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Plastics in Electronics Components: Technologies and Global Markets

Publisher BCC Research
Published Feb 23, 2023
Length 218 Pages
SKU # WA17768145

Description

Plastics in Electronics Components: Technologies and Global Markets

Report Scope:

This study covers all electronic components where plastics are used to a significant extent. It concentrates on components produced by injection molding compression molding, and encapsulation. It does not cover wire and cable, films used in capacitors or recording media, or enclosures. The study also identifies major material suppliers and key processors. It reviews important new technologies, as well as changes in legislation and industry standards and norms that may have significant effects on markets for electronic components, and it looks at interpolymer competition.

Report Includes:

61 data tables and 23 additional tables

An overview of the global markets and technologies for plastics in electronics components

Analyses of the global market trends, with data for 2022, 2023 and projections of compound annual growth rates (CAGRs) through 2028

Estimation of the market size and revenue forecast for plastics in electronics components, and market share analysis by type, end-user, and region

Highlights of the market opportunities, and major issues and trends affecting the plastic industry

Insight into the recent industry structure, regulations and policies, pipeline products, and the vendor landscape of the market leading participants

Company profiles of major players within the industry, including BASF, Covestro AG, Henkel AG, Mitsubishi Engineering-Plastics Corp., and SABIC

Companies Mentioned

ASAHI KASEI CORP.
ASHLAND INC.
BASF
CELANESE
COVESTRO AG
CYTEC INDUSTRIES INC.
DSM
DUPONT DE NEMOURS AND CO.
EMS GRIVORY
EPIC RESINS
HENKEL AG
HUNTSMAN INTERNATIONAL LLC
INTERPLASTIC CORP.
Kingfa Science And Technology Co. Ltd.
LANXESS AG
Mitsubishi Engineering-Plastics Corp.
POLYPLASTICS
SABIC INNOVATIVE PLASTICS
SOLVAY SPECIALTY POLYMERS
SUMITOMO BAKELITE
TORAY PLASTICS
VICTREX PLC

