PC Power Supply OEM Market by Wattage Range (500-750W, 750-1000W, <500W), Efficiency Certification (Bronze, Gold, Platinum), Form Factor, Cooling Type, Application - Global Forecast 2026-2032
Description
The PC Power Supply OEM Market was valued at USD 3.45 billion in 2025 and is projected to grow to USD 3.71 billion in 2026, with a CAGR of 8.24%, reaching USD 6.01 billion by 2032.
A concise orientation to the converging engineering, regulatory, and end-user forces reshaping PC power supply OEM priorities and product architectures
The PC power supply sector stands at a pivotal inflection point where engineering excellence, regulatory change, and shifting end-user expectations converge to redefine competitive advantage. Over recent years, technological refinement in power conversion, thermal management, and component reliability has elevated the role of the power supply from commoditized accessory to differentiated system enabler. As original equipment manufacturers recalibrate design priorities, procurement frameworks and aftermarket positioning must adapt to prioritize efficiency, modularity, and compatibility across increasingly varied system architectures.
Furthermore, the ongoing evolution of computing workloads - from high-frequency gaming bursts to sustained enterprise-class loads in small-form-factor servers - requires suppliers to deliver both flexible power delivery and predictable thermal profiles. This transition places a premium on cross-functional collaboration between electrical design, thermal engineering, and firmware teams, while also compelling OEMs to rethink partner selection criteria to balance performance, lifecycle support, and total cost of ownership implications for end customers.
How advances in efficiency, supply chain diversification, and sustainability imperatives are jointly redefining competitive positioning and product innovation in PSUs
In recent cycles, transformative shifts have emerged along three interdependent vectors: technological differentiation, supply chain resilience, and sustainability-driven compliance. Technological differentiation hinges on incremental efficiency gains, adoption of digital monitoring for predictive maintenance, and the integration of advanced materials to reduce size while improving thermal conductivity. These innovations enable systems designers to extract higher performance from smaller form factors without compromising reliability, which in turn opens new avenues for premium positioning and aftermarket service revenues.
Supply chain resilience has become a strategic imperative as OEMs diversify component sourcing, invest in dual-sourcing strategies for critical semiconductors and passive components, and pursue more geographically distributed manufacturing footprints. Concurrently, sustainability-driven compliance - evidenced by higher-tier efficiency certifications and tighter regional energy regulations - is accelerating the shift toward designs that prioritize long-term operational efficiency and end-of-life recyclability. Taken together, these shifts are prompting OEMs to move beyond unit-level cost competition toward value propositions built on durability, support infrastructure, and sustainability credentials.
An analysis of evolving United States tariff measures through 2025 and how shifting trade dynamics compel procurement, design, and pricing realignments across OEMs
Policy measures announced through 2025 in the United States have introduced new layers of tariff exposure and compliance complexity that reverberate across procurement, pricing strategy, and supplier selection. For original equipment manufacturers, the cumulative impact of tariff policy changes has intensified scrutiny of landed costs, encouraged nearshoring conversations, and prompted more rigorous total-cost modeling when evaluating global bill-of-material options. These pressures are particularly pronounced for components with concentrated supply bases, such as specialized capacitors, high-performance MOSFETs, and certain passive subassemblies.
In response, many OEMs have accelerated strategic supplier diversification and engaged in collaborative design-for-cost exercises to re-specify components for greater geographic flexibility. Pricing teams are recalibrating contractual pass-through mechanisms while commercial leaders explore hedging approaches and inventory buffering to smooth short-term volatility. Importantly, procurement and product teams are aligning more closely to assess how tariff-induced cost increases interact with customer willingness to pay for higher-efficiency certifications and advanced feature sets, ensuring that product roadmaps remain commercially viable under evolving trade policies.
A granular segmentation framework linking wattage, efficiency tiers, form factor constraints, modularity choices, application needs, and cooling strategies to product archetypes and ROI
Segmentation analysis reveals distinct demand drivers and engineering constraints when products are viewed through the lenses of power capacity, efficiency class, mechanical footprint, modular architecture, application profile, and cooling strategy. When products are arrayed by wattage range - covering options under 500W, the 500–750W band, the 750–1000W band, and configurations above 1000W - design trade-offs around thermal dissipation, transient response, and connector density become central to specification priorities. At the same time, efficiency certification tiers such as Bronze, Silver, Gold, Platinum, and Titanium increasingly function as both engineering targets and marketing differentiators, influencing component selection and warranty positioning.
