Lithography Metrology Equipment Market by Equipment Type (AFM, CD-SEM, Scatterometry), Technique (Atomic Force Microscopy, Electron Beam Metrology, Optical Metrology), Wavelength, Application - Global Forecast 2025-2032
Description
The Lithography Metrology Equipment Market was valued at USD 4.28 billion in 2024 and is projected to grow to USD 4.61 billion in 2025, with a CAGR of 8.04%, reaching USD 7.95 billion by 2032.
A concise orientation to advanced lithography metrology equipment trends that frames current technological pressures and operational priorities for process leaders
The lithography metrology equipment landscape sits at the intersection of precision measurement, advanced materials science, and accelerating semiconductor complexity. As process nodes shrink and patterning techniques diversify, measurement systems have evolved from standalone instruments to integrated metrology platforms that combine hardware, software, and automated workflows. This transformation responds to persistent demand for higher throughput, enhanced resolution, and traceable accuracy that support yield optimization and process control across wafer fabs and R&D environments.
Contemporary metrology outfits increasingly emphasize digital ecosystems: closed-loop control enabled by real-time analytics, machine learning-assisted defect classification, and modular sensor architectures that facilitate multi-parameter characterization. Meanwhile, cross-domain convergence has placed new requirements on measurement vendors to support heterogeneous substrates and non-planar topographies, including advanced memory, logic, and emerging packaging schemes. Consequently, procurement and process engineering teams must weigh equipment precision against integration complexity, service models, and software interoperability as part of broader capital equipment strategies.
Given these shifts, stakeholders require concise, decision-grade intelligence that clarifies where incremental instrument capabilities yield proportionate process improvements, and where investments in automation and analytics unlock larger operational gains. This report synthesizes those dynamics to help leaders prioritize investments, align metrology roadmaps with device roadmaps, and mitigate the technical and commercial risks inherent in advanced lithography metrology adoption.
How escalating technical complexity, digitalization, and supply chain resilience are reshaping competitive differentiation and procurement priorities in metrology
The landscape of lithography metrology is undergoing transformative shifts driven by a mix of technological, commercial, and regulatory forces. First, the relentless scaling of critical dimensions and the introduction of complex multi-patterning and EUV-based workflows have amplified the need for sub-nanometer measurement repeatability and cross-tool traceability. In response, vendors are prioritizing ultra-stable environmental control, higher-sensitivity detectors, and novel probe techniques that preserve throughput while shrinking measurement uncertainty.
At the same time, digital transformation is reshaping vendor-customer relationships. Manufacturers increasingly bundle software-defined analytics, predictive maintenance, and cloud-connected data services with instrument hardware, moving the value proposition toward outcome-based service models. This shift enables fabs to extract more value from existing equipment through advanced analytics, but it also raises questions around data governance, latency, and integration with legacy manufacturing execution systems.
Moreover, supply chain resilience and geopolitical dynamics are prompting strategic diversification of sourcing and a renewed focus on regional equipment servicing capabilities. Investments in automation and remote diagnostics are accelerating to reduce downtime risk and to enable rapid response across distributed manufacturing footprints. Collectively, these shifts are redefining competitive differentiation in metrology from raw instrumentation performance to holistic solutions that support faster process development cycles, reduced time-to-yield, and scalable factory deployments.
Analyzing the compound effects of the 2025 United States tariff measures on supply chains, procurement strategies, and total cost of ownership dynamics
The imposition of new United States tariff measures in 2025 has introduced a material inflection in sourcing strategies, supplier pricing, and cross-border equipment flows across the lithography metrology sector. Equipment manufacturers and fabs have navigated a complex set of direct and indirect effects: direct duty impacts on imported instruments and components have pressured margins and, in some cases, accelerated the redesign of component sourcing to mitigate tariff exposure. Indirectly, tariffs have altered the calculus for where systems are assembled and serviced, increasing the attractiveness of regional manufacturing and localized value-added activities that reduce exposure to cross-border levies.
