Positive Photoresists Market by Resist Type (Chemically Amplified, DNQ Novolak), Process Type (ArF, EUV, I-Line), Thickness Range, Application, End Use Industry - Global Forecast 2026-2032
Description
The Positive Photoresists Market was valued at USD 2.19 billion in 2025 and is projected to grow to USD 2.32 billion in 2026, with a CAGR of 6.61%, reaching USD 3.44 billion by 2032.
A clear and authoritative introduction that frames positive photoresists as critical enablers of lithographic performance, supply resilience, and device innovation
Positive photoresists are a foundational material technology enabling pattern transfer at the heart of modern microfabrication. These chemistries drive the lithographic steps that define device geometry, yield, and scaling across semiconductor manufacturing, printed circuit boards, MEMS, and microfluidic devices. Over the last decade, improvements in resist chemistry, process integration, and tool compatibility have supported transitions to finer nodes, immersion lithography modalities, and expanded application footprints beyond conventional logic and memory devices.
Introducing this executive summary, the objective is to synthesize technical trends, supply chain considerations, segmentation dynamics, and regional strategic implications into a concise reference for senior decision-makers. The focus is on actionable intelligence that connects resist selection to downstream performance metrics such as line-edge roughness, defectivity control, and process window robustness. By framing resist technology within the context of process types, thickness demands, and end-use requirements, readers will gain a clear understanding of where investments, qualification efforts, and collaborative development will deliver the greatest operational leverage.
An analysis of the transformative technological and supply-chain shifts reshaping positive photoresist requirements and supplier collaboration models
The landscape for positive photoresists is undergoing transformative shifts driven by concurrent technological and supply-chain forces. Advances in lithography, notably the broader industrial adoption of extreme ultraviolet processes and continued refinement of ArF immersion techniques, are elevating performance demands on resist chemistries. At the same time, applications such as heterogeneous integration, advanced packaging, and high-density interconnect PCBs are placing new constraints on thickness ranges and post-exposure process compatibility.
Concurrently, suppliers are evolving product portfolios to address divergent needs: chemically amplified resists for ultra-fine patterning and DNQ novolak systems for thicker-film, high-aspect applications. This bifurcation in product development reflects a strategic focus on both high-resolution logic and memory nodes, and on robust solutions for MEMS, microfluidics, and packaging environments. As manufacturing ecosystems diversify, partnerships between material suppliers, foundries, and equipment vendors are shifting from transactional supply to co-development agreements that accelerate qualifications and tailor chemistries to specific fab toolsets and process recipes.
A comprehensive assessment of how United States tariff dynamics in 2025 could alter cost structures, supplier selection, and qualification timelines across positive photoresist supply chains
Evolving trade policies and tariff measures can have material ripple effects across specialty chemical supply chains, and hypothetical or enacted tariff actions in 2025 require careful scenario planning. Tariffs increase landed costs for imported resist raw materials and finished products, which can compress supplier margins and incentivize regional sourcing alternatives. For manufacturers that rely on cross-border supply of advanced resist chemistries or precursor monomers, this dynamic may accelerate nearshoring and the establishment of regional production capacity to control input cost volatility and maintain delivery reliability.
Beyond direct cost impacts, tariffs can affect qualification timelines and supplier selection. When alternate suppliers are sought to avoid tariff exposure, qualification workloads rise because new chemistries and formulations must be validated for critical metrics such as line-edge roughness, throughput compatibility, and defect density. For capital-intensive fabs and assembly operations, even modest procurement cost shifts can change total cost of ownership calculations over multiyear capacity plans. Therefore, procurement teams should integrate tariff scenario analysis into supplier risk assessments and prioritize contractual terms that include contingency clauses for trade-policy driven cost changes.
Critical segmentation insights explaining how resist chemistries, applications, process types, thickness demands, and end-use industries determine qualification and procurement priorities
Segmentation delivers clarity on performance expectations and qualification pathways by aligning resist families, application requirements, and process constraints. Based on resist type, the market separates into chemically amplified formulations that drive high-resolution patterning and DNQ novolak systems suited to thicker films and specific post-exposure processing needs. Based on application, end-use demands range from MEMS devices and microfluidics with specialized topography and material compatibility requirements, to printed circuit boards where coating uniformity and adhesion dominate, and to semiconductor manufacturing where foundry services, logic and memory customers impose the most aggressive lithographic precision and defectivity thresholds.
