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Semiconductor & IC Packaging Materials Market by Type (Bonding wires, Ceramic Packages, Die Attach Materials), Technology (Dual Flat No-leads, Dual-in-line, Grid Array), End-use - Global Forecast 2024-2030

Publisher 360iResearch
Published Apr 17, 2024
Length 186 Pages
SKU # IRE18713678

Description

Semiconductor & IC Packaging Materials Market by Type (Bonding wires, Ceramic Packages, Die Attach Materials), Technology (Dual Flat No-leads, Dual-in-line, Grid Array), End-use - Global Forecast 2024-2030


The Semiconductor & IC Packaging Materials Market size was estimated at USD 38.44 billion in 2023 and expected to reach USD 42.16 billion in 2024, at a CAGR 10.35% to reach USD 76.64 billion by 2030.

Semiconductor and Integrated Circuit (IC) packaging materials include a broad range of substances and components used to encase and protect electronic circuits or semiconductors. These materials serve as a physical shield and play critical roles in heat dissipation, electrical insulation, and enhancing the reliability and performance of the semiconductors. The expansion in their use is primarily driven by the burgeoning demand for consumer electronics, telecommunications equipment, and automotive electronics. As technology advances and electronic devices become more compact and powerful, the need for efficient, durable, and heat-resistant packaging materials has escalated. However, the industry faces challenges, notably concerning the environmental impact of some packaging materials and the quest for materials that can withstand increasingly high temperatures and harsh operating conditions. Addressing these disadvantages requires ongoing research and development to discover more sustainable materials and innovative packaging techniques that reduce waste and enhance performance. Nevertheless, the advent of 5G technology, the Internet of Things (IoT), artificial intelligence (AI), and the increasing adoption of electric vehicles (EVs) are expected to spur further growth. Moreover, the drive towards miniaturized devices with higher computing power signals a growing demand for advanced packaging solutions that can accommodate these trends. Innovations in materials science, such as the development of eco-friendly and high thermal conductivity materials, are poised to open new avenues for industry expansion, catering to the evolving needs of the technology landscape.



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Table of Contents

186 Pages
1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Stakeholders
2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update
3. Executive Summary
4. Market Overview
5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Rising demand for semiconductor and IC packaging materials for consumer electronics
5.1.1.2. Relentless advancement in technology supporting innovative packaging materials
5.1.1.3. Growing miniaturization and densification in electronic sector
5.1.2. Restraints
5.1.2.1. IP Concerns of semiconductor industry in outsourcing and testing
5.1.3. Opportunities
5.1.3.1. Integration with advance technologies
5.1.3.2. Adoption of 5G and autonomous vehicles
5.1.4. Challenges
5.1.4.1. Increasing environmental regulations regarding the use and disposal of materials
5.2. Market Segmentation Analysis
5.2.1. Type: Suitability of ceramic packages for high-performance and high-reliability applications
5.2.2. End-use: Proliferation in consumer electronics for excellent electrical insulation and good thermal management
5.3. Market Disruption Analysis
5.4. Porter’s Five Forces Analysis
5.4.1. Threat of New Entrants
5.4.2. Threat of Substitutes
5.4.3. Bargaining Power of Customers
5.4.4. Bargaining Power of Suppliers
5.4.5. Industry Rivalry
5.5. Value Chain & Critical Path Analysis
5.6. Pricing Analysis
5.7. Technology Analysis
5.8. Patent Analysis
5.9. Trade Analysis
5.10. Regulatory Framework Analysis
6. Semiconductor & IC Packaging Materials Market, by Type
6.1. Introduction
6.2. Bonding wires
6.3. Ceramic Packages
6.4. Die Attach Materials
6.5. Encapsulation Resins
6.6. Leadframes
6.7. Organic substrate
6.8. Solder Balls
6.9. Thermal Interface Materials
7. Semiconductor & IC Packaging Materials Market, by Technology
7.1. Introduction
7.2. Dual Flat No-leads
7.3. Dual-in-line
7.4. Grid Array
7.5. Quad Flat no-leads
7.6. Quad Flat Packages
7.7. Small Outline Package
8. Semiconductor & IC Packaging Materials Market, by End-use
8.1. Introduction
8.2. Aerospace & Defense
8.3. Automotive
8.4. Consumer Electronics
8.5. Healthcare
8.6. IT & Telecommunication
9. Americas Semiconductor & IC Packaging Materials Market
9.1. Introduction
9.2. Argentina
9.3. Brazil
9.4. Canada
9.5. Mexico
9.6. United States
10. Asia-Pacific Semiconductor & IC Packaging Materials Market
10.1. Introduction
10.2. Australia
10.3. China
10.4. India
10.5. Indonesia
10.6. Japan
10.7. Malaysia
10.8. Philippines
10.9. Singapore
10.10. South Korea
10.11. Taiwan
10.12. Thailand
10.13. Vietnam
11. Europe, Middle East & Africa Semiconductor & IC Packaging Materials Market
11.1. Introduction
11.2. Denmark
11.3. Egypt
11.4. Finland
11.5. France
11.6. Germany
11.7. Israel
11.8. Italy
11.9. Netherlands
11.10. Nigeria
11.11. Norway
11.12. Poland
11.13. Qatar
11.14. Russia
11.15. Saudi Arabia
11.16. South Africa
11.17. Spain
11.18. Sweden
11.19. Switzerland
11.20. Turkey
11.21. United Arab Emirates
11.22. United Kingdom
12. Competitive Landscape
12.1. Market Share Analysis, 2023
12.2. FPNV Positioning Matrix, 2023
12.3. Competitive Scenario Analysis
12.3.1. Amkor and Apple Forge Strategic Alliance to Build Largest Advanced Semiconductor Packaging Facility
12.3.2. Resonac Sets Foundation for Semiconductor Innovation with New Packaging Solution Center in Silicon Valley
12.3.3. Strategic Expansion and Innovation in Semiconductor Packaging
12.4. Strategy Analysis & Recommendation
13. Competitive Portfolio
13.1. Key Company Profiles
13.2. Key Product Portfolio
FIGURE 1. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET RESEARCH PROCESS
FIGURE 2. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2023 VS 2030
FIGURE 3. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2018-2030 (USD MILLION)
FIGURE 4. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY REGION, 2023 VS 2030 (%)
FIGURE 5. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 6. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET DYNAMICS
FIGURE 7. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2023 VS 2030 (%)
FIGURE 8. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 9. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2023 VS 2030 (%)
FIGURE 10. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 11. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2023 VS 2030 (%)
FIGURE 12. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 13. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
FIGURE 14. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 15. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY STATE, 2023 VS 2030 (%)
FIGURE 16. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 17. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
FIGURE 18. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 19. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
FIGURE 20. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 21. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SHARE, BY KEY PLAYER, 2023
FIGURE 22. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, FPNV POSITIONING MATRIX, 2023

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