Silicon Wafer Double-sides Grinding Machines Market by Machine Configuration (Horizontal Double-Disc, Vertical Double-Disc, Planetary Carrier Type), Wafer Diameter (150Mm, 200Mm, 300Mm), Automation Level, Process Type, End-User Industry - Global Forecast
Description
The Silicon Wafer Double-sides Grinding Machines Market was valued at USD 3.97 billion in 2025 and is projected to grow to USD 4.34 billion in 2026, with a CAGR of 10.18%, reaching USD 7.83 billion by 2032.
Introduction to the rapidly evolving double-sides grinding equipment landscape driven by advanced metrology, modular design and diversified end-use demands
The silicon wafer double-sides grinding equipment sector is navigating a period of rapid technical refinement and shifting demand vectors as semiconductor, automotive, and renewable energy applications intensify requirements for surface planarity and thickness uniformity. Advances in spindle dynamics, abrasive media engineering, and real-time metrology are converging to elevate throughput while reducing total cost of ownership. As a result, machine builders and integrators are prioritizing modular architectures and tighter process controls to deliver predictable performance across an increasingly diverse set of wafer diameters and end-use specifications.
Stakeholders are responding to a more complex buyer landscape in which requirements vary from ultra-thin silicon for electric vehicle power electronics to hardened wafers for high-reliability telecommunications modules. In parallel, manufacturers are balancing capital intensity with the need to future-proof production lines through flexible automation options and interoperable control platforms. This transition creates both opportunity and pressure: suppliers that can marry high-precision mechanics with scalable automation and data-enabled service models will differentiate in performance-driven procurement environments.
How technological convergence, shifting end-user specifications and automation choices are reshaping supplier strategies and equipment design imperatives
The industry is experiencing transformative shifts driven by technological innovation, changing customer requirements, and supply-chain resilience strategies. Precision has emerged as a strategic differentiator rather than a technical checkbox, pushing manufacturers toward multi-axis control, adaptive abrasive deposition, and integrated in-line metrology that detect and correct process deviations in real time. These capabilities shorten cycle times and reduce rework, which bears directly on unit economics and adoption within high-mix, low-volume production environments.
Concurrently, demand-side evolution is reshaping product roadmaps: electric vehicle powertrains and advanced driver-assistance systems impose tighter thickness and flatness specifications, while consumer electronics require rapid changeovers to accommodate shorter product life cycles. Automation levels are also shifting; adoption of fully automatic systems is accelerating in high-throughput fabs, while semi-automatic and manual configurations retain relevance where customization and lower capital outlay are priorities. These dynamics encourage suppliers to offer configurable platforms that can scale from pilot lines to full production suites, and to pair mechanical upgrades with predictive maintenance and remote diagnostics to extend equipment uptime and lower operational risk.
Implications of 2025 tariff adjustments on procurement strategies, supplier localization, and resilient sourcing for capital equipment investments
Trade policies and tariff adjustments in 2025 have introduced new considerations for procurement strategy, supplier selection, and capital investment timing. Tariff changes have amplified the need for geographically diversified sourcing and have encouraged end users to re-evaluate total landed cost rather than purchase price alone. In some instances, higher import duties have motivated strategic localization of key manufacturing steps or the negotiation of alternative supply routes to preserve lead times and protect critical capacity.
These policy shifts have a cascading effect on equipment vendors and system integrators. Vendors with established local service networks and regional assembly capabilities are positioned to mitigate tariff exposure for customers, while those heavily reliant on cross-border supply chains must adapt by increasing inventory buffers or qualifying alternate component sources. The result is a renewed emphasis on supplier resilience, contractual flexibility, and transparent cost modeling that allows buyers to quantify tariff-related impacts across procurement cycles and prioritize investments that deliver long-term stability over short-term cost advantages.