Form factor segmentation across ATX, FlexATX, SFX, TFX, and Ultra SFX highlights divergent mechanical constraints and the need for bespoke PCB layouts, capacitor placement, and airflow channels. Decisions around modular design - whether fully modular, semi-modular, or non-modular - affect assembly complexity, spare-parts strategies, and aftermarket cross-compatibility. Application-specific requirements for commercial desktop, gaming, industrial, and server deployments further shape reliability thresholds and feature sets, while choices in cooling type, including 120mm fan, 140mm fan, dual fan, and fanless architectures, drive acoustics, mean-time-between-failure expectations, and perceived premium value. Taken together, these segmentation vectors delineate clear product archetypes and reveal where investment in R&D and channel education will produce the most durable returns.
Regional demand patterns, regulatory environments, and channel dynamics across Americas, Europe Middle East & Africa, and Asia-Pacific that dictate differentiated commercial strategies
Regional dynamics underscore divergent demand patterns, regulatory environments, and partner ecosystems that OEMs must navigate with differentiated commercial approaches. In the Americas, buyers emphasize ease of integration, aftermarket warranty support, and performance-to-noise balance, with channel partners often prioritizing quick fulfillment and robust technical documentation to support system builders. Regulatory and incentive programs in some jurisdictions also encourage higher-efficiency designs, which shifts commercial conversations toward lifecycle operating costs rather than initial purchase price.
Within Europe, Middle East & Africa, regulatory heterogeneity and strong energy-efficiency mandates shape product certification strategies and documentation demands, while enterprise buyers in select markets value long-term service contracts and predictable supply chains. In Asia-Pacific, a combination of high-volume consumer demand, rapid gaming market expansion, and a strong local manufacturing ecosystem creates both fierce competition and opportunities for scale. Across all regions, regional logistics capabilities, tariff exposure, and local standards compliance collectively inform route-to-market choices and local partner selection, requiring nimble regional strategies that align product portfolios with the specific needs of end users and channel partners.
How engineering leadership, manufacturing scale, and collaborative go-to-market models converge to determine supplier success and long-term OEM partnerships
Competitive dynamics in the OEM landscape are characterized by a bifurcation between engineering-led differentiation and cost-driven volume plays. Leading suppliers that prioritize advanced electrical design, thermal optimization, and higher efficiency class validation tend to secure stronger OEM partnerships for premium systems, while price-competitive producers focus on scale, rapid production cycles, and aggressive supply chain optimization to serve bulk segments. Strategic capabilities that separate leaders include depth of testing infrastructure, firmware and monitoring expertise, and documented field reliability data that reduce perceived integration risk for system integrators.
Partnership models are evolving as well; OEMs increasingly seek suppliers who offer collaborative design services, co-engineering support, and flexible minimum order quantities to accelerate time-to-market for niche SKUs. Aftermarket support and warranty terms remain powerful differentiators, as do certifications and third-party validation for efficiency and safety standards. For suppliers seeking growth, investing in modular platform architectures, establishing multi-regional manufacturing touchpoints, and developing transparent reliability reporting are the most effective means to win long-term OEM commitments.
Practical short-term resilience moves and longer-term innovation investments that OEMs and suppliers must implement to secure competitive advantage and operational continuity
Industry leaders should adopt a triage approach that balances near-term resilience measures with longer-term strategic modernization. In the near term, prioritize supplier diversification for high-risk components, negotiate flexible contractual terms to allow cost pass-through where necessary, and establish inventory risk buffers for critical subcomponents. Concurrently, align product roadmaps to place a premium on higher-efficiency certifications and modular designs that support a broader set of system configurations, which can improve attach rates and aftermarket revenue potential.
Over the medium to long term, invest in thermal and power-architecture R&D to drive efficiency and acoustic differentiation, and expand regional manufacturing or assembly capabilities to mitigate trade-policy exposure. Strengthen channel enablement through improved technical documentation, integration toolkits, and targeted training programs to reduce integration friction and shorten sales cycles. Finally, embed sustainability into product development cycles by designing for recyclability, reducing heavy-metals usage, and documenting lifecycle energy performance to unlock preference among procurement teams and enterprise buyers.
