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Memory Packaging Market

Publisher Coherent Market Insights
Published Apr 26, 2023
Length 142 Pages
SKU # CMI18001142

Description

Memory Packaging Market, By Platform (Flip-chip, Lead-frame, Wafer-level Chip-scale Packaging (WLCSP), Through-Silicon Via (TSV), Wire-bond), By Application (NAND Flash Packaging, NOR Flash Packaging, DRAM Packaging, Other Applications), By End User (IT and Telecom, Consumer Electronics, Embedded Systems, Automotive, Other End Users), and By Geography (North America, Europe, Asia Pacific, Latin America, and Middle East & Africa)- Size, Share, Outlook, and Opportunity Analysis, 2023 - 2030

Memory packaging is the process of assembling tiny semiconductor chips into a more durable form so that they can be easily integrated into computer systems. This can be done in a variety of ways. These packages have pins that connect to the motherboard and provide two communications lines for the memory module and the system. They are available in 168, 100, and 184 pin configurations. They are also known as small outline DIMMs (SO-DIMM). These are similar to DIMMs but use different pin settings. These are commonly used in laptop computers. They are often used in low-end and mid-range notebook computers.

Market Dynamics:

The memory packaging market is growing rapidly as the industry seeks to increase its performance and capabilities while shrinking its footprint. This is happening at a time when demand for memory chips in mobile devices and computing is increasing. The global market for memory packaging is expected to continue grow at a rapid pace. These growth rates are primarily driven by increasing demand from consumer electronics, which is expected to continue increasing in the future.

On the other hand, challenges associated with the outsourced semiconductor assembly and test (OSAT) industry is expected to hinder the market growth.

Key features of the study:
  • This report provides in-depth analysis of the global memory packaging market, and provides market size (US$ Billion) and compound annual growth rate (CAGR%) for the forecast period (2023–2030), considering 2022 as the base year
  • It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
  • This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, market trends, regional outlook, and competitive strategies adopted by key players
  • It profiles key players in the global memory packaging market based on the following parameters – company highlights, products portfolio, key highlights, financial performance, and strategies
  • Key companies covered as a part of this study include Tianshui Huatian Technology Co Ltd, Hana Micron Inc., lingsen precision industries Ltd, Formosa Advanced Technologies Co. Ltd (FATC), Advanced Semiconductor Engineering Inc. (ASE Inc.), Amkor Technology Inc., Jiangsu Changjiang Electronics Technology Co. Ltd, Powertech Technology, King Yuan Electronics Corp. Ltd, ChipMOS Technologies Inc., TongFu Microelectronics Co., and Signetics Corporation
  • Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics
  • The global memory packaging market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts
  • Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global memory packaging market
Detailed Segmentation:
  • Global Memory Packaging Market, By Platform
Flip-chip

Lead-frame

Wafer-level Chip-scale Packaging (WLCSP)

Through-Silicon Via (TSV)

Wire-bond

Application

NAND Flash Packaging

NOR Flash Packaging

DRAM Packaging

Other Applications
  • Global Memory Packaging Market, By End User
IT and Telecom

Consumer Electronics

Embedded Systems

Automotive

Other End Users
  • Global Memory Packaging Market, By Region
North America

Europe

Asia Pacific

Latin America

Middle East & Africa
  • Company Profiles
Tianshui Huatian Technology Co Ltd

Hana Micron Inc.

lingsen precision industries Ltd

Formosa Advanced Technologies Co. Ltd (FATC)

Advanced Semiconductor Engineering Inc. (ASE Inc.)

Amkor Technology Inc.

Jiangsu Changjiang Electronics Technology Co. Ltd

Powertech Technology

King Yuan Electronics Corp. Ltd

ChipMOS Technologies Inc.

TongFu Microelectronics Co.