Actionable segmentation intelligence that links wafer diameter, automation level, industry end-use, machine configuration and process type to buyer value drivers
Segmentation insights reveal where performance requirements and buyer preferences diverge, guiding tailored product development and go-to-market strategies. When wafers are categorized by diameter, stakeholders design process flows and tooling for 150mm, 200mm, and 300mm wafers, each with distinct handling, chucking, and throughput implications. Automation level segmentation separates fully automatic, manual, and semi-automatic systems, reflecting a gradient between throughput demands and flexibility needs that informs control system design and human-machine interface investments.
End-user industry segmentation highlights differentiated technical priorities: automotive applications, which include both electric vehicles and traditional vehicles, emphasize durability and thermal management; consumer electronics, spanning computing devices, mobile devices, and wearables, favor rapid changeover and high-volume repeatability; solar applications, divided into crystalline and thin-film processes, demand large-area flatness and contamination control; telecommunications customers prioritize signal integrity and defect minimization. Machine configuration segmentation differentiates multi head, single head, and twin head architectures, with single head systems further characterized by horizontal and vertical orientations and twin head systems offering adjustable spindle or fixed spindle variants, each affecting cycle time and layout flexibility. Process type segmentation distinguishes grinding-only systems from grinding-polishing integrated platforms, and the latter includes chemical mechanical polishing and mechanical polishing process routes, indicating varying consumable, waste-handling, and metrology requirements.
Together, these segmentation lenses enable suppliers to map feature sets to customer value drivers, prioritize R&D investments in spindle stabilization or in-line metrology, and craft service offers aligned to the operational realities of each buyer cohort.
Regional dynamics and procurement nuances across the Americas, Europe Middle East & Africa and Asia-Pacific that determine deployment and service priorities
Regional dynamics continue to shape equipment demand, manufacturing strategies, and service network configurations across the Americas, Europe, Middle East & Africa, and Asia-Pacific. In the Americas, demand favors flexible production platforms capable of supporting automotive electrification and high-performance computing, with buyers placing a premium on localized service and rapid spare parts availability to minimize downtime. Across Europe, Middle East & Africa, regulatory frameworks and advanced industrial ecosystems push suppliers to emphasize energy efficiency, emissions performance, and integration with Industry 4.0 manufacturing cells; compliance and sustainability are key decision factors for capital equipment procurement.
The Asia-Pacific region remains a focal point for volume deployment and innovation, with a dense supplier and customer base that accelerates technology adoption. Manufacturers operating in this region must balance aggressive lead-time expectations with competitive pricing while providing robust after-sales service to support high-utilization fabs and contract manufacturers. These regional variations inform where vendors field regional assembly, where they prioritize certification and regulatory support, and how they structure commercial terms to align with local financing and procurement practices.
Competitive differentiation rooted in engineering, service ecosystems and integrated process solutions that translate into customer operational advantage
Competitive positioning in the double-sides grinding market is defined by engineering depth, service reach, and the ability to integrate advanced metrology and control layers into monolithic equipment platforms. Leading suppliers differentiate through investments in spindle technology, vibration isolation, and consumable chemistry, while others build advantage via software-enabled performance guarantees and pay-per-use service models that shift capital expenditure considerations for buyers. Partnership ecosystems that combine machine suppliers with abrasives, additive process consumables, and metrology vendors are increasingly common to deliver turnkey process capability rather than standalone hardware.
Service excellence remains a critical determinant of customer retention. Vendors who offer predictive maintenance, remote troubleshooting, and regional spare parts depots reduce the operational risk for high-value production lines. At the same time, new entrants can compete on niche capabilities such as ultra-thin wafer handling, hybrid grinding-polishing sequences, or highly configurable twin head systems that enable customers to trade between throughput and footprint efficiency. The convergence of mechanical, chemical, and digital competencies will continue to re-shape competitive boundaries as buyers favor suppliers that can deliver validated process windows and rapid integration support.