A transparent description of the mixed-method research approach combining primary stakeholder interviews and targeted secondary technical and regulatory analysis to validate findings
This analysis synthesizes primary interviews with product, procurement, and technical leaders across OEMs, complemented by secondary research into regulatory guidance, standards bodies, and publicly available engineering literature. Primary inputs were collected through structured interviews and technical questionnaires that focused on product design priorities, certification burdens, and supply chain risk mitigation strategies. Secondary sources provided context on evolving energy-efficiency standards, tariff announcements, and component-level reliability studies to validate themes emerging from direct stakeholder engagement.
Analytical methods combined qualitative coding of interview transcripts with thematic trend analysis to identify recurring constraints and opportunity areas. Cross-validation across independent data sources ensured that conclusions reflect both practitioner perspectives and documented regulatory and technological developments. Wherever possible, recommendations are oriented toward operational feasibility and include considerations for procurement cycles, certification timelines, and engineering resource allocation to facilitate direct application by product and commercial teams.
A concise summation of the strategic imperatives and operational priorities OEMs must master to convert engineering advances and regulatory change into sustained commercial value
The PC power supply OEM landscape will be defined by firms that can translate engineering competency into commercially differentiated, regulation-ready products while maintaining supply chain agility. Companies that invest in efficiency, modularity, and thermal innovation will find opportunities to extract premium positioning, particularly where end customers buy on long-term operating cost and system reliability rather than headline price. Simultaneously, those that secure diversified sourcing and regional flexibility will be better positioned to withstand episodic trade-policy shifts and component bottlenecks.
In conclusion, success hinges on a dual focus: deepen technical capabilities that materially improve system-level outcomes, and align commercial execution to regional regulatory realities and channel expectations. Organizations that pair robust engineering roadmaps with pragmatic procurement and channel strategies will capture disproportionate value as the category transitions from cost-centric to performance- and sustainability-driven purchasing behaviors.
Note: PDF & Excel + Online Access - 1 Year
A concise orientation to the converging engineering, regulatory, and end-user forces reshaping PC power supply OEM priorities and product architectures
The PC power supply sector stands at a pivotal inflection point where engineering excellence, regulatory change, and shifting end-user expectations converge to redefine competitive advantage. Over recent years, technological refinement in power conversion, thermal management, and component reliability has elevated the role of the power supply from commoditized accessory to differentiated system enabler. As original equipment manufacturers recalibrate design priorities, procurement frameworks and aftermarket positioning must adapt to prioritize efficiency, modularity, and compatibility across increasingly varied system architectures.
Furthermore, the ongoing evolution of computing workloads - from high-frequency gaming bursts to sustained enterprise-class loads in small-form-factor servers - requires suppliers to deliver both flexible power delivery and predictable thermal profiles. This transition places a premium on cross-functional collaboration between electrical design, thermal engineering, and firmware teams, while also compelling OEMs to rethink partner selection criteria to balance performance, lifecycle support, and total cost of ownership implications for end customers.
How advances in efficiency, supply chain diversification, and sustainability imperatives are jointly redefining competitive positioning and product innovation in PSUs
In recent cycles, transformative shifts have emerged along three interdependent vectors: technological differentiation, supply chain resilience, and sustainability-driven compliance. Technological differentiation hinges on incremental efficiency gains, adoption of digital monitoring for predictive maintenance, and the integration of advanced materials to reduce size while improving thermal conductivity. These innovations enable systems designers to extract higher performance from smaller form factors without compromising reliability, which in turn opens new avenues for premium positioning and aftermarket service revenues.
Supply chain resilience has become a strategic imperative as OEMs diversify component sourcing, invest in dual-sourcing strategies for critical semiconductors and passive components, and pursue more geographically distributed manufacturing footprints. Concurrently, sustainability-driven compliance - evidenced by higher-tier efficiency certifications and tighter regional energy regulations - is accelerating the shift toward designs that prioritize long-term operational efficiency and end-of-life recyclability. Taken together, these shifts are prompting OEMs to move beyond unit-level cost competition toward value propositions built on durability, support infrastructure, and sustainability credentials.
An analysis of evolving United States tariff measures through 2025 and how shifting trade dynamics compel procurement, design, and pricing realignments across OEMs
Policy measures announced through 2025 in the United States have introduced new layers of tariff exposure and compliance complexity that reverberate across procurement, pricing strategy, and supplier selection. For original equipment manufacturers, the cumulative impact of tariff policy changes has intensified scrutiny of landed costs, encouraged nearshoring conversations, and prompted more rigorous total-cost modeling when evaluating global bill-of-material options. These pressures are particularly pronounced for components with concentrated supply bases, such as specialized capacitors, high-performance MOSFETs, and certain passive subassemblies.
