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Global Wafer-level Packaging Equipment Industry Growth and Trends Forecast to 2031

Publisher APO Research, Inc.
Published Feb 09, 2025
Length 109 Pages
SKU # APRC19838062

Description

Summary

Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing. We statistics in the report are the equipment used in the wafer-level packaging process.

According to APO Research, The global Wafer-level Packaging Equipment market was estimated at US$ million in 2025 and is projected to reach a revised size of US$ million by 2031, witnessing a CAGR of xx% during the forecast period 2026-2031.

North American market for Wafer-level Packaging Equipment is estimated to increase from $ million in 2025 to reach $ million by 2031, at a CAGR of % during the forecast period of 2026 through 2031.

Asia-Pacific market for Wafer-level Packaging Equipment is estimated to increase from $ million in 2025 to reach $ million by 2031, at a CAGR of % during the forecast period of 2026 through 2031.

Europe market for Wafer-level Packaging Equipment is estimated to increase from $ million in 2025 to reach $ million by 2031, at a CAGR of % during the forecast period of 2026 through 2031.

The major global manufacturers of Wafer-level Packaging Equipment include Applied Materials, Tokyo Electron, KLA-Tencor Corporation, EV Group, Tokyo Seimitsu, Disco, SEMES, Suss Microtec and Veeco/CNT, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Wafer-level Packaging Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer-level Packaging Equipment.

The Wafer-level Packaging Equipment market size, estimations, and forecasts are provided in terms of sales volume (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Wafer-level Packaging Equipment market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided. For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

Key Companies & Market Share Insights

In this section, the readers will gain an understanding of the key players competing. This report has studied the key growth strategies, such as innovative trends and developments, intensification of product portfolio, mergers and acquisitions, collaborations, new product innovation, and geographical expansion, undertaken by these participants to maintain their presence. Apart from business strategies, the study includes current developments and key financials. The readers will also get access to the data related to global revenue, price, and sales by manufacturers for the period 2020-2025. This all-inclusive report will certainly serve the clients to stay updated and make effective decisions in their businesses.

Wafer-level Packaging Equipment Segment by Company

Applied Materials
Tokyo Electron
KLA-Tencor Corporation
EV Group
Tokyo Seimitsu
Disco
SEMES
Suss Microtec
Veeco/CNT
Rudolph Technologies

Wafer-level Packaging Equipment Segment by Type

Fan In
Fan Out
Others

Wafer-level Packaging Equipment Segment by Application

Integrated Circuit Fabrication Process
Semiconductor Industry
Microelectromechanical Systems (MEMS)
Other

Wafer-level Packaging Equipment Segment by Region

North America
United States
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Spain
Netherlands
Switzerland
Sweden
Poland
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Southeast Asia
South America
Brazil
Argentina
Chile
Middle East & Africa
Egypt
South Africa
Israel
Türkiye
GCC Countries

Key Drivers & Barriers

High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.

Reasons to Buy This Report

1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Wafer-level Packaging Equipment market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of Wafer-level Packaging Equipment and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market
5. This report helps stakeholders to gain insights into which regions to target globally
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Wafer-level Packaging Equipment.
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.

Chapter Outline

Chapter 1: Introduces the study scope of this report, executive summary of market segments by type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter 2: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Wafer-level Packaging Equipment manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Sales, revenue of Wafer-level Packaging Equipment in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter 5: Introduces market segments by application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter 6: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 7, 8, 9, 10 and 11: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter 12: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics.
Chapter 13: Concluding Insights of the report.

Please Note: Single-User license will be delivered via PDF from the publisher without the rights to print or to edit.

Table of Contents

109 Pages
1 Market Overview

1.1 Product Definition
1.2 Global Market Growth Prospects
1.2.1 Global Wafer-level Packaging Equipment Market Size Estimates and Forecasts (2020-2031)
1.2.2 Global Wafer-level Packaging Equipment Sales Estimates and Forecasts (2020-2031)
1.3 Wafer-level Packaging Equipment Market by Type
1.3.1 Fan In
1.3.2 Fan Out
1.3.3 Others
1.4 Global Wafer-level Packaging Equipment Market Size by Type
1.4.1 Global Wafer-level Packaging Equipment Market Size Overview by Type (2020-2031)
1.4.2 Global Wafer-level Packaging Equipment Historic Market Size Review by Type (2020-2025)
1.4.3 Global Wafer-level Packaging Equipment Forecasted Market Size by Type (2026-2031)
1.5 Key Regions Market Size by Type
1.5.1 North America Wafer-level Packaging Equipment Sales Breakdown by Type (2020-2025)
1.5.2 Europe Wafer-level Packaging Equipment Sales Breakdown by Type (2020-2025)
1.5.3 Asia-Pacific Wafer-level Packaging Equipment Sales Breakdown by Type (2020-2025)
1.5.4 South America Wafer-level Packaging Equipment Sales Breakdown by Type (2020-2025)
1.5.5 Middle East and Africa Wafer-level Packaging Equipment Sales Breakdown by Type (2020-2025)
2 Global Market Dynamics