Table of Contents

218 Pages
Chapter 1 Introduction
1.1 Study Goals and Objectives
1.2 Reasons for Doing This Study
1.3 Scope of Report
1.4 What’s New in This Report?
1.5 Information Sources
1.6 Methodology
1.7 Geographic Breakdown
1.8 Analyst’s Credentials
1.9 BCC Custom Research
1.10 Related BCC Research Reports
Chapter 2 Summary and Highlights
Chapter 3 Market and Technology Background
3.1 Overview
3.2 Snapshot of the Electronic Device Market
3.3 Computers
3.3.1 Overview
3.3.2 Desktops
3.4 Electronic Displays
3.4.1 Background
3.5 Printers
3.5.1 Overview
3.5.2 Inkjet Printers
3.5.3 Monochrome Laser Printers
3.5.4 Color Laser Printers
3.5.5 Manufacturers
3.6 “All-in-One” Machines
3.7 Phones
3.7.1 Corded
3.7.2 Cordless
3.8 Fax Machines
3.9 Scanners
3.10 Mobile Electronics Devices
3.10.1 Phones
3.10.2 Laptops/Notebooks/Netbooks
3.10.3 Tablets
3.10.4 E-Readers
3.10.5 Portable Music Players
3.11 Automotive Market
3.11.1 Overview
3.11.2 Electric Cars
3.11.3 CAFE Issues
3.11.4 Overview of Electronic Components in Automotive Products
3.11.5 Flexible Circuitry in Automotive Applications
Chapter 4 Market Breakdown by Technology Type
4.1 Overview
4.2 Types of Polymers
4.3 Thermoplastics
4.3.1 Standard Nylons
4.3.2 Thermoplastic Polymers
4.3.3 Polyphenylene Sulfide
4.3.4 Polyimides
4.3.5 Polycarbonates
4.3.6 Polyphthalamides and Other High-Temperature Nylons
4.3.7 Liquid Crystal Polymers
4.3.8 Sulfone Polymers
4.3.9 Alloys/Blends
4.3.10 Fluoropolymers
4.3.11 Polyaryletherketones
4.3.12 Cyclic Olefin Copolymers
4.3.13 Thermoplastic Market Estimates and Forecasts Summary
4.4 Thermoset Polymers
4.4.1 Overview
4.4.2 General Properties
4.4.3 Epoxy Resins
4.4.4 Polyurethanes
4.4.5 Phenolics
4.4.6 Unsaturated Polyesters
4.4.7 Diallyl Phthalate
4.4.8 BT-Epoxy Resins and Cyanate Esters
4.4.9 Thermoset Market Estimates and Forecasts Summary
Chapter 5 Overview of Key Components, PCBs and Encapsulants
5.1 Introduction
5.2 The Focus of This Report
5.3 Resin Consumption
5.3.1 Background
5.3.2 Markets
5.3.3 Growth
5.3.4 Market Drivers
5.4 Printed Circuit Boards
5.4.1 Overview
5.4.2 Property Requirements for Laminates
5.4.3 Physical Composition
5.4.4 Assembly Technologies
5.4.5 PCB Substrates
5.4.6 Specific Polymers Used in Printed Circuit Boards
5.4.7 Other Materials Used in Printed Circuit Boards
5.4.8 Fiber Reinforcements
5.4.9 Production of Circuitry
5.4.10 Environmental Issues
5.4.11 Flexible Printed Circuit Boards
5.4.12 Soldering
5.4.13 Production Statistics
5.4.14 Industry Trends
5.4.15 Electronics Packaging
5.4.16 Market Estimates and Forecasts
5.5 Encapsulants
5.5.1 Definitions and Background
5.5.2 Primary Purposes of Encapsulation
5.5.3 Encapsulant Materials
5.5.4 Epoxy Encapsulation Formulations
5.5.5 Encapsulated Electrical and Electronic Components
5.5.6 Epoxy Encapsulant Systems
5.5.7 Silicone Encapsulants
5.5.8 Thermoplastic Encapsulants
5.5.9 Selected Major Encapsulant Producers and Their Product Lines
5.5.10 Market Estimates and Forecasts
Chapter 6 Molded Electronic Products
6.1 Overview
6.1.1 Background
6.1.2 Polymers Used
6.1.3 Market Drivers
6.2 Connectors
6.2.1 Background
6.2.2 Functions and Components of Connectors
6.2.3 Trends
6.2.4 Applications for Electronic Connectors
6.2.5 Material Selection
6.2.6 Flame Retardance
6.2.7 Standards Relating to Connectors
6.2.8 Manufacturers
6.2.9 End-Use Markets
6.2.10 Market Estimates and Forecasts
6.3 Switches
6.3.1 Background
6.3.2 Market Estimates and Forecasts
6.4 Coil Formers
6.4.1 Background
6.4.2 Manufacturers
6.4.3 Market Estimates and Forecasts
6.5 Relays
6.5.1 Background
6.5.2 Market Estimates and Forecasts
6.6 Capacitors
6.6.1 Background
6.6.2 Applications
6.6.3 Capacitor Materials
6.6.4 Consumption by Market Segment
6.6.5 Market Estimates and Forecasts
6.7 Other Types of Molded Electronic Components
6.7.1 Resistors
6.7.2 Market Estimates and Forecasts
6.8 Summary of Market Estimates and Forecasts
Chapter 7 New Developments
7.1 Background
7.2 Importance of Miniaturization
7.2.1 High-density Interconnect Technology to Drive Market for PCB
7.3 Thin-Walling Electronic Components
7.3.1 Background
7.3.2 Effects of Thin-Walling on Performance Requirements and Design
7.3.3 Application Requirements
7.3.4 Material and Process Selection
7.3.5 Properties Required
7.3.6 Challenges in Downsizing
7.3.7 Software that Aids Thin-wall Design
7.4 Flexible Electronics
7.4.1 Overview
7.5 Wearable Electronics
7.6 Cloud Computing and Big Data
7.7 The Internet of Everything
7.8 Changes in Electronics Component Manufacturing That Could Influence Resin Choices
7.9 Recent Patents Related to the Industry
Chapter 8 Electronic Component Industry Overview and Plastics Producers
8.1 Top Semiconductor Producers and Customers
8.2 Manufacturing and Marketing Aspects
8.2.1 Globalization
8.2.2 What Component Suppliers Are Doing
8.3 Plastics Producers
8.3.1 Overview
8.4 Polymer Producers According to Material Type
8.4.1 Thermosets
8.4.2 Thermoplastics
Chapter 9 Environmental Issues
9.1 Overview
9.2 Printed Circuit Board Disposal
9.3 Bromine-Free Printed Circuit Boards
9.4 Halogen-Free Flame Retardants for Thermoplastics
9.5 Recycling
9.6 Electronics Industry Interface
9.6.1 Overview
9.6.2 Reasons for Increased Environmental Regulations for Electronics Equipment
9.6.3 The European Union RoHS Directive
9.6.4 The European Union WEEE Directive
9.6.5 EPEAT
Chapter 10 Performance Requirements Related to Electronic Components
10.1 Overview
10.2 Flammability Standards
10.2.1 Definitions
10.3 Flammability Tests
10.3.1 Overview
10.3.2 UL 94
10.3.3 Glow-Wire Flammability Index - IEC 60695
10.3.4 UL 1694
10.3.5 UL 746C
10.4 Other Standards
10.4.1 UL 1446
10.4.2 UL 1950
Chapter 11 Competitive Landscape
11.1 Overview
11.2 Big Brands Engineer the Potential of Thermoplastics
11.3 Key Developments
11.3.1 Important News Pertaining to the Market for Plastics in Electronic Components
Chapter 12 Company Profiles
ASAHI KASEI CORP.
ASHLAND INC.
BASF
CELANESE
COVESTRO AG
CYTEC INDUSTRIES INC.
DSM
DUPONT DE NEMOURS AND CO.
EMS GRIVORY
EPIC RESINS
HENKEL AG
HUNTSMAN INTERNATIONAL LLC
INTERPLASTIC CORP.
KINGFA SCIENCE AND TECHNOLOGY CO. LTD.
LANXESS AG
MITSUBISHI ENGINEERING-PLASTICS CORP.
POLYPLASTICS
SABIC INNOVATIVE PLASTICS
SOLVAY SPECIALTY POLYMERS
SUMITOMO BAKELITE
TORAY PLASTICS
VICTREX PLC
Chapter 13 Appendix: Acronyms

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