In practice, organizations responded by reassessing supplier footprints and intensifying supplier qualification processes to ensure continuity of critical subcomponents. Capital procurement teams have extended lead-time assumptions and expanded dual-sourcing strategies to maintain production schedules. Simultaneously, vendors have sought to offset duty-related cost increases through engineering optimizations that reduce the use of tariff-sensitive components and through pricing strategies that preserve competitiveness in key customer segments.
Taken together, these dynamics have encouraged strategic adaptations across the ecosystem: a move toward nearshoring assembly and calibration operations, selective relocation of high-value subsystems, and increased emphasis on service and software revenue streams that are less exposed to hardware-centric tariffs. For stakeholders, the primary implication is that total cost of ownership assessments must now account for tariff risk, regional servicing availability, and the operational flexibility of suppliers to shift production footprints in response to evolving trade policy.
An integrated segmentation framework linking equipment types, measurement techniques, applications, and wavelength domains to illuminate instrument selection and process alignment
A robust segmentation analysis clarifies where technological investments and operational priorities converge within lithography metrology. Based on equipment type, the field spans atomic force microscopy, critical-dimension scanning electron microscopy, scatterometry, and X-ray metrology; within atomic force microscopy, contact, non-contact, and tapping modes serve distinct applications that balance tip-sample interaction with resolution and throughput needs, while scatterometry differentiates through angle-resolved and spectroscopic approaches that trade measurement speed for spectral detail, and X-ray metrology separates into diffraction and reflectometry techniques tailored for crystalline and thin-film characterization respectively. Transitioning to technique-based differentiation, the market is also organized around atomic force microscopy methods, electron beam metrology approaches, optical metrology solutions, and X-ray metrology platforms, each offering unique spatial resolution, contrast mechanisms, and compatibility with diverse substrate chemistries.
When considered by application, instrument selection and configuration vary considerably across data storage, flat panel display, MEMS, and semiconductor uses; data storage and MEMS often require specialized surface and topography measurements, whereas flat panel display and semiconductor manufacturing emphasize high-throughput, inline strategies that support large-area uniformity assessments and critical-dimension control. Wavelength-based segmentation further refines measurement choices: deep ultraviolet, extreme ultraviolet, infrared, and visible wavelengths present different penetration depths and interaction mechanisms with patterned materials; deep ultraviolet techniques, including 157 nm, 193 nm, and 248 nm variants, offer differing trade-offs in resolution and optical system design, while infrared approaches subdivide into far, mid, and near infrared bands that excel at material-specific contrast and subsurface analysis. Integrating these segmentation lenses yields a layered understanding of where instrument investment yields maximal process benefit and where hybrid measurement strategies provide complementary insights for next-generation device manufacture.
How regional manufacturing ecosystems and service infrastructures shape adoption pathways and procurement strategies across global lithography metrology markets
Regional dynamics materially influence procurement risk, service ecosystems, and adoption pathways for lithography metrology equipment. In the Americas, advanced research centers and mature foundry operations drive demand for high-throughput in-line metrology and robust service networks, while a strong cadence of capital investment and innovation partnerships accelerates adoption of digital analytics and automation. Conversely, Europe, Middle East & Africa present a heterogenous landscape where precision instrumentation and collaborative research initiatives emphasize standardization, traceability, and sustainability considerations, and where regional supply chains and regulatory frameworks shape vendor strategies around local certification and environmental controls.
Asia-Pacific remains the most diversified and fast-moving region, with large-scale fabrication hubs, consumer electronics supply chains, and memory production exerting intense demand pressures for both high-resolution metrology and scalable automation. The regional emphasis on rapid cycle time, cost-effective scaling, and integrated manufacturing ecosystems has driven localized supply chain development, strong aftermarket service networks, and close collaboration between equipment suppliers and device manufacturers to accelerate process maturity. Taken together, regional contrasts highlight the importance of tailoring deployment strategies to localized operational priorities, ensuring that instrument selection, service models, and software integration align with regional production rhythms and regulatory expectations.