2.1 Wafer-level Packaging Equipment Industry Trends
2.2 Wafer-level Packaging Equipment Industry Drivers
2.3 Wafer-level Packaging Equipment Industry Opportunities and Challenges
2.4 Wafer-level Packaging Equipment Industry Restraints
3 Market Competitive Landscape by Company

3.1 Global Top Players by Wafer-level Packaging Equipment Revenue (2020-2025)
3.2 Global Top Players by Wafer-level Packaging Equipment Sales (2020-2025)
3.3 Global Top Players by Wafer-level Packaging Equipment Price (2020-2025)
3.4 Global Wafer-level Packaging Equipment Industry Company Ranking, 2023 VS 2024 VS 2025
3.5 Global Wafer-level Packaging Equipment Major Company Production Sites & Headquarters
3.6 Global Wafer-level Packaging Equipment Company, Product Type & Application
3.7 Global Wafer-level Packaging Equipment Company Establishment Date
3.8 Market Competitive Analysis
3.8.1 Global Wafer-level Packaging Equipment Market CR5 and HHI
3.8.2 Global Top 5 and 10 Wafer-level Packaging Equipment Players Market Share by Revenue in 2024
3.8.3 2023 Wafer-level Packaging Equipment Tier 1, Tier 2, and Tier 3
4 Wafer-level Packaging Equipment Regional Status and Outlook

4.1 Global Wafer-level Packaging Equipment Market Size and CAGR by Region: 2020 VS 2024 VS 2031
4.2 Global Wafer-level Packaging Equipment Historic Market Size by Region
4.2.1 Global Wafer-level Packaging Equipment Sales in Volume by Region (2020-2025)
4.2.2 Global Wafer-level Packaging Equipment Sales in Value by Region (2020-2025)
4.2.3 Global Wafer-level Packaging Equipment Sales (Volume & Value), Price and Gross Margin (2020-2025)
4.3 Global Wafer-level Packaging Equipment Forecasted Market Size by Region
4.3.1 Global Wafer-level Packaging Equipment Sales in Volume by Region (2026-2031)
4.3.2 Global Wafer-level Packaging Equipment Sales in Value by Region (2026-2031)
4.3.3 Global Wafer-level Packaging Equipment Sales (Volume & Value), Price and Gross Margin (2026-2031)
5 Wafer-level Packaging Equipment by Application

5.1 Wafer-level Packaging Equipment Market by Application
5.1.1 Integrated Circuit Fabrication Process
5.1.2 Semiconductor Industry
5.1.3 Microelectromechanical Systems (MEMS)
5.1.4 Other
5.2 Global Wafer-level Packaging Equipment Market Size by Application
5.2.1 Global Wafer-level Packaging Equipment Market Size Overview by Application (2020-2031)
5.2.2 Global Wafer-level Packaging Equipment Historic Market Size Review by Application (2020-2025)
5.2.3 Global Wafer-level Packaging Equipment Forecasted Market Size by Application (2026-2031)
5.3 Key Regions Market Size by Application
5.3.1 North America Wafer-level Packaging Equipment Sales Breakdown by Application (2020-2025)
5.3.2 Europe Wafer-level Packaging Equipment Sales Breakdown by Application (2020-2025)
5.3.3 Asia-Pacific Wafer-level Packaging Equipment Sales Breakdown by Application (2020-2025)
5.3.4 South America Wafer-level Packaging Equipment Sales Breakdown by Application (2020-2025)
5.3.5 Middle East and Africa Wafer-level Packaging Equipment Sales Breakdown by Application (2020-2025)
6 Company Profiles