Based on end use industry, adoption patterns differ: automotive electronics prioritize reliability and thermal robustness, flat panel display manufacturing emphasizes large-area uniformity and process throughput, advanced packaging demands thin-film and overlay performance, while the semiconductor industry requires both node-specific resolution and supply continuity. Based on process type, photoresist selection is informed by the lithography platform: ArF processes-subdivided into dry and immersion modalities-remain prevalent for many logic and memory flows, while EUV continues to push chemical sensitivity and outgassing considerations, and I-line and KrF retain roles in legacy and thick-resist applications. Based on thickness range, formulation targets span greater than five micrometers for high-aspect structures, less than one micrometer for cutting-edge patterning, and one to five micrometers where intermediate mechanical and optical properties are balanced.
A strategic regional assessment revealing how Americas, Europe Middle East & Africa, and Asia-Pacific dynamics influence supply priorities, qualification, and sustainability expectations
Regional dynamics shape how suppliers, fabs, and assemblers prioritize investments in capacity, R&D, and logistics. In the Americas, a focus on foundry partnerships, advanced packaging pilot lines, and a growing appetite for localized supply has produced demand for resists that can be rapidly qualified across diverse toolsets and environmental conditions. This region also emphasizes supplier contracts that hedge against trade-policy volatility and support long-term tech transfer agreements to secure continuity.
In Europe, Middle East & Africa, regulatory compliance, sustainability requirements, and established specialty chemical expertise inform procurement decisions. Manufacturers and assemblers in this region often demand transparency on raw material sourcing, solvent recovery pathways, and lifecycle impacts, which influences the uptake of alternative solvent systems and rework protocols. In the Asia-Pacific region, concentration of high-volume semiconductor fabs, foundry services, and display manufacturing drives a dual need for high-performance chemically amplified resists for leading-edge nodes and robust DNQ novolak and thicker film solutions for packaging and display lines. Capacity constraints, supplier lead times, and advanced node roadmaps in Asia-Pacific make rapid qualification and supply predictability a strategic priority for regional players.
Insightful company-level analysis showing how technical innovation, capacity deployment, and customer-centric services create competitive advantage for positive photoresist suppliers
Key company behaviours demonstrate how technical leadership, supply reliability, and commercial agility intersect in the positive photoresist ecosystem. Leading materials producers are investing in formulation science to balance sensitivity, resolution, and line-edge roughness while also expanding global manufacturing footprints to address lead-time pressures. Strategic moves include selective capacity expansion near major fab clusters, co-development programs with foundries and packaging specialists, and investments in analytics and process modeling to reduce qualification cycles for customers.
Supply-side competition is increasingly driven by the ability to deliver consistent quality at scale while supporting customers through qualification, troubleshooting, and yield ramp activities. Firms that integrate advanced analytical capabilities, such as comprehensive defectivity screening and photoresist outgassing analysis for EUV environments, gain adoption advantages. At the same time, companies that offer modular supply agreements, technical service bundles, and collaborative roadmaps for next-generation resist needs position themselves as preferred partners for both mature fabs and emerging fabrication hubs.
Actionable recommendations for industry leaders to secure supply resilience, accelerate resist qualification, and align procurement with technical and sustainability priorities
Industry leaders should adopt a proactive approach that fuses technical, commercial, and risk-management measures to protect throughput and accelerate innovation. Begin by prioritizing supplier diversification strategies that maintain technical equivalence while minimizing qualification overhead. Establish collaborative development agreements that include shared validation protocols, joint test wafers, and clear data-sharing arrangements to reduce time to approval and align roadmaps for novel chemistries.
Parallel to supplier strategies, invest in internal capability development: strengthen in-house lithography characterization skills, allocate pilot-lot capacity for rapid turn qualification, and build laboratory capabilities to evaluate sensitivity, outgassing, and defectivity under realistic process conditions. Procurement teams should negotiate flexible contract terms that include pass-through clauses for trade-policy events and options for regionalized supply. Finally, sustainability and regulatory compliance must be embedded into supplier scorecards to future-proof operations against tightening environmental requirements and to support long-term customer commitments.