Why competitive advantage now hinges on integrated hardware-software platforms, service ecosystems, and strategic partnerships to deliver measurable operational outcomes
Competitive dynamics among suppliers have shifted from pure instrumentation performance to platform-level differentiation that pairs hardware with software ecosystems and global service capabilities. Leading providers increasingly invest in modular instrument architectures, open data standards, and machine learning toolchains that facilitate multi-instrument data fusion and enable closed-loop process control. This strategic pivot recognizes that long-term customer value derives not only from precision hardware but also from the ability to lower cost-per-measurement, reduce downtime through predictive maintenance, and accelerate process qualification through integrated analytics.
Strategic partnerships and selective acquisitions remain prevalent as vendors seek complementary competencies in optics, detectors, and software analytics. Service models have evolved to include outcome-oriented contracts, remote diagnostics, and lifecycle management offerings that lock in recurring revenue while delivering operational predictability for customers. At the same time, specialized innovators continue to introduce disruptive sensing modalities and probe technologies, forcing incumbents to prioritize rapid product development cycles and tighter customer engagement. For procurement and engineering leaders, supplier evaluation therefore extends beyond immediate instrument specifications to include roadmaps for software integration, support capacity in key regions, and demonstrated ability to co-develop solutions with fabrication partners.
Actionable operational and procurement measures that executive teams can implement to strengthen resilience, accelerate yield, and optimize long-term equipment value delivery
Industry leaders should adopt a pragmatic set of actions that protect margins while accelerating process capability and equipment uptime. First, align capital planning with integration readiness by prioritizing instruments that support open data interoperability and API-based connectivity; this reduces friction during deployment and accelerates the value realized from analytics investments. Second, expand supplier diversification and qualification protocols to include assessments of regional service availability, spare parts logistics, and software update cadences, thereby reducing operational risk associated with geopolitical and tariff volatility.
Third, invest in internal capabilities for advanced data analytics and instrument lifecycle management so that teams can extract more value from existing equipment through predictive maintenance and closed-loop control. Fourth, pursue strategic collaborations with measurement vendors and academic partners to co-develop specialized metrology workflows for emerging device architectures, which accelerates time-to-yield while sharing technical risk. Finally, redesign procurement agreements to emphasize total operational value over near-term price metrics; include service-level commitments, upgrade pathways, and clear definitions of data ownership and integration responsibilities to ensure long-term alignment between tool vendors and fabs.
A rigorous mixed-methods approach combining practitioner interviews, technical validation, and scenario analysis to ensure operationally grounded insights and recommendations
The research methodology for this analysis combined primary engagement with domain experts, technical validation of instrument capabilities, and synthesis of recent public-facing technical literature. Primary inputs included structured interviews with process engineers, metrology specialists, and procurement leaders across fabrication and research environments to capture real-world deployment considerations, service expectations, and integration challenges. These practitioner insights provided nuanced perspectives on throughput imperatives, environmental control constraints, and software interoperability requirements.
Secondary validation drew from peer-reviewed publications, conference proceedings, and vendor technical data that describe method-specific performance characteristics and deployment case studies. Cross-comparison of these sources with practitioner feedback ensured that instrument capability claims were weighed against operational realities, such as factory uptime targets, cleanroom constraints, and calibration regimes. Finally, scenario analysis techniques were applied to explore the implications of supply chain disruptions and policy shifts, enabling the development of practical recommendations that remain robust across plausible operational conditions.
Concluding synthesis that emphasizes integrated metrology solutions, service resilience, and analytic-enabled process control as the determinants of future manufacturing success
In conclusion, lithography metrology is maturing into a solutions-driven domain where instrument precision remains necessary but insufficient alone to meet industry needs. The most impactful advances arise when high-performance hardware is coupled with interoperable software, scalable service models, and resilient supply chains. As device architectures diversify and process control windows narrow, the ability to integrate multi-modal measurement data and to automate actionable feedback will determine which organizations achieve sustainable yield advantages.
