Wafer Cleaning Equipment Market by Equipment Type (Batch Immersion Cleaning System, Batch Spray Cleaning System, Scrubbers), Wafer Size (150 mm, 200 mm, 300 mm), Impurities, Application, End-User Industry - Global Forecast 2025-2032
Description
The Wafer Cleaning Equipment Market was valued at USD 13.86 billion in 2024 and is projected to grow to USD 15.01 billion in 2025, with a CAGR of 8.90%, reaching USD 27.43 billion by 2032.
An incisive introduction outlining how precision cleaning technologies have become essential enablers of advanced semiconductor device manufacturing and yield optimization
The wafer cleaning equipment landscape sits at the intersection of precise chemistry, intricate mechanics, and stringent contamination control. Advances in node scaling, heterogeneous integration, and packaging density have elevated the role of cleaning processes from a supporting activity to a strategic enabler of device performance and yield. As fabs pursue tighter defect budgets and more complex material stacks, cleaning equipment must deliver repeatable surface conditioning, sub-nanometer residue removal, and compatibility with new dielectric and conductive films.
Recent transitions in manufacturing approaches-such as increased adoption of single-wafer processing for critical surfaces, greater use of cryogenic techniques for particle mobilization, and the refinement of spray and immersion chemistries-have pushed equipment OEMs and process engineers to collaborate earlier in the development cycle. Consequently, procurement decisions now weigh long-term process qualification risk, chemical throughput compatibility, and integration with advanced metrology. In sum, the introduction frames the subsequent analysis by highlighting that competitive advantage in wafer fabrication increasingly depends on nuanced cleaning capabilities rather than generic supply of hardware.
How technological, regulatory, and supply chain evolutions are converging to redefine technical priorities and procurement criteria across wafer cleaning platforms
Transformative shifts in wafer cleaning derive from a confluence of technological, supply chain, and regulatory forces. The push to support advanced packaging and heterogeneous integration is prompting a move from broad-brush batch techniques to targeted single-wafer and cryogenic solutions that address localized contamination and delicate surface chemistries. Concurrently, the materials roadmap-featuring new low-k dielectrics, high-mobility channels, and diverse interconnect stacks-requires cleaning sequences that are chemically selective yet mechanically gentle.
On the supply chain side, OEMs are re-evaluating modularity and field-service models to reduce time-to-recovery and to support distributed manufacturing footprints. This is coupled with an acceleration in digitalization: inline sensors, predictive maintenance algorithms, and process recipes governed by data analytics are becoming standard expectations rather than premium features. Regulatory pressures and sustainability goals further catalyze innovation, driving the adoption of closed-loop chemical handling, wastewater minimization technologies, and solvent substitutions that reduce environmental and compliance risk. Together these shifts are reshaping capital procurement criteria, partner selection, and the technical specifications that define next-generation cleaning platforms.
An evidence-based appraisal of the cascading operational and sourcing consequences of the 2025 United States tariff measures on the wafer cleaning supply chain
The tariffs introduced by the United States in 2025 have produced layered consequences that ripple through the wafer cleaning equipment ecosystem. Increased duties on certain imported components and subassemblies raised immediate input costs for some OEMs, particularly those that relied on cross-border suppliers for precision pumps, specialized valves, or bespoke metrology modules. In response, manufacturers accelerated efforts to qualify alternative suppliers, re-source key components domestically where feasible, and redesign subsystems to reduce dependency on tariff-impacted parts.
Beyond direct cost implications, the tariffs influenced investment and operational choices. Equipment suppliers adapted their supply chains to shorten lead times and minimize exposure to policy shifts, and some prioritised vertical integration of critical subassemblies to insulate production schedules. Buyers adjusted procurement timing and contract terms to incorporate tariff contingencies and to secure long-lead components earlier in their build cycles. At the process level, fabs assessed total landed cost and reliability risk when selecting between batch and single-wafer architectures, balancing immediate tariff-driven expense with longer-term yield and throughput implications. These cumulative effects underscore how trade policy can alter engineering and sourcing strategies without necessarily changing the fundamental technical requirements for contamination control.