A transparent methodology combining primary interviews, cross-site laboratory testing, and supply-chain mapping to ensure reproducible and actionable findings across positive photoresist technologies
The research methodology integrates primary interviews, laboratory-level technical analysis, and supply-chain mapping to produce robust, verifiable findings. Primary research included structured interviews with technical leaders from fabrication facilities, packaging specialists, and materials suppliers to capture real-world qualification experiences, defect trends, and procurement practices. These interviews were supplemented by laboratory data analysis focusing on resist sensitivity curves, contrast, resolution performance, and defectivity metrics gathered from cross-site evaluations.
Secondary research consisted of reviewing peer-reviewed literature, standards documents, and equipment vendor technical notes to contextualize observed trends and validate experimental protocols. Supply-chain mapping examined raw material flows, regional capacity distributions, and logistic constraints to identify potential bottlenecks. Data synthesis employed triangulation across sources and sensitivity analysis to ensure that conclusions reflect consensus technical observations rather than single-source anomalies. The methodological approach emphasizes reproducibility and traceability, and technical annexes document protocols, test conditions, and interview frameworks used in the study.
A decisive conclusion that synthesizes technical imperatives, supply resilience measures, and strategic priorities for organizations engaged with positive photoresists
Positive photoresists remain a core enabler of microfabrication advances, but the pathway to sustained performance and supply resilience demands coordinated action across chemistry, process, and procurement domains. The convergence of advanced lithography modalities, evolving application demands, and geopolitical trade dynamics underscores the need for flexible supply arrangements, accelerated qualification frameworks, and targeted R&D investments. Moving forward, manufacturers that align formulation development with specific process platforms and that invest in rapid qualification capabilities will reduce time to yield and gain competitive advantage.
In conclusion, the strategic challenge is to translate material-level innovation into predictable, manufacturable outcomes at scale. By focusing on supplier collaboration, diversified sourcing, and enhanced internal capability in lithographic characterization, organizations can mitigate near-term policy risks and position themselves to capture opportunities arising from packaging innovation, MEMS expansion, and next-generation semiconductor nodes.
Note: PDF & Excel + Online Access - 1 Year
A clear and authoritative introduction that frames positive photoresists as critical enablers of lithographic performance, supply resilience, and device innovation
Positive photoresists are a foundational material technology enabling pattern transfer at the heart of modern microfabrication. These chemistries drive the lithographic steps that define device geometry, yield, and scaling across semiconductor manufacturing, printed circuit boards, MEMS, and microfluidic devices. Over the last decade, improvements in resist chemistry, process integration, and tool compatibility have supported transitions to finer nodes, immersion lithography modalities, and expanded application footprints beyond conventional logic and memory devices.
Introducing this executive summary, the objective is to synthesize technical trends, supply chain considerations, segmentation dynamics, and regional strategic implications into a concise reference for senior decision-makers. The focus is on actionable intelligence that connects resist selection to downstream performance metrics such as line-edge roughness, defectivity control, and process window robustness. By framing resist technology within the context of process types, thickness demands, and end-use requirements, readers will gain a clear understanding of where investments, qualification efforts, and collaborative development will deliver the greatest operational leverage.
An analysis of the transformative technological and supply-chain shifts reshaping positive photoresist requirements and supplier collaboration models
The landscape for positive photoresists is undergoing transformative shifts driven by concurrent technological and supply-chain forces. Advances in lithography, notably the broader industrial adoption of extreme ultraviolet processes and continued refinement of ArF immersion techniques, are elevating performance demands on resist chemistries. At the same time, applications such as heterogeneous integration, advanced packaging, and high-density interconnect PCBs are placing new constraints on thickness ranges and post-exposure process compatibility.
Concurrently, suppliers are evolving product portfolios to address divergent needs: chemically amplified resists for ultra-fine patterning and DNQ novolak systems for thicker-film, high-aspect applications. This bifurcation in product development reflects a strategic focus on both high-resolution logic and memory nodes, and on robust solutions for MEMS, microfluidics, and packaging environments. As manufacturing ecosystems diversify, partnerships between material suppliers, foundries, and equipment vendors are shifting from transactional supply to co-development agreements that accelerate qualifications and tailor chemistries to specific fab toolsets and process recipes.
A comprehensive assessment of how United States tariff dynamics in 2025 could alter cost structures, supplier selection, and qualification timelines across positive photoresist supply chains
Evolving trade policies and tariff measures can have material ripple effects across specialty chemical supply chains, and hypothetical or enacted tariff actions in 2025 require careful scenario planning. Tariffs increase landed costs for imported resist raw materials and finished products, which can compress supplier margins and incentivize regional sourcing alternatives. For manufacturers that rely on cross-border supply of advanced resist chemistries or precursor monomers, this dynamic may accelerate nearshoring and the establishment of regional production capacity to control input cost volatility and maintain delivery reliability.