6.1 Applied Materials
6.1.1 Applied Materials Comapny Information
6.1.2 Applied Materials Business Overview
6.1.3 Applied Materials Wafer-level Packaging Equipment Sales, Revenue and Gross Margin (2020-2025)
6.1.4 Applied Materials Wafer-level Packaging Equipment Product Portfolio
6.1.5 Applied Materials Recent Developments
6.2 Tokyo Electron
6.2.1 Tokyo Electron Comapny Information
6.2.2 Tokyo Electron Business Overview
6.2.3 Tokyo Electron Wafer-level Packaging Equipment Sales, Revenue and Gross Margin (2020-2025)
6.2.4 Tokyo Electron Wafer-level Packaging Equipment Product Portfolio
6.2.5 Tokyo Electron Recent Developments
6.3 KLA-Tencor Corporation
6.3.1 KLA-Tencor Corporation Comapny Information
6.3.2 KLA-Tencor Corporation Business Overview
6.3.3 KLA-Tencor Corporation Wafer-level Packaging Equipment Sales, Revenue and Gross Margin (2020-2025)
6.3.4 KLA-Tencor Corporation Wafer-level Packaging Equipment Product Portfolio
6.3.5 KLA-Tencor Corporation Recent Developments
6.4 EV Group
6.4.1 EV Group Comapny Information
6.4.2 EV Group Business Overview
6.4.3 EV Group Wafer-level Packaging Equipment Sales, Revenue and Gross Margin (2020-2025)
6.4.4 EV Group Wafer-level Packaging Equipment Product Portfolio
6.4.5 EV Group Recent Developments
6.5 Tokyo Seimitsu
6.5.1 Tokyo Seimitsu Comapny Information
6.5.2 Tokyo Seimitsu Business Overview
6.5.3 Tokyo Seimitsu Wafer-level Packaging Equipment Sales, Revenue and Gross Margin (2020-2025)
6.5.4 Tokyo Seimitsu Wafer-level Packaging Equipment Product Portfolio
6.5.5 Tokyo Seimitsu Recent Developments
6.6 Disco
6.6.1 Disco Comapny Information
6.6.2 Disco Business Overview
6.6.3 Disco Wafer-level Packaging Equipment Sales, Revenue and Gross Margin (2020-2025)
6.6.4 Disco Wafer-level Packaging Equipment Product Portfolio
6.6.5 Disco Recent Developments
6.7 SEMES
6.7.1 SEMES Comapny Information
6.7.2 SEMES Business Overview
6.7.3 SEMES Wafer-level Packaging Equipment Sales, Revenue and Gross Margin (2020-2025)
6.7.4 SEMES Wafer-level Packaging Equipment Product Portfolio
6.7.5 SEMES Recent Developments
6.8 Suss Microtec
6.8.1 Suss Microtec Comapny Information
6.8.2 Suss Microtec Business Overview
6.8.3 Suss Microtec Wafer-level Packaging Equipment Sales, Revenue and Gross Margin (2020-2025)
6.8.4 Suss Microtec Wafer-level Packaging Equipment Product Portfolio
6.8.5 Suss Microtec Recent Developments
6.9 Veeco/CNT
6.9.1 Veeco/CNT Comapny Information
6.9.2 Veeco/CNT Business Overview
6.9.3 Veeco/CNT Wafer-level Packaging Equipment Sales, Revenue and Gross Margin (2020-2025)
6.9.4 Veeco/CNT Wafer-level Packaging Equipment Product Portfolio
6.9.5 Veeco/CNT Recent Developments
6.10 Rudolph Technologies
6.10.1 Rudolph Technologies Comapny Information
6.10.2 Rudolph Technologies Business Overview
6.10.3 Rudolph Technologies Wafer-level Packaging Equipment Sales, Revenue and Gross Margin (2020-2025)
6.10.4 Rudolph Technologies Wafer-level Packaging Equipment Product Portfolio
6.10.5 Rudolph Technologies Recent Developments
7 North America by Country

7.1 North America Wafer-level Packaging Equipment Sales by Country
7.1.1 North America Wafer-level Packaging Equipment Sales Growth Rate (CAGR) by Country: 2020 VS 2024 VS 2031
7.1.2 North America Wafer-level Packaging Equipment Sales by Country (2020-2025)
7.1.3 North America Wafer-level Packaging Equipment Sales Forecast by Country (2026-2031)
7.2 North America Wafer-level Packaging Equipment Market Size by Country
7.2.1 North America Wafer-level Packaging Equipment Market Size Growth Rate (CAGR) by Country: 2020 VS 2024 VS 2031
7.2.2 North America Wafer-level Packaging Equipment Market Size by Country (2020-2025)
7.2.3 North America Wafer-level Packaging Equipment Market Size Forecast by Country (2026-2031)
8 Europe by Country