Deep segmentation-driven insights revealing where equipment types, wafer sizes, impurity profiles, application classes, and end-user demands intersect to shape procurement logic
Segmentation offers a structured lens to evaluate where technical differentiation and commercial opportunity intersect within wafer cleaning equipment. When considering equipment type, it is important to recognize that Batch Immersion Cleaning Systems and Batch Spray Cleaning Systems remain relevant for high-throughput pre-clean and post-etch steps, whereas Scrubbers provide mechanical agitation for robust particle removal, and Single Wafer Cryogenic Systems and Single Wafer Spray Systems address precision, localised contamination challenges on advanced nodes. These distinctions influence capital selection, process qualification timelines, and footprint decisions.
Wafer size segmentation-150 mm, 200 mm, and 300 mm-reflects both historical fabrication hierarchies and current capacity planning choices; tool designs must accommodate mechanical handling differences, throughput objectives, and the ergonomics of wafer carriers. Impurity-focused segmentation distinguishes Chemical Impurities, Metallic Impurities, and Particle Impurities, a classification that drives chemistry selection, filtration requirements, and endpoint metrology. Application-based segmentation across Interposer, LED, Logic, Memory, Microelectromechanical Systems, and RF Devices illuminates how cleaning demands vary from packaging interface cleanliness to nanoscale defect control in logic and memory. Lastly, end-user industry segmentation spanning Aerospace & Defense, Automotive, Consumer Electronics, and Medical Devices highlights divergent regulatory corridors, reliability thresholds, and certification demands that shape equipment validation and service models.
A nuanced regional perspective on how geographic regulatory regimes, supplier density, and service infrastructure drive differing priorities for equipment procurement and deployment
Regional dynamics change the competitive calculus for equipment providers and end users by influencing regulatory environment, supplier ecosystems, and capital investment behavior. In the Americas, manufacturing clusters combine design leadership with a strong emphasis on intellectual property protection and onsite service capabilities, driving demand for configurable tools and rapid field support. This region’s strategic priorities often skew toward integration with local supply chains and robust service contracts to minimize downtime and protect high-value production lines.
In Europe, Middle East & Africa, regulatory complexity and sustainability mandates push vendors to offer closed-loop chemical management and rigorous environmental compliance data. Customers in this region prioritize traceability and lifecycle documentation alongside performance. Asia-Pacific hosts concentrated fabrication capacity and a dense network of equipment suppliers and component manufacturers, resulting in intense competition around cost, delivery speed, and feature differentiation. Buyers in this region frequently seek tight integration with regional suppliers and favor modular platforms that enable rapid scaling. Across all regions, geopolitical considerations, local incentives, and workforce availability continue to shape where and how wafer cleaning equipment is procured and supported.
Competitive company dynamics showing how technology leadership, service excellence, and strategic partnerships determine supply-side differentiation and customer selection
Key companies in the wafer cleaning equipment arena are distinguishing themselves through a combination of technological depth, service ecosystems, and strategic partnerships. Leading OEMs are investing in advanced process control, inline monitoring, and adaptable chemistry delivery systems to support a widening array of material stacks and device architectures. These firms are also forging alliances with chemical suppliers, metrology vendors, and fab operators to co-develop recipes that reduce qualification risk and speed time-to-yield.
At the same time, smaller and specialised vendors are capturing niche positions by delivering innovations such as low-damage cryogenic particle removal, compact single-wafer spray modules for lab-to-fab transition, and integrated scrubber subsystems for legacy production lines. Service differentiation-comprising remote diagnostics, predictive maintenance, and localized spare part inventories-has emerged as a critical competitive axis, particularly where uptime and mean time to repair materially affect customer economics. As a result, buyers weigh not only equipment performance but also the depth and responsiveness of the supplier’s support infrastructure and the breadth of its partnership ecosystem.