High-impact strategic moves for vendors to secure durable competitive advantage through modularity, integrated metrology and resilient regional operations
Industry leaders should prioritize modular platform architectures that can be configured across wafer diameters, automation levels, and machine configurations to address diverse customer needs while driving economies of scale. Investing in integrated metrology and adaptive control algorithms will reduce cycle variability and enable predictive service offerings that increase lifetime equipment utilization. Partnering strategically with consumable and metrology specialists can accelerate time to validated process performance and lower the entry barrier for customers adopting grinding-polishing integrated systems.
In markets affected by tariff volatility, strengthening regional assembly and service footprints will mitigate supply-chain risk and enhance commercial agility. Suppliers should also develop flexible commercial models, including outcome-based contracts and financing options, to align with customer capital constraints. Finally, targeted investments in workforce training and remote diagnostic capabilities will preserve uptime and build long-term customer trust, supporting broader aftermarket revenue streams that enhance lifetime value.
Robust mixed-methods research approach combining interviews, technical validation and cross-checked vendor documentation to ensure analytical rigor
This analysis is grounded in a mixed-methods research approach that synthesizes primary interviews with senior equipment engineers, procurement leaders, and process specialists, combined with secondary technical literature and supplier documentation. The methodology emphasizes cross-validation: insights from vendor white papers and technical datasheets were triangulated with practitioner interviews to ensure that reported capabilities and claimed performance align with real-world implementation constraints. Careful attention was given to process-level variables such as abrasive selection, spindle design, and in-line metrology integration to map product capabilities to operational outcomes.
Where applicable, case examples and technology validation notes were used to illustrate how machine configuration choices affect cycle time, footprint, and consumable consumption. The research also included structured vendor scoring across engineering maturity, service reach, and digital capability to contextualize competitive positioning. Data quality was upheld through iterative review and follow-up interviews to resolve discrepancies and to capture recent product launches and service model innovations.
Synthesis and forward-looking perspective on how adaptability, service excellence and cross-industry collaboration will define future winners in the equipment market
The double-sides grinding equipment landscape is at an inflection point where engineering refinements, shifting end-use requirements, and external policy pressures are jointly accelerating the need for adaptable, service-centric equipment solutions. Suppliers that invest in modular mechanical platforms, in-line metrology, and digital service capabilities will be best positioned to convert these shifts into commercial advantage. At the same time, procurement teams must adopt a holistic view of total cost of ownership that includes service responsiveness, consumable ecosystems, and trade-policy exposure.
Looking ahead, collaboration between machine builders, consumable manufacturers, and end users will be essential to shorten process development cycles and to validate high-yield production recipes for emerging applications. The interplay between local service networks and global engineering centers will determine which suppliers can reliably support complex product ramps, particularly in markets where rapid scale-up is aligned with strategic industrial priorities. Decision-makers should treat equipment purchases not as point transactions but as partnerships that require continuous alignment of technology roadmaps and operational objectives.
Note: PDF & Excel + Online Access - 1 Year
Introduction to the rapidly evolving double-sides grinding equipment landscape driven by advanced metrology, modular design and diversified end-use demands
The silicon wafer double-sides grinding equipment sector is navigating a period of rapid technical refinement and shifting demand vectors as semiconductor, automotive, and renewable energy applications intensify requirements for surface planarity and thickness uniformity. Advances in spindle dynamics, abrasive media engineering, and real-time metrology are converging to elevate throughput while reducing total cost of ownership. As a result, machine builders and integrators are prioritizing modular architectures and tighter process controls to deliver predictable performance across an increasingly diverse set of wafer diameters and end-use specifications.
Stakeholders are responding to a more complex buyer landscape in which requirements vary from ultra-thin silicon for electric vehicle power electronics to hardened wafers for high-reliability telecommunications modules. In parallel, manufacturers are balancing capital intensity with the need to future-proof production lines through flexible automation options and interoperable control platforms. This transition creates both opportunity and pressure: suppliers that can marry high-precision mechanics with scalable automation and data-enabled service models will differentiate in performance-driven procurement environments.