In response, many OEMs have accelerated strategic supplier diversification and engaged in collaborative design-for-cost exercises to re-specify components for greater geographic flexibility. Pricing teams are recalibrating contractual pass-through mechanisms while commercial leaders explore hedging approaches and inventory buffering to smooth short-term volatility. Importantly, procurement and product teams are aligning more closely to assess how tariff-induced cost increases interact with customer willingness to pay for higher-efficiency certifications and advanced feature sets, ensuring that product roadmaps remain commercially viable under evolving trade policies.
A granular segmentation framework linking wattage, efficiency tiers, form factor constraints, modularity choices, application needs, and cooling strategies to product archetypes and ROI
Segmentation analysis reveals distinct demand drivers and engineering constraints when products are viewed through the lenses of power capacity, efficiency class, mechanical footprint, modular architecture, application profile, and cooling strategy. When products are arrayed by wattage range - covering options under 500W, the 500–750W band, the 750–1000W band, and configurations above 1000W - design trade-offs around thermal dissipation, transient response, and connector density become central to specification priorities. At the same time, efficiency certification tiers such as Bronze, Silver, Gold, Platinum, and Titanium increasingly function as both engineering targets and marketing differentiators, influencing component selection and warranty positioning.
Form factor segmentation across ATX, FlexATX, SFX, TFX, and Ultra SFX highlights divergent mechanical constraints and the need for bespoke PCB layouts, capacitor placement, and airflow channels. Decisions around modular design - whether fully modular, semi-modular, or non-modular - affect assembly complexity, spare-parts strategies, and aftermarket cross-compatibility. Application-specific requirements for commercial desktop, gaming, industrial, and server deployments further shape reliability thresholds and feature sets, while choices in cooling type, including 120mm fan, 140mm fan, dual fan, and fanless architectures, drive acoustics, mean-time-between-failure expectations, and perceived premium value. Taken together, these segmentation vectors delineate clear product archetypes and reveal where investment in R&D and channel education will produce the most durable returns.
Regional demand patterns, regulatory environments, and channel dynamics across Americas, Europe Middle East & Africa, and Asia-Pacific that dictate differentiated commercial strategies
Regional dynamics underscore divergent demand patterns, regulatory environments, and partner ecosystems that OEMs must navigate with differentiated commercial approaches. In the Americas, buyers emphasize ease of integration, aftermarket warranty support, and performance-to-noise balance, with channel partners often prioritizing quick fulfillment and robust technical documentation to support system builders. Regulatory and incentive programs in some jurisdictions also encourage higher-efficiency designs, which shifts commercial conversations toward lifecycle operating costs rather than initial purchase price.
Within Europe, Middle East & Africa, regulatory heterogeneity and strong energy-efficiency mandates shape product certification strategies and documentation demands, while enterprise buyers in select markets value long-term service contracts and predictable supply chains. In Asia-Pacific, a combination of high-volume consumer demand, rapid gaming market expansion, and a strong local manufacturing ecosystem creates both fierce competition and opportunities for scale. Across all regions, regional logistics capabilities, tariff exposure, and local standards compliance collectively inform route-to-market choices and local partner selection, requiring nimble regional strategies that align product portfolios with the specific needs of end users and channel partners.
How engineering leadership, manufacturing scale, and collaborative go-to-market models converge to determine supplier success and long-term OEM partnerships
Competitive dynamics in the OEM landscape are characterized by a bifurcation between engineering-led differentiation and cost-driven volume plays. Leading suppliers that prioritize advanced electrical design, thermal optimization, and higher efficiency class validation tend to secure stronger OEM partnerships for premium systems, while price-competitive producers focus on scale, rapid production cycles, and aggressive supply chain optimization to serve bulk segments. Strategic capabilities that separate leaders include depth of testing infrastructure, firmware and monitoring expertise, and documented field reliability data that reduce perceived integration risk for system integrators.
Partnership models are evolving as well; OEMs increasingly seek suppliers who offer collaborative design services, co-engineering support, and flexible minimum order quantities to accelerate time-to-market for niche SKUs. Aftermarket support and warranty terms remain powerful differentiators, as do certifications and third-party validation for efficiency and safety standards. For suppliers seeking growth, investing in modular platform architectures, establishing multi-regional manufacturing touchpoints, and developing transparent reliability reporting are the most effective means to win long-term OEM commitments.