Actionable strategic and operational recommendations that equipment manufacturers and fabricators can implement to reduce risk, accelerate qualification, and improve long-term competitiveness
Industry leaders should prioritize a set of practical actions to strengthen resilience and capture strategic advantage. First, embed modularity and parts commonality into new tool designs to reduce exposure to supply-chain shocks and to simplify field maintenance. Second, escalate investments in digital twins, inline sensors, and analytics to enable predictive maintenance and recipe governance; these capabilities reduce variability and improve first-pass yield. Third, formalize supplier qualification frameworks that include contingency plans for tariff or trade-policy shifts and that emphasize multi-sourcing for critical components.
Additionally, accelerate cross-functional collaboration between process engineers, equipment architects, and procurement teams to shorten validation cycles and to align procurement specifications with operational realities. Pursue selective vertical integration where it reduces supply risk without imposing excessive capital burden, and expand service offerings to include outcome-based contracts that align incentives around uptime and yield. Finally, commit to sustainability objectives by adopting closed-loop chemical handling and wastewater reduction measures, which can streamline permitting and reduce long-term operating risk. Together these actions produce tangible improvements in operational robustness and strategic positioning.
A transparent mixed-methods research approach combining expert interviews, technical literature review, and cross-validation against vendor and regulatory sources to ensure robust insights
The research underpinning this executive summary combined qualitative expert interviews, technical literature review, and comparative analysis of publicly available product specifications and regulatory frameworks. Primary insights were validated through structured interviews with process engineers, equipment OEM product managers, and procurement leads to ensure practical relevance and to ground conclusions in operational realities. Secondary sources included peer-reviewed publications, standards documents, and supplier technical collateral to capture the latest modality innovations and environmental compliance trends.
Analytical rigor was maintained by cross-referencing vendor claims with independent technical assessments and by synthesizing common themes across different fabrication nodes and end-use sectors. Where divergent viewpoints emerged, the methodology prioritized corroboration from multiple stakeholders to reduce bias and to reflect a balanced view of technical feasibility versus commercial constraints. This mixed-methods approach enabled a strategic narrative that links technology trends, supply-chain dynamics, and policy impacts without relying on proprietary market sizing or forecasting assumptions.
A conclusive synthesis emphasizing the strategic role of cleaning technologies in yield, reliability, and supplier selection amid evolving technical and policy pressures
In conclusion, wafer cleaning equipment has evolved from a legacy utility into a strategic lever that affects yield, device performance, and operational resilience. Technological trends-such as the shift toward single-wafer, cryogenic, and data-enabled cleaning solutions-are redefining what buyers expect from suppliers, while regulatory and trade policy developments add layers of supply-chain complexity that must be actively managed. Segmentation across equipment types, wafer sizes, impurity classes, applications, and end-user industries reveals differentiated requirements that demand tailored tool design and support models.
Looking ahead, success will accrue to organizations that combine technological innovation with supply-chain agility and a service-led commercial proposition. Those that align equipment design with rigorous sustainability practices and with digital process governance will be better positioned to meet the dual challenges of tighter contamination budgets and more complex material systems. The balance of engineering excellence, supplier resilience, and customer-focused service will determine which firms lead in supporting the next generation of semiconductor manufacturing.
Note: PDF & Excel + Online Access - 1 Year
An incisive introduction outlining how precision cleaning technologies have become essential enablers of advanced semiconductor device manufacturing and yield optimization
The wafer cleaning equipment landscape sits at the intersection of precise chemistry, intricate mechanics, and stringent contamination control. Advances in node scaling, heterogeneous integration, and packaging density have elevated the role of cleaning processes from a supporting activity to a strategic enabler of device performance and yield. As fabs pursue tighter defect budgets and more complex material stacks, cleaning equipment must deliver repeatable surface conditioning, sub-nanometer residue removal, and compatibility with new dielectric and conductive films.