How technological convergence, shifting end-user specifications and automation choices are reshaping supplier strategies and equipment design imperatives
The industry is experiencing transformative shifts driven by technological innovation, changing customer requirements, and supply-chain resilience strategies. Precision has emerged as a strategic differentiator rather than a technical checkbox, pushing manufacturers toward multi-axis control, adaptive abrasive deposition, and integrated in-line metrology that detect and correct process deviations in real time. These capabilities shorten cycle times and reduce rework, which bears directly on unit economics and adoption within high-mix, low-volume production environments.
Concurrently, demand-side evolution is reshaping product roadmaps: electric vehicle powertrains and advanced driver-assistance systems impose tighter thickness and flatness specifications, while consumer electronics require rapid changeovers to accommodate shorter product life cycles. Automation levels are also shifting; adoption of fully automatic systems is accelerating in high-throughput fabs, while semi-automatic and manual configurations retain relevance where customization and lower capital outlay are priorities. These dynamics encourage suppliers to offer configurable platforms that can scale from pilot lines to full production suites, and to pair mechanical upgrades with predictive maintenance and remote diagnostics to extend equipment uptime and lower operational risk.
Implications of 2025 tariff adjustments on procurement strategies, supplier localization, and resilient sourcing for capital equipment investments
Trade policies and tariff adjustments in 2025 have introduced new considerations for procurement strategy, supplier selection, and capital investment timing. Tariff changes have amplified the need for geographically diversified sourcing and have encouraged end users to re-evaluate total landed cost rather than purchase price alone. In some instances, higher import duties have motivated strategic localization of key manufacturing steps or the negotiation of alternative supply routes to preserve lead times and protect critical capacity.
These policy shifts have a cascading effect on equipment vendors and system integrators. Vendors with established local service networks and regional assembly capabilities are positioned to mitigate tariff exposure for customers, while those heavily reliant on cross-border supply chains must adapt by increasing inventory buffers or qualifying alternate component sources. The result is a renewed emphasis on supplier resilience, contractual flexibility, and transparent cost modeling that allows buyers to quantify tariff-related impacts across procurement cycles and prioritize investments that deliver long-term stability over short-term cost advantages.
Actionable segmentation intelligence that links wafer diameter, automation level, industry end-use, machine configuration and process type to buyer value drivers
Segmentation insights reveal where performance requirements and buyer preferences diverge, guiding tailored product development and go-to-market strategies. When wafers are categorized by diameter, stakeholders design process flows and tooling for 150mm, 200mm, and 300mm wafers, each with distinct handling, chucking, and throughput implications. Automation level segmentation separates fully automatic, manual, and semi-automatic systems, reflecting a gradient between throughput demands and flexibility needs that informs control system design and human-machine interface investments.
End-user industry segmentation highlights differentiated technical priorities: automotive applications, which include both electric vehicles and traditional vehicles, emphasize durability and thermal management; consumer electronics, spanning computing devices, mobile devices, and wearables, favor rapid changeover and high-volume repeatability; solar applications, divided into crystalline and thin-film processes, demand large-area flatness and contamination control; telecommunications customers prioritize signal integrity and defect minimization. Machine configuration segmentation differentiates multi head, single head, and twin head architectures, with single head systems further characterized by horizontal and vertical orientations and twin head systems offering adjustable spindle or fixed spindle variants, each affecting cycle time and layout flexibility. Process type segmentation distinguishes grinding-only systems from grinding-polishing integrated platforms, and the latter includes chemical mechanical polishing and mechanical polishing process routes, indicating varying consumable, waste-handling, and metrology requirements.
Together, these segmentation lenses enable suppliers to map feature sets to customer value drivers, prioritize R&D investments in spindle stabilization or in-line metrology, and craft service offers aligned to the operational realities of each buyer cohort.
