Dicing Blade Average Sales Price by Manufacturers (2021-2025)
- 5.2 Dicing Blade Competitive Landscape Analysis and Market Dynamic
- 5.2.1 Dicing Blade Competitive Landscape Analysis
- 5.2.2 Global Key Manufacturers Headquarter and Key Area Sales
- 5.2.3 Market Dynamic
- 6 Dicing Blade Market Analysis by Type
- 6.1 Global Dicing Blade Market Revenue Analysis by Type
- 6.1.1 Global Dicing Blade Market Size Analysis by Type: 2024 & 2025 & 2032
- 6.1.2 Global Dicing Blade Revenue and Forecast Analysis by Type (2020-2032)
- 6.2 Global Dicing Blade Sales and Forecast Analysis by Type (2020-2032)
- 6.3 Global Dicing Blade Sales Price Trend Analysis by Type (2020-2032)
- 7 Key Companies Analysis
- 7.1 DISCO
- 7.1.1 DISCO Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.1.2 DISCO Dicing Blade Product Portfolio
- 7.1.3 DISCO Dicing Blade Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.2 ADT
- 7.2.1 ADT Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.2.2 ADT Dicing Blade Product Portfolio
- 7.2.3 ADT Dicing Blade Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.3 K&S
- 7.3.1 K&S Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.3.2 K&S Dicing Blade Product Portfolio
- 7.3.3 K&S Dicing Blade Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.4 UKAM
- 7.4.1 UKAM Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.4.2 UKAM Dicing Blade Product Portfolio
- 7.4.3 UKAM Dicing Blade Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.5 Ceiba
- 7.5.1 Ceiba Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.5.2 Ceiba Dicing Blade Product Portfolio
- 7.5.3 Ceiba Dicing Blade Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.6 Shanghai Sinyang Semiconductor Materials
- 7.6.1 Shanghai Sinyang Semiconductor Materials Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.6.2 Shanghai Sinyang Semiconductor Materials Dicing Blade Product Portfolio
- 7.6.3 Shanghai Sinyang Semiconductor Materials Dicing Blade Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.7 Kinik
- 7.7.1 Kinik Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.7.2 Kinik Dicing Blade Product Portfolio
- 7.7.3 Kinik Dicing Blade Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 7.8 ITI
- 7.8.1 ITI Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 7.8.2 ITI Dicing Blade Product Portfolio
- 7.8.3 ITI Dicing Blade Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 8 Industry Chain Analysis
- 8.1 Dicing Blade Industry Chain Analysis
- 8.2 Dicing Blade Industry Upstream Supply Analysis
- 8.2.1 Upstream Key Raw Material Supply Analysis
- 8.2.2 Raw Material Suppliers and Contact Information
- 8.3 Dicing Blade Product Downstream Application Analysis
- 8.3.1 Global Dicing Blade Revenue Market Size by Application: 2024 & 2025 & 2032
- 8.3.2 Global Dicing Blade Revenue and Forecast Analysis by Application (2020-2032)
- 8.3.3 Global Dicing Blade Sales and Forecast Analysis by Application (2020-2032)
- 8.4 Dicing Blade Typical Downstream Customers
- 8.5 Dicing Blade Sales Channel Analysis
- 9 Research Findings and Conclusion
- 10 Methodology and Data Source
- 10.1 Methodology/Research Approach
- 10.2 Research Scope
- 10.3 Benchmarks and Assumptions
- 10.4 Date Source
- 10.4.1 Primary Sources
- 10.4.2 Secondary Sources
- 10.5 Data Cross Validation
- 10.6 Disclaimer
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