Recent transitions in manufacturing approaches-such as increased adoption of single-wafer processing for critical surfaces, greater use of cryogenic techniques for particle mobilization, and the refinement of spray and immersion chemistries-have pushed equipment OEMs and process engineers to collaborate earlier in the development cycle. Consequently, procurement decisions now weigh long-term process qualification risk, chemical throughput compatibility, and integration with advanced metrology. In sum, the introduction frames the subsequent analysis by highlighting that competitive advantage in wafer fabrication increasingly depends on nuanced cleaning capabilities rather than generic supply of hardware.
How technological, regulatory, and supply chain evolutions are converging to redefine technical priorities and procurement criteria across wafer cleaning platforms
Transformative shifts in wafer cleaning derive from a confluence of technological, supply chain, and regulatory forces. The push to support advanced packaging and heterogeneous integration is prompting a move from broad-brush batch techniques to targeted single-wafer and cryogenic solutions that address localized contamination and delicate surface chemistries. Concurrently, the materials roadmap-featuring new low-k dielectrics, high-mobility channels, and diverse interconnect stacks-requires cleaning sequences that are chemically selective yet mechanically gentle.
On the supply chain side, OEMs are re-evaluating modularity and field-service models to reduce time-to-recovery and to support distributed manufacturing footprints. This is coupled with an acceleration in digitalization: inline sensors, predictive maintenance algorithms, and process recipes governed by data analytics are becoming standard expectations rather than premium features. Regulatory pressures and sustainability goals further catalyze innovation, driving the adoption of closed-loop chemical handling, wastewater minimization technologies, and solvent substitutions that reduce environmental and compliance risk. Together these shifts are reshaping capital procurement criteria, partner selection, and the technical specifications that define next-generation cleaning platforms.
An evidence-based appraisal of the cascading operational and sourcing consequences of the 2025 United States tariff measures on the wafer cleaning supply chain
The tariffs introduced by the United States in 2025 have produced layered consequences that ripple through the wafer cleaning equipment ecosystem. Increased duties on certain imported components and subassemblies raised immediate input costs for some OEMs, particularly those that relied on cross-border suppliers for precision pumps, specialized valves, or bespoke metrology modules. In response, manufacturers accelerated efforts to qualify alternative suppliers, re-source key components domestically where feasible, and redesign subsystems to reduce dependency on tariff-impacted parts.
Beyond direct cost implications, the tariffs influenced investment and operational choices. Equipment suppliers adapted their supply chains to shorten lead times and minimize exposure to policy shifts, and some prioritised vertical integration of critical subassemblies to insulate production schedules. Buyers adjusted procurement timing and contract terms to incorporate tariff contingencies and to secure long-lead components earlier in their build cycles. At the process level, fabs assessed total landed cost and reliability risk when selecting between batch and single-wafer architectures, balancing immediate tariff-driven expense with longer-term yield and throughput implications. These cumulative effects underscore how trade policy can alter engineering and sourcing strategies without necessarily changing the fundamental technical requirements for contamination control.
Deep segmentation-driven insights revealing where equipment types, wafer sizes, impurity profiles, application classes, and end-user demands intersect to shape procurement logic
Segmentation offers a structured lens to evaluate where technical differentiation and commercial opportunity intersect within wafer cleaning equipment. When considering equipment type, it is important to recognize that Batch Immersion Cleaning Systems and Batch Spray Cleaning Systems remain relevant for high-throughput pre-clean and post-etch steps, whereas Scrubbers provide mechanical agitation for robust particle removal, and Single Wafer Cryogenic Systems and Single Wafer Spray Systems address precision, localised contamination challenges on advanced nodes. These distinctions influence capital selection, process qualification timelines, and footprint decisions.