Regional dynamics and procurement nuances across the Americas, Europe Middle East & Africa and Asia-Pacific that determine deployment and service priorities
Regional dynamics continue to shape equipment demand, manufacturing strategies, and service network configurations across the Americas, Europe, Middle East & Africa, and Asia-Pacific. In the Americas, demand favors flexible production platforms capable of supporting automotive electrification and high-performance computing, with buyers placing a premium on localized service and rapid spare parts availability to minimize downtime. Across Europe, Middle East & Africa, regulatory frameworks and advanced industrial ecosystems push suppliers to emphasize energy efficiency, emissions performance, and integration with Industry 4.0 manufacturing cells; compliance and sustainability are key decision factors for capital equipment procurement.
The Asia-Pacific region remains a focal point for volume deployment and innovation, with a dense supplier and customer base that accelerates technology adoption. Manufacturers operating in this region must balance aggressive lead-time expectations with competitive pricing while providing robust after-sales service to support high-utilization fabs and contract manufacturers. These regional variations inform where vendors field regional assembly, where they prioritize certification and regulatory support, and how they structure commercial terms to align with local financing and procurement practices.
Competitive differentiation rooted in engineering, service ecosystems and integrated process solutions that translate into customer operational advantage
Competitive positioning in the double-sides grinding market is defined by engineering depth, service reach, and the ability to integrate advanced metrology and control layers into monolithic equipment platforms. Leading suppliers differentiate through investments in spindle technology, vibration isolation, and consumable chemistry, while others build advantage via software-enabled performance guarantees and pay-per-use service models that shift capital expenditure considerations for buyers. Partnership ecosystems that combine machine suppliers with abrasives, additive process consumables, and metrology vendors are increasingly common to deliver turnkey process capability rather than standalone hardware.
Service excellence remains a critical determinant of customer retention. Vendors who offer predictive maintenance, remote troubleshooting, and regional spare parts depots reduce the operational risk for high-value production lines. At the same time, new entrants can compete on niche capabilities such as ultra-thin wafer handling, hybrid grinding-polishing sequences, or highly configurable twin head systems that enable customers to trade between throughput and footprint efficiency. The convergence of mechanical, chemical, and digital competencies will continue to re-shape competitive boundaries as buyers favor suppliers that can deliver validated process windows and rapid integration support.
High-impact strategic moves for vendors to secure durable competitive advantage through modularity, integrated metrology and resilient regional operations
Industry leaders should prioritize modular platform architectures that can be configured across wafer diameters, automation levels, and machine configurations to address diverse customer needs while driving economies of scale. Investing in integrated metrology and adaptive control algorithms will reduce cycle variability and enable predictive service offerings that increase lifetime equipment utilization. Partnering strategically with consumable and metrology specialists can accelerate time to validated process performance and lower the entry barrier for customers adopting grinding-polishing integrated systems.
In markets affected by tariff volatility, strengthening regional assembly and service footprints will mitigate supply-chain risk and enhance commercial agility. Suppliers should also develop flexible commercial models, including outcome-based contracts and financing options, to align with customer capital constraints. Finally, targeted investments in workforce training and remote diagnostic capabilities will preserve uptime and build long-term customer trust, supporting broader aftermarket revenue streams that enhance lifetime value.
Robust mixed-methods research approach combining interviews, technical validation and cross-checked vendor documentation to ensure analytical rigor
This analysis is grounded in a mixed-methods research approach that synthesizes primary interviews with senior equipment engineers, procurement leaders, and process specialists, combined with secondary technical literature and supplier documentation. The methodology emphasizes cross-validation: insights from vendor white papers and technical datasheets were triangulated with practitioner interviews to ensure that reported capabilities and claimed performance align with real-world implementation constraints. Careful attention was given to process-level variables such as abrasive selection, spindle design, and in-line metrology integration to map product capabilities to operational outcomes.
Where applicable, case examples and technology validation notes were used to illustrate how machine configuration choices affect cycle time, footprint, and consumable consumption. The research also included structured vendor scoring across engineering maturity, service reach, and digital capability to contextualize competitive positioning. Data quality was upheld through iterative review and follow-up interviews to resolve discrepancies and to capture recent product launches and service model innovations.