Signetics Corporation

Table of Contents

142 Pages
1. Research Objectives and Assumptions
Research Objectives
Assumptions
Abbreviations
2. Market Purview
Report Description
Market Definition and Scope
Executive Summary
Market Snapshot, By Platform
Market Snapshot, By Application
Market Snapshot, By End User
Market Snapshot, By Region
Coherent Opportunity Map (COM)
3. Market Dynamics, Regulations, and Trends Analysis
Market Dynamics
Growing demand for smartphone and advancement in technology
Changing landscape of the OSATS sector
Innovation in packaging technology
Impact Analysis
Key Highlights
Regulatory Scenario
Product launch/Approvals
PEST Analysis
PORTER’s Analysis
Merger and Acquisition Scenario
4. Global Memory Packaging Market – Impact of Coronavirus (COVID-19) Pandemic
COVID-19 Epidemiology
Supply Side and Demand Side Analysis
Economic Impact
5. Global Memory Packaging Market , By Platform, 2017-2030, (US$ Bn)
Introduction
Market Share Analysis, 2023 and 2030 (%)
Y-o-Y Growth Analysis, 2017 – 2030
Segment Trends
Flip-chip
Introduction
Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Bn)
Lead-frame
Introduction
Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Bn)
Wafer-level Chip-scale Packaging (WLCSP)
Introduction
Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Bn)
Through-Silicon Via (TSV)
Introduction
Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Bn)
Wire-bond
Introduction
Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Bn)
6. Global Memory Packaging Market , By Application, 2017-2030, (US$ Bn)
Introduction
Market Share Analysis, 2023 and 2030 (%)
Y-o-Y Growth Analysis, 2017 – 2030
Segment Trends
NAND Flash Packaging
Introduction
Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
NOR Flash Packaging
Introduction
Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
DRAM Packaging
Introduction
Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
Other Applications
Introduction
Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
7. Global Memory Packaging Market , By End User, 2017-2030, (US$ Bn)
Introduction
Market Share Analysis, 2023 and 2030 (%)
Y-o-Y Growth Analysis, 2017 – 2030
Segment Trends
IT and Telecom
Introduction
Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
Consumer Electronics
Introduction
Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
Embedded Systems
Introduction
Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
Automotive
Introduction
Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
Other End Users
Introduction
Market Size and Forecast, and Y-o-Y Growth, 2017-2030,(US$ Billion)
8. Global Memory Packaging Market , By Region, 2017-2030, (US$ Bn)
Introduction
Market Share Analysis, By Country, 2023 and 2030 (%)
Y-o-Y Growth Analysis, For Country 2017 –2030
Country Trends
North America
Introduction
Market Size and Forecast, and Y-o-Y Growth, By Platform, 2017-2030,(US$ Bn)
Market Size and Forecast, and Y-o-Y Growth, By Application, 2017-2030,(US$ Bn)
Market Size and Forecast, and Y-o-Y Growth, By End User, 2017-2030,(US$ Bn)
Europe
Introduction
Market Size and Forecast, and Y-o-Y Growth, By Platform, 2017-2030,(US$ Bn)
Market Size and Forecast, and Y-o-Y Growth, By Application, 2017-2030,(US$ Bn)
Market Size and Forecast, and Y-o-Y Growth, By End User, 2017-2030,(US$ Bn)
Asia Pacific
Introduction
Market Size and Forecast, and Y-o-Y Growth, By Platform, 2017-2030,(US$ Bn)
Market Size and Forecast, and Y-o-Y Growth, By Application, 2017-2030,(US$ Bn)
Market Size and Forecast, and Y-o-Y Growth, By End User, 2017-2030,(US$ Bn)
Latin America
Introduction
Market Size and Forecast, and Y-o-Y Growth, By Platform, 2017-2030,(US$ Bn)
Market Size and Forecast, and Y-o-Y Growth, By Application, 2017-2030,(US$ Bn)
Market Size and Forecast, and Y-o-Y Growth, By End User, 2017-2030,(US$ Bn)
Middle East & Africa
Introduction
Market Size and Forecast, and Y-o-Y Growth, By Platform, 2017-2030,(US$ Bn)
Market Size and Forecast, and Y-o-Y Growth, By Application, 2017-2030,(US$ Bn)
Market Size and Forecast, and Y-o-Y Growth, By End User, 2017-2030,(US$ Bn)
9. Competitive Landscape
Tianshui Huatian Technology Co Ltd
Company Highlights
Product Portfolio
Key Developments
Financial Performance
Strategies
Hana Micron Inc.
lingsen precision industries Ltd
Formosa Advanced Technologies Co. Ltd (FATC)
Advanced Semiconductor Engineering Inc. (ASE Inc.)
Amkor Technology Inc.
Jiangsu Changjiang Electronics Technology Co. Ltd
Powertech Technology
King Yuan Electronics Corp. Ltd
Others
Analyst Views
10. Section
Research Methodology
About us
*Browse 24 market data tables and 28 figures on "Global Memory Packaging Market” - Global forecast to 2030

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