Stakeholders must therefore evaluate investments through a broader lens that includes integration complexity, service readiness, and supplier agility in response to policy and supply chain shifts. By focusing on open interfaces, advanced analytics, and regional service capabilities, manufacturing organizations can both mitigate near-term risks and capture long-term operational gains. Ultimately, those who treat metrology as an integral component of the manufacturing ecosystem rather than a discrete procurement item will be best positioned to navigate the technical and commercial challenges ahead.
Note: PDF & Excel + Online Access - 1 Year
A concise orientation to advanced lithography metrology equipment trends that frames current technological pressures and operational priorities for process leaders
The lithography metrology equipment landscape sits at the intersection of precision measurement, advanced materials science, and accelerating semiconductor complexity. As process nodes shrink and patterning techniques diversify, measurement systems have evolved from standalone instruments to integrated metrology platforms that combine hardware, software, and automated workflows. This transformation responds to persistent demand for higher throughput, enhanced resolution, and traceable accuracy that support yield optimization and process control across wafer fabs and R&D environments.
Contemporary metrology outfits increasingly emphasize digital ecosystems: closed-loop control enabled by real-time analytics, machine learning-assisted defect classification, and modular sensor architectures that facilitate multi-parameter characterization. Meanwhile, cross-domain convergence has placed new requirements on measurement vendors to support heterogeneous substrates and non-planar topographies, including advanced memory, logic, and emerging packaging schemes. Consequently, procurement and process engineering teams must weigh equipment precision against integration complexity, service models, and software interoperability as part of broader capital equipment strategies.
Given these shifts, stakeholders require concise, decision-grade intelligence that clarifies where incremental instrument capabilities yield proportionate process improvements, and where investments in automation and analytics unlock larger operational gains. This report synthesizes those dynamics to help leaders prioritize investments, align metrology roadmaps with device roadmaps, and mitigate the technical and commercial risks inherent in advanced lithography metrology adoption.
How escalating technical complexity, digitalization, and supply chain resilience are reshaping competitive differentiation and procurement priorities in metrology
The landscape of lithography metrology is undergoing transformative shifts driven by a mix of technological, commercial, and regulatory forces. First, the relentless scaling of critical dimensions and the introduction of complex multi-patterning and EUV-based workflows have amplified the need for sub-nanometer measurement repeatability and cross-tool traceability. In response, vendors are prioritizing ultra-stable environmental control, higher-sensitivity detectors, and novel probe techniques that preserve throughput while shrinking measurement uncertainty.
At the same time, digital transformation is reshaping vendor-customer relationships. Manufacturers increasingly bundle software-defined analytics, predictive maintenance, and cloud-connected data services with instrument hardware, moving the value proposition toward outcome-based service models. This shift enables fabs to extract more value from existing equipment through advanced analytics, but it also raises questions around data governance, latency, and integration with legacy manufacturing execution systems.
Moreover, supply chain resilience and geopolitical dynamics are prompting strategic diversification of sourcing and a renewed focus on regional equipment servicing capabilities. Investments in automation and remote diagnostics are accelerating to reduce downtime risk and to enable rapid response across distributed manufacturing footprints. Collectively, these shifts are redefining competitive differentiation in metrology from raw instrumentation performance to holistic solutions that support faster process development cycles, reduced time-to-yield, and scalable factory deployments.
Analyzing the compound effects of the 2025 United States tariff measures on supply chains, procurement strategies, and total cost of ownership dynamics
The imposition of new United States tariff measures in 2025 has introduced a material inflection in sourcing strategies, supplier pricing, and cross-border equipment flows across the lithography metrology sector. Equipment manufacturers and fabs have navigated a complex set of direct and indirect effects: direct duty impacts on imported instruments and components have pressured margins and, in some cases, accelerated the redesign of component sourcing to mitigate tariff exposure. Indirectly, tariffs have altered the calculus for where systems are assembled and serviced, increasing the attractiveness of regional manufacturing and localized value-added activities that reduce exposure to cross-border levies.