Practical short-term resilience moves and longer-term innovation investments that OEMs and suppliers must implement to secure competitive advantage and operational continuity
Industry leaders should adopt a triage approach that balances near-term resilience measures with longer-term strategic modernization. In the near term, prioritize supplier diversification for high-risk components, negotiate flexible contractual terms to allow cost pass-through where necessary, and establish inventory risk buffers for critical subcomponents. Concurrently, align product roadmaps to place a premium on higher-efficiency certifications and modular designs that support a broader set of system configurations, which can improve attach rates and aftermarket revenue potential.
Over the medium to long term, invest in thermal and power-architecture R&D to drive efficiency and acoustic differentiation, and expand regional manufacturing or assembly capabilities to mitigate trade-policy exposure. Strengthen channel enablement through improved technical documentation, integration toolkits, and targeted training programs to reduce integration friction and shorten sales cycles. Finally, embed sustainability into product development cycles by designing for recyclability, reducing heavy-metals usage, and documenting lifecycle energy performance to unlock preference among procurement teams and enterprise buyers.
A transparent description of the mixed-method research approach combining primary stakeholder interviews and targeted secondary technical and regulatory analysis to validate findings
This analysis synthesizes primary interviews with product, procurement, and technical leaders across OEMs, complemented by secondary research into regulatory guidance, standards bodies, and publicly available engineering literature. Primary inputs were collected through structured interviews and technical questionnaires that focused on product design priorities, certification burdens, and supply chain risk mitigation strategies. Secondary sources provided context on evolving energy-efficiency standards, tariff announcements, and component-level reliability studies to validate themes emerging from direct stakeholder engagement.
Analytical methods combined qualitative coding of interview transcripts with thematic trend analysis to identify recurring constraints and opportunity areas. Cross-validation across independent data sources ensured that conclusions reflect both practitioner perspectives and documented regulatory and technological developments. Wherever possible, recommendations are oriented toward operational feasibility and include considerations for procurement cycles, certification timelines, and engineering resource allocation to facilitate direct application by product and commercial teams.
A concise summation of the strategic imperatives and operational priorities OEMs must master to convert engineering advances and regulatory change into sustained commercial value
The PC power supply OEM landscape will be defined by firms that can translate engineering competency into commercially differentiated, regulation-ready products while maintaining supply chain agility. Companies that invest in efficiency, modularity, and thermal innovation will find opportunities to extract premium positioning, particularly where end customers buy on long-term operating cost and system reliability rather than headline price. Simultaneously, those that secure diversified sourcing and regional flexibility will be better positioned to withstand episodic trade-policy shifts and component bottlenecks.
In conclusion, success hinges on a dual focus: deepen technical capabilities that materially improve system-level outcomes, and align commercial execution to regional regulatory realities and channel expectations. Organizations that pair robust engineering roadmaps with pragmatic procurement and channel strategies will capture disproportionate value as the category transitions from cost-centric to performance- and sustainability-driven purchasing behaviors.
Note: PDF & Excel + Online Access - 1 Year
Table of Contents
190 Pages
- 1. Preface
- 1.1. Objectives of the Study
