Glass Interposers Market, By Wafer Size, By Type, By Material, By End Use, By Country, and By Region – Global Industry Analysis, Market Size, Market Share & Forecast from 2025-2032

REPORT HIGHLIGHT

Glass interposers market size was valued at US$ 120.91 Million in 2024, expanding at a CAGR of 12.87% from 2025 to 2032.
The Glass Interposers Market is the global industry focused on designing, developing, and manufacturing glass-based interposers. These are substrate structures used to connect semiconductor components in advanced packaging. Glass interposers provide better electrical insulation, stability, and high density interconnect options compared to traditional organic or silicon-based interposers. They are gaining popularity in high performance computing, data centers, 5G communication, AI and machine learning processors, and consumer electronics. In these areas, compact design, signal quality, and heat management are crucial. The market is growing due to the demand for smaller sizes, multi-chip integration, and improved performance in new electronic devices.
Glass Interposers Market- Market Dynamics

Growing adoption of 2.5D and 3D IC packaging technologies
The shift towards 2.5D and 3D IC packaging is increasing the demand for glass interposers. This change is driven by the need for high bandwidth, low latency, and energy efficient chip integration. These packaging methods allow for the integration of multiple logic and memory dies in a compact space, leading to faster data transfer and better performance. Glass interposers provide key benefits compared to traditional organic and silicon substrates. They have better dimensional stability, reduced signal loss, and can support high I/O density.
Glass interposers are particularly well suited for high performance computing, AI accelerators, and sophisticated network processors because of these advantages. Glass interposers are becoming more and more necessary to satisfy the needs of next generation devices as the semiconductor industry continues to shift toward chiplet based architectures and heterogeneous integration. Glass interposers are predicted to become more widely used in sophisticated electronic applications as a result of the growing complexity of integrated circuits and the need for effective packaging solutions.

For Instance,

In February 2024, AGC, a leader in glass technology, partnered with semiconductor packaging firms to develop ultra-thin glass interposers optimized for 2.5D/3D integration. AGC is responding to increased demand from clients in AI processing and high end networking sectors seeking better electrical performance and warpage control.
Glass Interposers Market- Key Insights
As per the analysis shared by our research analyst, the global market is estimated to grow annually at a CAGR of around 12.87% over the forecast period (2025-2032)
Based on wafer size segmentation, 300 mm was predicted to show maximum market share in the year 2024
Based on type segmentation, 2.5D was the leading type in 2024
Based on material segmentation, glass was the leading material in 2024
Based on end use segmentation, consumer electronics was the leading end use in 2024
On the basis of region, Asia Pacific was the leading revenue generator in 2024
Glass Interposers Market- Segmentation Analysis:

The global glass interposers market is segmented on the basis of wafer size, type, material, end use, and region.
The market is divided into three categories based on wafer size: less than 200 mm, 200 mm, 300 mm. The 300 mm sector dominates the market. This is due to its ability to support higher throughput, reduced manufacturing cost per unit, and compatibility with existing semiconductor fabrication infrastructure. These wafers provide a larger surface area, allowing the production of more interposer units per batch, which is particularly advantageous in mass production environments. Additionally, 300 mm wafers are widely used in the production of high-density, high-performance interposers for use in high performance computing (HPC) systems, advanced GPUs, 5G infrastructure, and AI accelerators. Due to its effectiveness and scalability in the production of commercial semiconductors, this wafer size continues to dominate as demand for multi-die integration and advanced packaging increases.
The market is divided into five categories based on end use: automotive, consumer electronics, defense & aerospace, healthcare, telecommunications, others. The consumer electronics sector dominates the market and is likely to maintain its dominance during the forecast period. This is driven by rising demand for high-performance, compact, and energy-efficient devices like smartphones, tablets, wearables, AR/VR headsets, and gaming consoles. These devices need better semiconductor packaging with high interconnect density, improved thermal performance, and faster data transmission. Glass interposer integration makes this possible. The trend of chiplet-based architecture in mobile and computing devices, along with the move toward multi-functional SoCs (System on Chips), is increasing the use of glass interposers in this sector. As consumers expect more speed, functionality, and smaller sizes from devices, this segment is set to keep its leading position throughout the forecast period.
Glass Interposers Market- Geographical Insights

Asia Pacific dominates the global glass interposers market during the forecast period in 2024
Asia Pacific dominates the global glass interposers market due to its robust global foundries and well-established semiconductor supply chain. Leading nations in advanced chip manufacturing and packaging include China, Japan, Taiwan, and South Korea. In response to the growing need for high-density, low-loss interconnects, major corporations like ASE Group, Samsung Electronics, and TSMC are aggressively incorporating glass interposers into their IC packaging procedures. Glass interposers and other high-performance packaging solutions are becoming more popular in the region due to the massive consumption of consumer electronics, the growing demand for electric vehicles, and the widespread deployment of 5G technologies.
North America is estimated to register the highest CAGR in the glass interposers market during the forecast period in 2024
North America is becoming the fastest growing region in the glass interposers market. This growth is due to increased research and development investments in heterogeneous integration and chiplet-based designs. Major semiconductor companies in the U.S., such as Intel, AMD, and Amkor Technology, are investigating glass interposer solutions to support next-generation computing, AI acceleration, and high speed communication systems. The CHIPS and Science Act of 2022 is also boosting local manufacturing and innovation in the semiconductor field. This will speed up the use of advanced packaging technologies. The focus on data centers, AI infrastructure, and defence electronics in this region is likely to drive significant market growth in the coming years.
Glass Interposers Market- Competitive Landscape:

The Glass Interposers Market is moderately consolidated, with a mix of established semiconductor packaging companies and emerging players investing in R&D and manufacturing capacity. Key players are focusing on technological innovation, strategic collaborations, and capacity expansion to meet the growing demand for advanced interposer solutions.
AGC Inc., SCHOTT AG, Plan Optik AG, Taiwan Advanced Nanotech Inc., Corning Inc., and Samtec Inc. are some of the top businesses in this field. These businesses, which specialize in AI, HPC, consumer electronics, and telecommunications, are using their knowledge of glass processing and microfabrication to create high-precision, reasonably priced interposer solutions for 2.5D/3D packaging.
Across the competitive landscape, strategic developments like joint ventures, new material innovations, and expansion of fabrication capabilities are typical. In order to scale production and maintain their competitiveness in a market that is changing quickly, many players are also partnering with top foundries and OSATs (Outsourced Semiconductor Assembly and Test providers).

Recent Developments:

In January 2025, AGC Inc. introduced an ultra-thin, 30 μm glass substrate with embedded passive components. This substrate is designed to simplify fan-out wafer-level and chiplet packaging. The innovation improves form factor, signal performance, and thermal management for next-generation AR/MR and consumer devices
In January 2024, Samtec announced a partnership with a leading OSAT provider to integrate its high-speed interconnect solutions with emerging glass interposer substrates. This collaboration is designed to enhance data transmission performance in high bandwidth networking and server applications, leveraging Samtec’s expertise in signal integrity and glass-compatible connector technology
In November 2023, Plan Optik AG expanded its manufacturing capabilities by introducing a new line of photolithographically patterned glass interposers for semiconductor packaging. This strategic move enhances their position in supplying precision glass substrates for 2.5D applications, focusing on European and Asian chip assembly markets demanding scalable and thermally stable interposer solutions
In August 2023, SCHOTT AG unveiled a new glass wafer technology designed for high-performance interposers in advanced packaging. The product launch includes improvements in coefficient of thermal expansion (CTE) matching and via etching performance, aiming to support chiplet architectures and reduce warpage in dense multi-die semiconductor assemblies
In June 2023, Corning announced an innovation program to supply ultra-flat glass panels for interposer applications in AI chipsets and cloud computing. The company is collaborating with leading foundries to optimize glass characteristics for finer pitch and increased I/O density, reinforcing its role in next-gen semiconductor substrate technologies

SCOPE OF THE REPORT

The scope of this report covers the market by its major segments, which include as follows:

GLOBAL GLASS INTERPOSERS MARKET KEY PLAYERS- DETAILED COMPETITIVE INSIGHTS

3D Glass Solutions, Inc.
Asahi Glass Co., Ltd.
Corning Incorporated
Ibiden Co., Ltd.
Kiso Micro Co.
NEG Microtec GmbH
Nippon Electric Glass Co., Ltd.
Plan Optik AG
Samtec
SCHOTT AG
TECNISCO, LTD.
Triton Microtechnologies, Inc
Ushio
Workshop of Photonics
RENA
Xilinx, Inc.
Taiwan Semiconductor Manufacturing Company (TSMC)
Kyocera Corporation
Sanmina
Kulicke & Soffa Industries, Inc.
Others

GLOBAL GLASS INTERPOSERS MARKET, BY WAFER SIZE- MARKET ANALYSIS, 2019 - 2032

Less than 200 mm
200 mm
300 mm

GLOBAL GLASS INTERPOSERS MARKET, BY TYPE- MARKET ANALYSIS, 2019 - 2032

2D
2.5D
3D

GLOBAL GLASS INTERPOSERS MARKET, BY MATERIAL- MARKET ANALYSIS, 2019 - 2032

Ceramics
Glasses
Metals

GLOBAL GLASS INTERPOSERS MARKET, BY END USE- MARKET ANALYSIS, 2019 - 2032

Automotive
Consumer Electronics
Defense & Aerospace
Healthcare
Telecommunications
Others

GLOBAL GLASS INTERPOSERS MARKET, BY REGION- MARKET ANALYSIS, 2019 - 2032

North America
U.S.
Canada
Europe
Germany
UK
France
Italy
Spain
The Netherlands
Sweden
Russia
Poland
Rest of Europe
Asia Pacific
China
India
Japan
South Korea
Australia
Indonesia
Thailand
Philippines
Rest of APAC
Latin America
Brazil
Mexico
Argentina
Colombia
Rest of LATAM
The Middle East and Africa
Saudi Arabia
UAE
Israel
Turkey
Algeria
Egypt
Rest of MEA Show more