Wafer size segmentation-150 mm, 200 mm, and 300 mm-reflects both historical fabrication hierarchies and current capacity planning choices; tool designs must accommodate mechanical handling differences, throughput objectives, and the ergonomics of wafer carriers. Impurity-focused segmentation distinguishes Chemical Impurities, Metallic Impurities, and Particle Impurities, a classification that drives chemistry selection, filtration requirements, and endpoint metrology. Application-based segmentation across Interposer, LED, Logic, Memory, Microelectromechanical Systems, and RF Devices illuminates how cleaning demands vary from packaging interface cleanliness to nanoscale defect control in logic and memory. Lastly, end-user industry segmentation spanning Aerospace & Defense, Automotive, Consumer Electronics, and Medical Devices highlights divergent regulatory corridors, reliability thresholds, and certification demands that shape equipment validation and service models.
A nuanced regional perspective on how geographic regulatory regimes, supplier density, and service infrastructure drive differing priorities for equipment procurement and deployment
Regional dynamics change the competitive calculus for equipment providers and end users by influencing regulatory environment, supplier ecosystems, and capital investment behavior. In the Americas, manufacturing clusters combine design leadership with a strong emphasis on intellectual property protection and onsite service capabilities, driving demand for configurable tools and rapid field support. This region’s strategic priorities often skew toward integration with local supply chains and robust service contracts to minimize downtime and protect high-value production lines.
In Europe, Middle East & Africa, regulatory complexity and sustainability mandates push vendors to offer closed-loop chemical management and rigorous environmental compliance data. Customers in this region prioritize traceability and lifecycle documentation alongside performance. Asia-Pacific hosts concentrated fabrication capacity and a dense network of equipment suppliers and component manufacturers, resulting in intense competition around cost, delivery speed, and feature differentiation. Buyers in this region frequently seek tight integration with regional suppliers and favor modular platforms that enable rapid scaling. Across all regions, geopolitical considerations, local incentives, and workforce availability continue to shape where and how wafer cleaning equipment is procured and supported.
Competitive company dynamics showing how technology leadership, service excellence, and strategic partnerships determine supply-side differentiation and customer selection
Key companies in the wafer cleaning equipment arena are distinguishing themselves through a combination of technological depth, service ecosystems, and strategic partnerships. Leading OEMs are investing in advanced process control, inline monitoring, and adaptable chemistry delivery systems to support a widening array of material stacks and device architectures. These firms are also forging alliances with chemical suppliers, metrology vendors, and fab operators to co-develop recipes that reduce qualification risk and speed time-to-yield.
At the same time, smaller and specialised vendors are capturing niche positions by delivering innovations such as low-damage cryogenic particle removal, compact single-wafer spray modules for lab-to-fab transition, and integrated scrubber subsystems for legacy production lines. Service differentiation-comprising remote diagnostics, predictive maintenance, and localized spare part inventories-has emerged as a critical competitive axis, particularly where uptime and mean time to repair materially affect customer economics. As a result, buyers weigh not only equipment performance but also the depth and responsiveness of the supplier’s support infrastructure and the breadth of its partnership ecosystem.
Actionable strategic and operational recommendations that equipment manufacturers and fabricators can implement to reduce risk, accelerate qualification, and improve long-term competitiveness
Industry leaders should prioritize a set of practical actions to strengthen resilience and capture strategic advantage. First, embed modularity and parts commonality into new tool designs to reduce exposure to supply-chain shocks and to simplify field maintenance. Second, escalate investments in digital twins, inline sensors, and analytics to enable predictive maintenance and recipe governance; these capabilities reduce variability and improve first-pass yield. Third, formalize supplier qualification frameworks that include contingency plans for tariff or trade-policy shifts and that emphasize multi-sourcing for critical components.