- 1.2. Market Definition
- 1.3. Market Segmentation & Coverage
- 1.4. Years Considered for the Study
- 1.5. Currency Considered for the Study
- 1.6. Language Considered for the Study
- 1.7. Key Stakeholders
- 2. Research Methodology
- 2.1. Introduction
- 2.2. Research Design
- 2.2.1. Primary Research
- 2.2.2. Secondary Research
- 2.3. Research Framework
- 2.3.1. Qualitative Analysis
- 2.3.2. Quantitative Analysis
- 2.4. Market Size Estimation
- 2.4.1. Top-Down Approach
- 2.4.2. Bottom-Up Approach
- 2.5. Data Triangulation
- 2.6. Research Outcomes
- 2.7. Research Assumptions
- 2.8. Research Limitations
- 3. Executive Summary
- 3.1. Introduction
- 3.2. CXO Perspective
- 3.3. Market Size & Growth Trends
- 3.4. Market Share Analysis, 2025
- 3.5. FPNV Positioning Matrix, 2025
- 3.6. New Revenue Opportunities
- 3.7. Next-Generation Business Models
- 3.8. Industry Roadmap
- 4. Market Overview
- 4.1. Introduction
- 4.2. Industry Ecosystem & Value Chain Analysis
- 4.2.1. Supply-Side Analysis
- 4.2.2. Demand-Side Analysis
- 4.2.3. Stakeholder Analysis
- 4.3. Porter’s Five Forces Analysis
- 4.4. PESTLE Analysis
- 4.5. Market Outlook
- 4.5.1. Near-Term Market Outlook (0–2 Years)
- 4.5.2. Medium-Term Market Outlook (3–5 Years)
- 4.5.3. Long-Term Market Outlook (5–10 Years)
- 4.6. Go-to-Market Strategy
- 5. Market Insights
- 5.1. Consumer Insights & End-User Perspective
- 5.2. Consumer Experience Benchmarking
- 5.3. Opportunity Mapping
- 5.4. Distribution Channel Analysis
- 5.5. Pricing Trend Analysis
- 5.6. Regulatory Compliance & Standards Framework
- 5.7. ESG & Sustainability Analysis
- 5.8. Disruption & Risk Scenarios
- 5.9. Return on Investment & Cost-Benefit Analysis
- 6. Cumulative Impact of United States Tariffs 2025
- 7. Cumulative Impact of Artificial Intelligence 2025
- 8. PC Power Supply OEM Market, by Wattage Range
- 8.1. 500-750W
- 8.2. 750-1000W
- 8.3. <500W
- 8.4. >1000W
- 9. PC Power Supply OEM Market, by Efficiency Certification
- 9.1. Bronze
- 9.2. Gold
- 9.3. Platinum
- 9.4. Silver
- 9.5. Titanium
- 10. PC Power Supply OEM Market, by Form Factor
- 10.1. ATX
- 10.2. FlexATX
- 10.3. SFX
- 10.4. TFX
- 10.5. Ultra SFX
- 11. PC Power Supply OEM Market, by Cooling Type
- 11.1. 120Mm Fan
- 11.2. 140Mm Fan
- 11.3. Dual Fan
- 11.4. Fanless
- 12. PC Power Supply OEM Market, by Application
- 12.1. Commercial Desktop
- 12.2. Gaming
- 12.3. Industrial
- 12.4. Server
- 13. PC Power Supply OEM Market, by Region
- 13.1. Americas
- 13.1.1. North America
- 13.1.2. Latin America
- 13.2. Europe, Middle East & Africa
- 13.2.1. Europe
- 13.2.2. Middle East
- 13.2.3. Africa
- 13.3. Asia-Pacific
- 14. PC Power Supply OEM Market, by Group
- 14.1. ASEAN
- 14.2. GCC
- 14.3. European Union
- 14.4. BRICS
- 14.5. G7
- 14.6. NATO
- 15. PC Power Supply OEM Market, by Country
- 15.1. United States
- 15.2. Canada
- 15.3. Mexico
- 15.4. Brazil
- 15.5. United Kingdom
- 15.6. Germany
- 15.7. France
- 15.8. Russia
- 15.9. Italy
- 15.10. Spain
- 15.11. China
- 15.12. India
- 15.13. Japan
- 15.14. Australia
- 15.15. South Korea
- 16. United States PC Power Supply OEM Market
- 17. China PC Power Supply OEM Market
- 18. Competitive Landscape
- 18.1. Market Concentration Analysis, 2025
- 18.1.1. Concentration Ratio (CR)
- 18.1.2. Herfindahl Hirschman Index (HHI)
- 18.2. Recent Developments & Impact Analysis, 2025
- 18.3. Product Portfolio Analysis, 2025
- 18.4. Benchmarking Analysis, 2025
- 18.5. AcBel Polytech Inc.
- 18.6. Antec, Inc.
- 18.7. be quiet! (Listan GmbH & Co. KG)
- 18.8. Channel Well Technology Co., Ltd.
- 18.9. Chicony Power Technology Co., Ltd.
- 18.10. Chieftec Group
- 18.11. Cooler Master Technology Inc.
- 18.12. Corsair Components, Inc.
- 18.13. Delta Electronics, Inc.
- 18.14. Enhance Electronics Co., Ltd.
- 18.15. EVGA Corporation
- 18.16. FSP Technology Inc.
- 18.17. Great Wall Enterprise Co., Ltd.
- 18.18. Huntkey Electric Co., Ltd.
- 18.19. Lite‑On Technology Corporation
- 18.20. NZXT Inc.
- 18.21. Seasonic Electronics Co., Ltd.
- 18.22. SilverStone Technology Co., Ltd.
- 18.23. Super Flower Computer Inc.
- 18.24. Thermaltake Technology Co., Ltd.
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