Global Electronic Adhesives Market Size study & Forecast, by Form (Liquid, Paste, Solid), Resin (Epoxy, Silicone, Acrylic), by End-Use Industry (Communications, Computers, Consumer Electronics, Industrial, Medical), Product Type and Regional Forecasts 202

The Global Electronic Adhesives Market is valued approximately at USD 5.07 billion in 2024 and is anticipated to expand at a promising CAGR of 6.10% over the forecast period 2025–2035. Acting as critical enablers for miniaturization and high-performance functionality, electronic adhesives are revolutionizing the way electrical and electronic components are assembled. These compounds are used to bond, seal, and encapsulate sensitive circuits and components in devices, ensuring durability, thermal stability, conductivity, and insulation. With the consumer electronics industry undergoing transformative shifts in design, speed, and complexity—particularly in devices like smartphones, wearables, and flexible electronics—the reliance on advanced adhesive formulations has grown markedly, fueling the upward trajectory of the market.

Rising global connectivity, the proliferation of 5G infrastructure, and the rapid evolution of the Internet of Things (IoT) are shaping the demand landscape for electronic adhesives. Manufacturers are shifting toward lighter, more compact devices with multi-layer circuit boards and sophisticated chip packaging, all of which require adhesives that offer precision, high strength, and electrical reliability. Additionally, epoxy, silicone, and acrylic-based adhesives are being enhanced to meet specific challenges like thermal management, reworkability, and resistance to harsh operating environments. As component density increases in electronic devices, the demand for high-performance adhesives to maintain integrity and prevent short circuits or material fatigue continues to surge.

Regionally, North America dominated the market in 2025 due to its robust semiconductor manufacturing ecosystem, high R&D investment in electronics miniaturization, and strong presence of leading OEMs. Europe follows closely, supported by innovation-driven applications in automotive electronics, particularly electric vehicles and autonomous systems. However, Asia Pacific is forecasted to experience the fastest growth through 2035. With China, South Korea, and Japan at the forefront of consumer electronics, PCB manufacturing, and semiconductor production, the region benefits from rising urbanization, strong export dynamics, and government-backed policies to bolster domestic electronics output. India is emerging as a notable growth hub owing to its expanding electronics manufacturing sector under the “Make in India” initiative.

Major market players included in this report are:
• Henkel AG & Co. KGaA
• Dow Chemical Company
• 3M Company
• H.B. Fuller Company
• Sika AG
• Lord Corporation
• Evonik Industries AG
• Bostik SA
• Dymax Corporation
• Permabond LLC
• Master Bond Inc.
• DELO Industrial Adhesives
• Shin-Etsu Chemical Co., Ltd.
• ITW Performance Polymers
• Parker Hannifin Corporation

Global Electronic Adhesives Market Report Scope:
• Historical Data – 2023, 2024
• Base Year for Estimation – 2024
• Forecast period – 2025–2035
• Report Coverage – Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
• Regional Scope – North America; Europe; Asia Pacific; Latin America; Middle East & Africa

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values for the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within the countries involved in the study. The report also provides detailed information about crucial aspects, such as driving factors and challenges, which will define the future growth of the market. Additionally, it incorporates potential opportunities in micro-markets for stakeholders to invest, along with a detailed analysis of the competitive landscape and product offerings of key players.

The detailed segments and sub-segments of the market are explained below:

By Form:
• Liquid
• Paste
• Solid

By Resin:
• Epoxy
• Silicone
• Acrylic

By End-Use Industry:
• Communications
• Computers
• Consumer Electronics
• Industrial
• Medical

By Product Type:
• (Custom Sub-segment as per client requirement)

By Region:

North America
• U.S.
• Canada

Europe
• UK
• Germany
• France
• Spain
• Italy
• Rest of Europe

Asia Pacific
• China
• India
• Japan
• Australia
• South Korea
• Rest of Asia Pacific

Latin America
• Brazil
• Mexico

Middle East & Africa
• UAE
• Saudi Arabia
• South Africa
• Rest of Middle East & Africa

Key Takeaways:
• Market Estimates & Forecast for 10 years from 2025 to 2035.
• Annualized revenues and regional level analysis for each market segment.
• Detailed analysis of geographical landscape with Country level analysis of major regions.
• Competitive landscape with information on major players in the market.
• Analysis of key business strategies and recommendations on future market approach.
• Analysis of competitive structure of the market.
• Demand side and supply side analysis of the market.

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