8.1 Europe Wafer-level Packaging Equipment Sales by Country
8.1.1 Europe Wafer-level Packaging Equipment Sales Growth Rate (CAGR) by Country: 2020 VS 2024 VS 2031
8.1.2 Europe Wafer-level Packaging Equipment Sales by Country (2020-2025)
8.1.3 Europe Wafer-level Packaging Equipment Sales Forecast by Country (2026-2031)
8.2 Europe Wafer-level Packaging Equipment Market Size by Country
8.2.1 Europe Wafer-level Packaging Equipment Market Size Growth Rate (CAGR) by Country: 2020 VS 2024 VS 2031
8.2.2 Europe Wafer-level Packaging Equipment Market Size by Country (2020-2025)
8.2.3 Europe Wafer-level Packaging Equipment Market Size Forecast by Country (2026-2031)
9 Asia-Pacific by Country

9.1 Asia-Pacific Wafer-level Packaging Equipment Sales by Country
9.1.1 Asia-Pacific Wafer-level Packaging Equipment Sales Growth Rate (CAGR) by Country: 2020 VS 2024 VS 2031
9.1.2 Asia-Pacific Wafer-level Packaging Equipment Sales by Country (2020-2025)
9.1.3 Asia-Pacific Wafer-level Packaging Equipment Sales Forecast by Country (2026-2031)
9.2 Asia-Pacific Wafer-level Packaging Equipment Market Size by Country
9.2.1 Asia-Pacific Wafer-level Packaging Equipment Market Size Growth Rate (CAGR) by Country: 2020 VS 2024 VS 2031
9.2.2 Asia-Pacific Wafer-level Packaging Equipment Market Size by Country (2020-2025)
9.2.3 Asia-Pacific Wafer-level Packaging Equipment Market Size Forecast by Country (2026-2031)
10 South America by Country

10.1 South America Wafer-level Packaging Equipment Sales by Country
10.1.1 South America Wafer-level Packaging Equipment Sales Growth Rate (CAGR) by Country: 2020 VS 2024 VS 2031
10.1.2 South America Wafer-level Packaging Equipment Sales by Country (2020-2025)
10.1.3 South America Wafer-level Packaging Equipment Sales Forecast by Country (2026-2031)
10.2 South America Wafer-level Packaging Equipment Market Size by Country
10.2.1 South America Wafer-level Packaging Equipment Market Size Growth Rate (CAGR) by Country: 2020 VS 2024 VS 2031
10.2.2 South America Wafer-level Packaging Equipment Market Size by Country (2020-2025)
10.2.3 South America Wafer-level Packaging Equipment Market Size Forecast by Country (2026-2031)
11 Middle East and Africa by Country

11.1 Middle East and Africa Wafer-level Packaging Equipment Sales by Country
11.1.1 Middle East and Africa Wafer-level Packaging Equipment Sales Growth Rate (CAGR) by Country: 2020 VS 2024 VS 2031
11.1.2 Middle East and Africa Wafer-level Packaging Equipment Sales by Country (2020-2025)
11.1.3 Middle East and Africa Wafer-level Packaging Equipment Sales Forecast by Country (2026-2031)
11.2 Middle East and Africa Wafer-level Packaging Equipment Market Size by Country
11.2.1 Middle East and Africa Wafer-level Packaging Equipment Market Size Growth Rate (CAGR) by Country: 2020 VS 2024 VS 2031
11.2.2 Middle East and Africa Wafer-level Packaging Equipment Market Size by Country (2020-2025)
11.2.3 Middle East and Africa Wafer-level Packaging Equipment Market Size Forecast by Country (2026-2031)
12 Value Chain and Sales Channels Analysis

12.1 Wafer-level Packaging Equipment Value Chain Analysis
12.1.1 Wafer-level Packaging Equipment Key Raw Materials
12.1.2 Key Raw Materials Price
12.1.3 Raw Materials Key Suppliers
12.1.4 Manufacturing Cost Structure
12.1.5 Wafer-level Packaging Equipment Production Mode & Process
12.2 Wafer-level Packaging Equipment Sales Channels Analysis
12.2.1 Direct Comparison with Distribution Share
12.2.2 Wafer-level Packaging Equipment Distributors
12.2.3 Wafer-level Packaging Equipment Customers
13 Concluding Insights
14 Appendix

14.1 Reasons for Doing This Study
14.2 Research Methodology
14.3 Research Process
14.4 Authors List of This Report
14.5 Data Source
14.5.1 Secondary Sources
14.5.2 Primary Sources
14.6 Disclaimer
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