Global Chip On Film Underfill (COF) Market Research Report, Competitive, Technology and Forecast Analysis 2025-2032

Market Overview

According to DIResearch"s in-depth investigation and research, the global Chip On Film Underfill (COF) market size will reach 432.15 Million USD in 2025 and is projected to reach 558.05 Million USD by 2032, with a CAGR of 3.72% (2025-2032). Notably, the China Chip On Film Underfill (COF) market has changed rapidly in the past few years. By 2025, China"s market size is expected to be Million USD, representing approximately % of the global market share.

Research Summary

Chip on Film Underfill (COF) is a specialized semiconductor packaging technology used to enhance the reliability and performance of flexible printed circuit (FPC) assemblies, typically found in modern electronic devices like smartphones, tablets, and displays. In COF packaging, the semiconductor chip is directly bonded to a flexible film substrate, forming a chip-on-film structure. Underfill material, usually a liquid epoxy-based adhesive, is applied to fill the gap between the chip and the FPC substrate. The underfill material not only provides mechanical support and protection for the chip but also improves thermal dissipation and stress distribution during temperature variations and mechanical movements. This process ensures a robust and reliable connection between the chip and the FPC, reducing the risk of delamination, cracking, and other potential failures. COF technology enables compact and lightweight designs while maintaining high-density interconnects, making it a preferred choice for modern electronic devices where space and performance are critical factors.

The major global  manufacturers of Chip On Film Underfill (COF) include Henkel, Won Chemical, LORD Corporation, Hanstars, Fuji Chemical, Panacol, Namics Corporation, Shenzhen Dover, Shin-Etsu Chemical, Bondline, Zymet, AIM Solder, MacDermid (Alpha Advanced Materials), Darbond, AI Technology, Master Bond, etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.

This report studies the market size, price trends and future development prospects of Chip On Film Underfill (COF). Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Chip On Film Underfill (COF) market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.

The regions and countries in the report include US, Germany, Japan, China, France, UK, South Korea, Canada, Italy, Russia, Mexico, Brazil, India, Vietnam, Thailand, South Africa and other regions, covering the Chip On Film Underfill (COF) market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Chip On Film Underfill (COF) industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.    

The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.

Global Key Manufacturers of Chip On Film Underfill (COF) Include:

Henkel

Won Chemical

LORD Corporation

Hanstars

Fuji Chemical

Panacol

Namics Corporation

Shenzhen Dover

Shin-Etsu Chemical

Bondline

Zymet

AIM Solder

MacDermid (Alpha Advanced Materials)

Darbond

AI Technology

Master Bond

Chip On Film Underfill (COF) Product Segment Include:

Capillary Underfill (CUF)

No Flow Underfill (NUF)

Non-Conductive Paste (NCP) Underfill

Non-Conductive Film (NCF) Underfill

Molded Underfill (MUF) Underfill

Chip On Film Underfill (COF) Product Application Include:

Cell Phone

Tablet

LCD Display

Others

Chapter Scope

Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trend

Chapter 2: Global Chip On Film Underfill (COF) Capacity and Production Analysis

Chapter 3: Global Chip On Film Underfill (COF) Industry PESTEL Analysis

Chapter 4: Global Chip On Film Underfill (COF) Industry Porter's Five Forces Analysis

Chapter 5: Global Chip On Film Underfill (COF) Major Regional Market Size (Sales, Revenue, Price) and Forecast Analysis

Chapter 6: Global Chip On Film Underfill (COF) Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)

Chapter 7: Global Chip On Film Underfill (COF) Sales, Revenue, Price and Forecast by Product Type

Chapter 8: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)

Chapter 9: Industrial Chain Analysis, Chip On Film Underfill (COF) Different Application Market Analysis (Sales and Revenue), Sales Channel Analysis

Chapter 10: Research Findings and Conclusion

Chapter 11: Methodology and Data Sources Show more