Additionally, accelerate cross-functional collaboration between process engineers, equipment architects, and procurement teams to shorten validation cycles and to align procurement specifications with operational realities. Pursue selective vertical integration where it reduces supply risk without imposing excessive capital burden, and expand service offerings to include outcome-based contracts that align incentives around uptime and yield. Finally, commit to sustainability objectives by adopting closed-loop chemical handling and wastewater reduction measures, which can streamline permitting and reduce long-term operating risk. Together these actions produce tangible improvements in operational robustness and strategic positioning.
A transparent mixed-methods research approach combining expert interviews, technical literature review, and cross-validation against vendor and regulatory sources to ensure robust insights
The research underpinning this executive summary combined qualitative expert interviews, technical literature review, and comparative analysis of publicly available product specifications and regulatory frameworks. Primary insights were validated through structured interviews with process engineers, equipment OEM product managers, and procurement leads to ensure practical relevance and to ground conclusions in operational realities. Secondary sources included peer-reviewed publications, standards documents, and supplier technical collateral to capture the latest modality innovations and environmental compliance trends.
Analytical rigor was maintained by cross-referencing vendor claims with independent technical assessments and by synthesizing common themes across different fabrication nodes and end-use sectors. Where divergent viewpoints emerged, the methodology prioritized corroboration from multiple stakeholders to reduce bias and to reflect a balanced view of technical feasibility versus commercial constraints. This mixed-methods approach enabled a strategic narrative that links technology trends, supply-chain dynamics, and policy impacts without relying on proprietary market sizing or forecasting assumptions.
A conclusive synthesis emphasizing the strategic role of cleaning technologies in yield, reliability, and supplier selection amid evolving technical and policy pressures
In conclusion, wafer cleaning equipment has evolved from a legacy utility into a strategic lever that affects yield, device performance, and operational resilience. Technological trends-such as the shift toward single-wafer, cryogenic, and data-enabled cleaning solutions-are redefining what buyers expect from suppliers, while regulatory and trade policy developments add layers of supply-chain complexity that must be actively managed. Segmentation across equipment types, wafer sizes, impurity classes, applications, and end-user industries reveals differentiated requirements that demand tailored tool design and support models.
Looking ahead, success will accrue to organizations that combine technological innovation with supply-chain agility and a service-led commercial proposition. Those that align equipment design with rigorous sustainability practices and with digital process governance will be better positioned to meet the dual challenges of tighter contamination budgets and more complex material systems. The balance of engineering excellence, supplier resilience, and customer-focused service will determine which firms lead in supporting the next generation of semiconductor manufacturing.
Note: PDF & Excel + Online Access - 1 Year
Table of Contents
190 Pages
- 1. Preface
- 1.1. Objectives of the Study
- 1.2. Market Segmentation & Coverage
- 1.3. Years Considered for the Study
- 1.4. Currency
- 1.5. Language
- 1.6. Stakeholders