Beyond direct cost impacts, tariffs can affect qualification timelines and supplier selection. When alternate suppliers are sought to avoid tariff exposure, qualification workloads rise because new chemistries and formulations must be validated for critical metrics such as line-edge roughness, throughput compatibility, and defect density. For capital-intensive fabs and assembly operations, even modest procurement cost shifts can change total cost of ownership calculations over multiyear capacity plans. Therefore, procurement teams should integrate tariff scenario analysis into supplier risk assessments and prioritize contractual terms that include contingency clauses for trade-policy driven cost changes.
Critical segmentation insights explaining how resist chemistries, applications, process types, thickness demands, and end-use industries determine qualification and procurement priorities
Segmentation delivers clarity on performance expectations and qualification pathways by aligning resist families, application requirements, and process constraints. Based on resist type, the market separates into chemically amplified formulations that drive high-resolution patterning and DNQ novolak systems suited to thicker films and specific post-exposure processing needs. Based on application, end-use demands range from MEMS devices and microfluidics with specialized topography and material compatibility requirements, to printed circuit boards where coating uniformity and adhesion dominate, and to semiconductor manufacturing where foundry services, logic and memory customers impose the most aggressive lithographic precision and defectivity thresholds.
Based on end use industry, adoption patterns differ: automotive electronics prioritize reliability and thermal robustness, flat panel display manufacturing emphasizes large-area uniformity and process throughput, advanced packaging demands thin-film and overlay performance, while the semiconductor industry requires both node-specific resolution and supply continuity. Based on process type, photoresist selection is informed by the lithography platform: ArF processes-subdivided into dry and immersion modalities-remain prevalent for many logic and memory flows, while EUV continues to push chemical sensitivity and outgassing considerations, and I-line and KrF retain roles in legacy and thick-resist applications. Based on thickness range, formulation targets span greater than five micrometers for high-aspect structures, less than one micrometer for cutting-edge patterning, and one to five micrometers where intermediate mechanical and optical properties are balanced.
A strategic regional assessment revealing how Americas, Europe Middle East & Africa, and Asia-Pacific dynamics influence supply priorities, qualification, and sustainability expectations
Regional dynamics shape how suppliers, fabs, and assemblers prioritize investments in capacity, R&D, and logistics. In the Americas, a focus on foundry partnerships, advanced packaging pilot lines, and a growing appetite for localized supply has produced demand for resists that can be rapidly qualified across diverse toolsets and environmental conditions. This region also emphasizes supplier contracts that hedge against trade-policy volatility and support long-term tech transfer agreements to secure continuity.
In Europe, Middle East & Africa, regulatory compliance, sustainability requirements, and established specialty chemical expertise inform procurement decisions. Manufacturers and assemblers in this region often demand transparency on raw material sourcing, solvent recovery pathways, and lifecycle impacts, which influences the uptake of alternative solvent systems and rework protocols. In the Asia-Pacific region, concentration of high-volume semiconductor fabs, foundry services, and display manufacturing drives a dual need for high-performance chemically amplified resists for leading-edge nodes and robust DNQ novolak and thicker film solutions for packaging and display lines. Capacity constraints, supplier lead times, and advanced node roadmaps in Asia-Pacific make rapid qualification and supply predictability a strategic priority for regional players.
Insightful company-level analysis showing how technical innovation, capacity deployment, and customer-centric services create competitive advantage for positive photoresist suppliers
Key company behaviours demonstrate how technical leadership, supply reliability, and commercial agility intersect in the positive photoresist ecosystem. Leading materials producers are investing in formulation science to balance sensitivity, resolution, and line-edge roughness while also expanding global manufacturing footprints to address lead-time pressures. Strategic moves include selective capacity expansion near major fab clusters, co-development programs with foundries and packaging specialists, and investments in analytics and process modeling to reduce qualification cycles for customers.
Supply-side competition is increasingly driven by the ability to deliver consistent quality at scale while supporting customers through qualification, troubleshooting, and yield ramp activities. Firms that integrate advanced analytical capabilities, such as comprehensive defectivity screening and photoresist outgassing analysis for EUV environments, gain adoption advantages. At the same time, companies that offer modular supply agreements, technical service bundles, and collaborative roadmaps for next-generation resist needs position themselves as preferred partners for both mature fabs and emerging fabrication hubs.