Synthesis and forward-looking perspective on how adaptability, service excellence and cross-industry collaboration will define future winners in the equipment market
The double-sides grinding equipment landscape is at an inflection point where engineering refinements, shifting end-use requirements, and external policy pressures are jointly accelerating the need for adaptable, service-centric equipment solutions. Suppliers that invest in modular mechanical platforms, in-line metrology, and digital service capabilities will be best positioned to convert these shifts into commercial advantage. At the same time, procurement teams must adopt a holistic view of total cost of ownership that includes service responsiveness, consumable ecosystems, and trade-policy exposure.
Looking ahead, collaboration between machine builders, consumable manufacturers, and end users will be essential to shorten process development cycles and to validate high-yield production recipes for emerging applications. The interplay between local service networks and global engineering centers will determine which suppliers can reliably support complex product ramps, particularly in markets where rapid scale-up is aligned with strategic industrial priorities. Decision-makers should treat equipment purchases not as point transactions but as partnerships that require continuous alignment of technology roadmaps and operational objectives.
Note: PDF & Excel + Online Access - 1 Year
Table of Contents
187 Pages
- 1. Preface
- 1.1. Objectives of the Study
- 1.2. Market Definition
- 1.3. Market Segmentation & Coverage
- 1.4. Years Considered for the Study
- 1.5. Currency Considered for the Study
- 1.6. Language Considered for the Study
- 1.7. Key Stakeholders
- 2. Research Methodology
- 2.1. Introduction
- 2.2. Research Design
- 2.2.1. Primary Research
- 2.2.2. Secondary Research
- 2.3. Research Framework
- 2.3.1. Qualitative Analysis
- 2.3.2. Quantitative Analysis
- 2.4. Market Size Estimation
- 2.4.1. Top-Down Approach
- 2.4.2. Bottom-Up Approach
- 2.5. Data Triangulation
- 2.6. Research Outcomes
- 2.7. Research Assumptions
- 2.8. Research Limitations
- 3. Executive Summary
- 3.1. Introduction
- 3.2. CXO Perspective
- 3.3. Market Size & Growth Trends
- 3.4. Market Share Analysis, 2025
- 3.5. FPNV Positioning Matrix, 2025
- 3.6. New Revenue Opportunities
- 3.7. Next-Generation Business Models
- 3.8. Industry Roadmap
- 4. Market Overview
- 4.1. Introduction
- 4.2. Industry Ecosystem & Value Chain Analysis
- 4.2.1. Supply-Side Analysis
- 4.2.2. Demand-Side Analysis
- 4.2.3. Stakeholder Analysis
- 4.3. Porter’s Five Forces Analysis
- 4.4. PESTLE Analysis
- 4.5. Market Outlook
- 4.5.1. Near-Term Market Outlook (0–2 Years)
- 4.5.2. Medium-Term Market Outlook (3–5 Years)
- 4.5.3. Long-Term Market Outlook (5–10 Years)
- 4.6. Go-to-Market Strategy
- 5. Market Insights
- 5.1. Consumer Insights & End-User Perspective
- 5.2. Consumer Experience Benchmarking
- 5.3. Opportunity Mapping
- 5.4. Distribution Channel Analysis
- 5.5. Pricing Trend Analysis
- 5.6. Regulatory Compliance & Standards Framework
- 5.7. ESG & Sustainability Analysis
- 5.8. Disruption & Risk Scenarios
- 5.9. Return on Investment & Cost-Benefit Analysis