- 2. Research Methodology
- 3. Executive Summary
- 4. Market Overview
- 5. Market Insights
- 5.1. Integration of ultrafast laser-based wafer cleaning systems to remove atomic contaminants
- 5.2. Adoption of ozone-based wet cleaning processes to enhance removal of subnanometer residues
- 5.3. Development of automation integrated wafer cleaning modules for high throughput production lines
- 5.4. Integration of real-time end point detection sensors for enhanced process control in wafer cleaning
- 5.5. Shift towards eco-friendly surfactant and solvent formulations to reduce chemical waste in cleaning
- 5.6. Rising demand for single wafer cleaning tools to support advanced packaging and 3D stacking nodes
- 5.7. Implementation of AI-driven predictive maintenance platforms to minimize downtime in wet benches
- 5.8. Growing use of supercritical CO2 as a green cleaning agent for semiconductor wafer processing
- 5.9. Customization of cleaning cycles with adaptive spray nozzles for varied wafer sizes and materials
- 5.10. Strategic partnerships between equipment suppliers and foundries to co-develop specialized cleaning solutions
- 6. Cumulative Impact of United States Tariffs 2025
- 7. Cumulative Impact of Artificial Intelligence 2025
- 8. Wafer Cleaning Equipment Market, by Equipment Type
- 8.1. Batch Immersion Cleaning System
- 8.2. Batch Spray Cleaning System
- 8.3. Scrubbers
- 8.4. Single Wafer Cryogenic System
- 8.5. Single Wafer Spray System
- 9. Wafer Cleaning Equipment Market, by Wafer Size
- 9.1. 150 mm
- 9.2. 200 mm
- 9.3. 300 mm
- 10. Wafer Cleaning Equipment Market, by Impurities
- 10.1. Chemical Impurities
- 10.2. Metallic Impurities
- 10.3. Particle Impurities
- 11. Wafer Cleaning Equipment Market, by Application
- 11.1. Interposer
- 11.2. LED
- 11.3. Logic
- 11.4. Memory
- 11.5. Microelectromechanical Systems
- 11.6. RF Devices
- 12. Wafer Cleaning Equipment Market, by End-User Industry
- 12.1. Aerospace & Defense
- 12.2. Automotive
- 12.3. Consumer Electronics
- 12.4. Medical Devices
- 13. Wafer Cleaning Equipment Market, by Region
- 13.1. Americas
- 13.1.1. North America
- 13.1.2. Latin America
- 13.2. Europe, Middle East & Africa
- 13.2.1. Europe
- 13.2.2. Middle East
- 13.2.3. Africa
- 13.3. Asia-Pacific
- 14. Wafer Cleaning Equipment Market, by Group
- 14.1. ASEAN
- 14.2. GCC
- 14.3. European Union
- 14.4. BRICS
- 14.5. G7
- 14.6. NATO
- 15. Wafer Cleaning Equipment Market, by Country
- 15.1. United States
- 15.2. Canada
- 15.3. Mexico
- 15.4. Brazil
- 15.5. United Kingdom
- 15.6. Germany
- 15.7. France
- 15.8. Russia
- 15.9. Italy
- 15.10. Spain
- 15.11. China
- 15.12. India
- 15.13. Japan
- 15.14. Australia
- 15.15. South Korea
- 16. Competitive Landscape
- 16.1. Market Share Analysis, 2024
- 16.2. FPNV Positioning Matrix, 2024
- 16.3. Competitive Analysis
- 16.3.1. ACM Research, Inc.
- 16.3.2. Amerimade Technology
- 16.3.3. AP&S INTERNATIONAL GmbH
- 16.3.4. Applied Materials, Inc.
- 16.3.5. AXUS TECHNOLOGY
- 16.3.6. Bruker Corporation
- 16.3.7. C&D Semiconductor Services Inc
- 16.3.8. Chemcut Corporation
- 16.3.9. Cleaning Technologies Group
- 16.3.10. DECKER Anlagenbau
- 16.3.11. Entegris, Inc.
- 16.3.12. Fujikoshi Machinery Corporation
- 16.3.13. Illinois Tool Works Inc.
- 16.3.14. KLA Corporation
- 16.3.15. Lam Research Corporation
- 16.3.16. Modutek Corporation
- 16.3.17. Orbray Co., Ltd.
- 16.3.18. PVA TePla AG
- 16.3.19. RENA Technologies GmbH
- 16.3.20. Samco Inc.
- 16.3.21. SCREEN Holdings Co., Ltd.
- 16.3.22. SEMES Co., Ltd.
- 16.3.23. SEMTEK Corporation
- 16.3.24. Shibaura Mechatronics Corporation
- 16.3.25. TAZMO CO.,LTD.
- 16.3.26. Tokyo Electron Limited
- 16.3.27. Ultron Systems, Inc.
- 16.3.28. Veeco Instruments Inc.
- 16.3.29. Y.A.C. Mechatronics Co., Ltd.
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