Actionable recommendations for industry leaders to secure supply resilience, accelerate resist qualification, and align procurement with technical and sustainability priorities
Industry leaders should adopt a proactive approach that fuses technical, commercial, and risk-management measures to protect throughput and accelerate innovation. Begin by prioritizing supplier diversification strategies that maintain technical equivalence while minimizing qualification overhead. Establish collaborative development agreements that include shared validation protocols, joint test wafers, and clear data-sharing arrangements to reduce time to approval and align roadmaps for novel chemistries.
Parallel to supplier strategies, invest in internal capability development: strengthen in-house lithography characterization skills, allocate pilot-lot capacity for rapid turn qualification, and build laboratory capabilities to evaluate sensitivity, outgassing, and defectivity under realistic process conditions. Procurement teams should negotiate flexible contract terms that include pass-through clauses for trade-policy events and options for regionalized supply. Finally, sustainability and regulatory compliance must be embedded into supplier scorecards to future-proof operations against tightening environmental requirements and to support long-term customer commitments.
A transparent methodology combining primary interviews, cross-site laboratory testing, and supply-chain mapping to ensure reproducible and actionable findings across positive photoresist technologies
The research methodology integrates primary interviews, laboratory-level technical analysis, and supply-chain mapping to produce robust, verifiable findings. Primary research included structured interviews with technical leaders from fabrication facilities, packaging specialists, and materials suppliers to capture real-world qualification experiences, defect trends, and procurement practices. These interviews were supplemented by laboratory data analysis focusing on resist sensitivity curves, contrast, resolution performance, and defectivity metrics gathered from cross-site evaluations.
Secondary research consisted of reviewing peer-reviewed literature, standards documents, and equipment vendor technical notes to contextualize observed trends and validate experimental protocols. Supply-chain mapping examined raw material flows, regional capacity distributions, and logistic constraints to identify potential bottlenecks. Data synthesis employed triangulation across sources and sensitivity analysis to ensure that conclusions reflect consensus technical observations rather than single-source anomalies. The methodological approach emphasizes reproducibility and traceability, and technical annexes document protocols, test conditions, and interview frameworks used in the study.
A decisive conclusion that synthesizes technical imperatives, supply resilience measures, and strategic priorities for organizations engaged with positive photoresists
Positive photoresists remain a core enabler of microfabrication advances, but the pathway to sustained performance and supply resilience demands coordinated action across chemistry, process, and procurement domains. The convergence of advanced lithography modalities, evolving application demands, and geopolitical trade dynamics underscores the need for flexible supply arrangements, accelerated qualification frameworks, and targeted R&D investments. Moving forward, manufacturers that align formulation development with specific process platforms and that invest in rapid qualification capabilities will reduce time to yield and gain competitive advantage.
In conclusion, the strategic challenge is to translate material-level innovation into predictable, manufacturable outcomes at scale. By focusing on supplier collaboration, diversified sourcing, and enhanced internal capability in lithographic characterization, organizations can mitigate near-term policy risks and position themselves to capture opportunities arising from packaging innovation, MEMS expansion, and next-generation semiconductor nodes.
