Global Semiconductor Plating System Market Size study & Forecast, by Type (Fully Automatic, Semi-automatic, Manual), by Technology (Electroplating, Electroless), by Wafer Size (Up to 100 mm, 100 mm-200 mm, above 200 mm), by Application (TSV, Copper Pillar

Global Semiconductor Plating System Market Size study & Forecast, by Type (Fully Automatic, Semi-automatic, Manual), by Technology (Electroplating, Electroless), by Wafer Size (Up to 100 mm, 100 mm-200 mm, above 200 mm), by Application (TSV, Copper Pillar, Redistribution Layer (RDL), Under Bump Metallization (UBM), Bumping, Others), and Regional Analysis, 2023-2030

Global Semiconductor Plating System Market is valued at approximately USD 5.1 billion in 2022 and is anticipated to grow with a growth rate of more than 4.8% over the forecast period 2023-2030. Semiconductor plating affects the performance of semiconductor components. The primary use of a semiconductor is for electronic applications such as capacitors, diodes, resistors, and transistors. The increasing usage of electronic components in the automotive sector and growing demand for semiconductors are the key factors responsible for the market growth of the Semiconductor Plating System Market over the forecast period 2023-2030.

According to Statista, in 2021, the global automotive electronics market is projected to grow to USD 272.3 billion and the market is expected to grow to USD 415.6 billion in 2027. The growing demand for semiconductors is anticipated to accelerate the market growth. For instance, according to Statista, in 2021, the loT connected devices market globally is projected to grow to USD 11.28 billion and is expected to grow to USD 29.42 billion by 2030. Also, a rise in investment in the semiconductor industry will accelerate market growth. Moreover, increasing strategic initiatives by key players, such as product launches and mergers & acquisitions and growth in digitization and artificial intelligence are creating lucrative opportunities for the market growth. However, high equipment cost hampers the market growth throughout the forecast period of 2023-2030.

The key regions considered for the Global Semiconductor Plating System Market study includes Asia Pacific, North America, Europe, Latin America, and Middle East & Africa. Asia Pacific dominated the market in terms of revenue owing to factors such as strong presence of semiconductor manufactures and growth in automotive and electronic industries. North America is the fastest-growing region owing to factors such as rise in government support for the semiconductor sector in the region.

Major market player included in this report are:
ACM Research, Inc
Applied Materials, Inc.
ASM Pacific Technology Ltd,
ClassOne Technology, Inc.
EBARA Technologies,Incorporated
Hitachi Power Solutions Co., Ltd.
Lam Research Corporation
Mitomo Semicon Engineering Co., Ltd.
RENA Technologies GmbH
TANAKA Holdings Co., Ltd

Recent Developments in the Market:
In May 2022, ACM Research, Inc., announced that they received a contract from a leading Chinese OSAT for 10 Ultra ECP ap high-speed plating tools,new high-speed plating technology has advanced WLP applications. This design provides stronger mass transfer during the plating process, coating all pillars on the entire wafer concurrently at the same plating rate.

Global Semiconductor Plating System Market Report Scope:
Historical Data – 2020 - 2021
Base Year for Estimation – 2022
Forecast period - 2023-2030
Report Coverage - Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
Segments Covered - Type, Technology, Wafer Size, Application, Region
Regional Scope - North America; Europe; Asia Pacific; Latin America; Middle East & Africa

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.

The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players.

The detailed segments and sub-segment of the market are explained below:

By Type:
Fully Automatic
Semi-automatic
Manual

By Technology:
Electroplating
Electroless

By Wafer Size:
Up to 100 mm
100 mm-200 mm
Above 200 mm

By Application:
TSV
Copper Pillar
Redistribution Layer (RDL)
Under Bump Metallization (UBM)
Bumping
Others

By Region:
North America
U.S.
Canada

Europe
UK
Germany
France
Spain
Italy
ROE

Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC

Latin America
Brazil
Mexico

Middle East & Africa
Saudi Arabia
South Africa
Rest of Middle East & Africa

Companies Mentioned
ACM Research, Inc
Applied Materials, Inc.
ASM Pacific Technology Ltd,
ClassOne Technology, Inc.
EBARA Technologies,Incorporated
Hitachi Power Solutions Co., Ltd.
Lam Research Corporation
Mitomo Semicon Engineering Co., Ltd.
RENA Technologies GmbH
TANAKA Holdings Co., Ltd

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