- 6. Cumulative Impact of United States Tariffs 2025
- 7. Cumulative Impact of Artificial Intelligence 2025
- 8. Silicon Wafer Double-sides Grinding Machines Market, by Machine Configuration
- 8.1. Horizontal Double-Disc
- 8.1.1. Single Platen
- 8.1.2. Multiple Platen
- 8.2. Vertical Double-Disc
- 8.2.1. Compact Footprint
- 8.2.2. Large Footprint
- 8.3. Planetary Carrier Type
- 8.3.1. Inner Diameter Carrier
- 8.3.2. Outer Diameter Carrier
- 8.4. Custom And Hybrid Systems
- 9. Silicon Wafer Double-sides Grinding Machines Market, by Wafer Diameter
- 9.1. 150Mm
- 9.2. 200Mm
- 9.3. 300Mm
- 10. Silicon Wafer Double-sides Grinding Machines Market, by Automation Level
- 10.1. Fully Automatic
- 10.2. Manual
- 10.3. Semi Automatic
- 11. Silicon Wafer Double-sides Grinding Machines Market, by Process Type
- 11.1. Grinding Only
- 11.2. Grinding Polishing Integrated
- 11.2.1. Chemical Mechanical Polishing
- 11.2.2. Mechanical Polishing
- 12. Silicon Wafer Double-sides Grinding Machines Market, by End-User Industry
- 12.1. Automotive
- 12.1.1. Electric Vehicles
- 12.1.2. Traditional Vehicles
- 12.2. Consumer Electronics
- 12.2.1. Computing Devices
- 12.2.2. Mobile Devices
- 12.2.3. Wearables
- 12.3. Solar
- 12.3.1. Crystalline
- 12.3.2. Thin Film
- 12.4. Telecommunications
- 13. Silicon Wafer Double-sides Grinding Machines Market, by Region
- 13.1. Americas
- 13.1.1. North America
- 13.1.2. Latin America
- 13.2. Europe, Middle East & Africa
- 13.2.1. Europe
- 13.2.2. Middle East
- 13.2.3. Africa
- 13.3. Asia-Pacific
- 14. Silicon Wafer Double-sides Grinding Machines Market, by Group
- 14.1. ASEAN
- 14.2. GCC
- 14.3. European Union
- 14.4. BRICS
- 14.5. G7
- 14.6. NATO
- 15. Silicon Wafer Double-sides Grinding Machines Market, by Country
- 15.1. United States
- 15.2. Canada
- 15.3. Mexico
- 15.4. Brazil
- 15.5. United Kingdom
- 15.6. Germany
- 15.7. France
- 15.8. Russia
- 15.9. Italy
- 15.10. Spain
- 15.11. China
- 15.12. India
- 15.13. Japan
- 15.14. Australia
- 15.15. South Korea
- 16. United States Silicon Wafer Double-sides Grinding Machines Market
- 17. China Silicon Wafer Double-sides Grinding Machines Market
- 18. Competitive Landscape
- 18.1. Market Concentration Analysis, 2025
- 18.1.1. Concentration Ratio (CR)
- 18.1.2. Herfindahl Hirschman Index (HHI)
- 18.2. Recent Developments & Impact Analysis, 2025
- 18.3. Product Portfolio Analysis, 2025
- 18.4. Benchmarking Analysis, 2025
- 18.5. Daitron, Inc.
- 18.6. DISCO Corporation
- 18.7. ENGIS Corporation
- 18.8. Hangzhou Xiantuo Precision Technology Co., Ltd.
- 18.9. Hunan Yujing Machine Industrial Co., Ltd.
- 18.10. Joen Lih Machinery Co., Ltd.
- 18.11. JTEKT Corporation
- 18.12. Koyo Machinery Co., Ltd.
- 18.13. Lapmaster Wolters, Inc.
- 18.14. Nanjing Sanjia Precision Machinery Co., Ltd.
- 18.15. Okamoto Machine Tool Works, Ltd.
- 18.16. Qingdao Gaoce Technology Co., Ltd.
- 18.17. Revasum, Inc.
- 18.18. Seibu Giken DST Co., Ltd.
- 18.19. Shenzhen Fangda Machinery Co., Ltd.
- 18.20. SpeedFam Co., Ltd.
- 18.21. Strasbaugh, Inc.
- 18.22. Taian Tools Co., Ltd.
- 18.23. TDG-Nissin Precision Machinery Co., Ltd.
- 18.24. Tokyo Seimitsu Co., Ltd.
- 18.25. Vertex Systems Co., Ltd.
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