Note: PDF & Excel + Online Access - 1 Year
Table of Contents
182 Pages
- 1. Preface
- 1.1. Objectives of the Study
- 1.2. Market Definition
- 1.3. Market Segmentation & Coverage
- 1.4. Years Considered for the Study
- 1.5. Currency Considered for the Study
- 1.6. Language Considered for the Study
- 1.7. Key Stakeholders
- 2. Research Methodology
- 2.1. Introduction
- 2.2. Research Design
- 2.2.1. Primary Research
- 2.2.2. Secondary Research
- 2.3. Research Framework
- 2.3.1. Qualitative Analysis
- 2.3.2. Quantitative Analysis
- 2.4. Market Size Estimation
- 2.4.1. Top-Down Approach
- 2.4.2. Bottom-Up Approach
- 2.5. Data Triangulation
- 2.6. Research Outcomes
- 2.7. Research Assumptions
- 2.8. Research Limitations
- 3. Executive Summary
- 3.1. Introduction
- 3.2. CXO Perspective
- 3.3. Market Size & Growth Trends
- 3.4. Market Share Analysis, 2025
- 3.5. FPNV Positioning Matrix, 2025
- 3.6. New Revenue Opportunities
- 3.7. Next-Generation Business Models
- 3.8. Industry Roadmap
- 4. Market Overview
- 4.1. Introduction
- 4.2. Industry Ecosystem & Value Chain Analysis
- 4.2.1. Supply-Side Analysis
- 4.2.2. Demand-Side Analysis
- 4.2.3. Stakeholder Analysis
- 4.3. Porter’s Five Forces Analysis
- 4.4. PESTLE Analysis
- 4.5. Market Outlook
- 4.5.1. Near-Term Market Outlook (0–2 Years)
- 4.5.2. Medium-Term Market Outlook (3–5 Years)
- 4.5.3. Long-Term Market Outlook (5–10 Years)
- 4.6. Go-to-Market Strategy
- 5. Market Insights
- 5.1. Consumer Insights & End-User Perspective
- 5.2. Consumer Experience Benchmarking
- 5.3. Opportunity Mapping
- 5.4. Distribution Channel Analysis
- 5.5. Pricing Trend Analysis
- 5.6. Regulatory Compliance & Standards Framework
- 5.7. ESG & Sustainability Analysis
- 5.8. Disruption & Risk Scenarios
- 5.9. Return on Investment & Cost-Benefit Analysis
- 6. Cumulative Impact of United States Tariffs 2025
- 7. Cumulative Impact of Artificial Intelligence 2025
- 8. Positive Photoresists Market, by Resist Type
- 8.1. Chemically Amplified
- 8.2. DNQ Novolak
- 9. Positive Photoresists Market, by Process Type
- 9.1. ArF
- 9.1.1. Dry
- 9.1.2. Immersion
- 9.2. EUV
- 9.3. I-Line
- 9.4. KrF
- 10. Positive Photoresists Market, by Thickness Range
- 10.1. Greater Than Five Micrometers
- 10.2. Less Than One Micrometer
- 10.3. One To Five Micrometers
- 11. Positive Photoresists Market, by Application
- 11.1. MEMS Devices
- 11.2. Microfluidics
- 11.3. Printed Circuit Boards
- 11.4. Semiconductor Manufacturing
- 11.4.1. Foundry Services
- 11.4.2. Logic
- 11.4.3. Memory
- 12. Positive Photoresists Market, by End Use Industry
- 12.1. Automotive Electronics
- 12.2. Flat Panel Display
- 12.3. Packaging
- 12.4. Semiconductor Industry
- 13. Positive Photoresists Market, by Region
- 13.1. Americas
- 13.1.1. North America
- 13.1.2. Latin America
- 13.2. Europe, Middle East & Africa
- 13.2.1. Europe
- 13.2.2. Middle East
- 13.2.3. Africa
- 13.3. Asia-Pacific
- 14. Positive Photoresists Market, by Group
- 14.1. ASEAN
- 14.2. GCC
- 14.3. European Union
- 14.4. BRICS
- 14.5. G7
- 14.6. NATO
- 15. Positive Photoresists Market, by Country
- 15.1. United States
- 15.2. Canada
- 15.3. Mexico
- 15.4. Brazil
- 15.5. United Kingdom
- 15.6. Germany
- 15.7. France
- 15.8. Russia
- 15.9. Italy
- 15.10. Spain
- 15.11. China
- 15.12. India
- 15.13. Japan
- 15.14. Australia
- 15.15. South Korea
- 16. United States Positive Photoresists Market
- 17. China Positive Photoresists Market
- 18. Competitive Landscape
- 18.1. Market Concentration Analysis, 2025
- 18.1.1. Concentration Ratio (CR)
- 18.1.2. Herfindahl Hirschman Index (HHI)
- 18.2. Recent Developments & Impact Analysis, 2025
- 18.3. Product Portfolio Analysis, 2025
- 18.4. Benchmarking Analysis, 2025
- 18.5. Brewer Science, Inc.
- 18.6. DuPont de Nemours, Inc.
- 18.7. Fujifilm Electronic Materials Co., Ltd.
- 18.8. Hitachi Chemical Company, Ltd.
- 18.9. JSR Corporation
- 18.10. Merck KGaA
- 18.11. Micro Resist Technology GmbH
- 18.12. Shin-Etsu Chemical Co., Ltd.
- 18.13. Sumitomo Chemical Co., Ltd.
- 18.14. Tokyo Ohka Kogyo Co., Ltd.
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