In practice, organizations responded by reassessing supplier footprints and intensifying supplier qualification processes to ensure continuity of critical subcomponents. Capital procurement teams have extended lead-time assumptions and expanded dual-sourcing strategies to maintain production schedules. Simultaneously, vendors have sought to offset duty-related cost increases through engineering optimizations that reduce the use of tariff-sensitive components and through pricing strategies that preserve competitiveness in key customer segments.
Taken together, these dynamics have encouraged strategic adaptations across the ecosystem: a move toward nearshoring assembly and calibration operations, selective relocation of high-value subsystems, and increased emphasis on service and software revenue streams that are less exposed to hardware-centric tariffs. For stakeholders, the primary implication is that total cost of ownership assessments must now account for tariff risk, regional servicing availability, and the operational flexibility of suppliers to shift production footprints in response to evolving trade policy.
An integrated segmentation framework linking equipment types, measurement techniques, applications, and wavelength domains to illuminate instrument selection and process alignment
A robust segmentation analysis clarifies where technological investments and operational priorities converge within lithography metrology. Based on equipment type, the field spans atomic force microscopy, critical-dimension scanning electron microscopy, scatterometry, and X-ray metrology; within atomic force microscopy, contact, non-contact, and tapping modes serve distinct applications that balance tip-sample interaction with resolution and throughput needs, while scatterometry differentiates through angle-resolved and spectroscopic approaches that trade measurement speed for spectral detail, and X-ray metrology separates into diffraction and reflectometry techniques tailored for crystalline and thin-film characterization respectively. Transitioning to technique-based differentiation, the market is also organized around atomic force microscopy methods, electron beam metrology approaches, optical metrology solutions, and X-ray metrology platforms, each offering unique spatial resolution, contrast mechanisms, and compatibility with diverse substrate chemistries.
When considered by application, instrument selection and configuration vary considerably across data storage, flat panel display, MEMS, and semiconductor uses; data storage and MEMS often require specialized surface and topography measurements, whereas flat panel display and semiconductor manufacturing emphasize high-throughput, inline strategies that support large-area uniformity assessments and critical-dimension control. Wavelength-based segmentation further refines measurement choices: deep ultraviolet, extreme ultraviolet, infrared, and visible wavelengths present different penetration depths and interaction mechanisms with patterned materials; deep ultraviolet techniques, including 157 nm, 193 nm, and 248 nm variants, offer differing trade-offs in resolution and optical system design, while infrared approaches subdivide into far, mid, and near infrared bands that excel at material-specific contrast and subsurface analysis. Integrating these segmentation lenses yields a layered understanding of where instrument investment yields maximal process benefit and where hybrid measurement strategies provide complementary insights for next-generation device manufacture.
How regional manufacturing ecosystems and service infrastructures shape adoption pathways and procurement strategies across global lithography metrology markets
Regional dynamics materially influence procurement risk, service ecosystems, and adoption pathways for lithography metrology equipment. In the Americas, advanced research centers and mature foundry operations drive demand for high-throughput in-line metrology and robust service networks, while a strong cadence of capital investment and innovation partnerships accelerates adoption of digital analytics and automation. Conversely, Europe, Middle East & Africa present a heterogenous landscape where precision instrumentation and collaborative research initiatives emphasize standardization, traceability, and sustainability considerations, and where regional supply chains and regulatory frameworks shape vendor strategies around local certification and environmental controls.
Asia-Pacific remains the most diversified and fast-moving region, with large-scale fabrication hubs, consumer electronics supply chains, and memory production exerting intense demand pressures for both high-resolution metrology and scalable automation. The regional emphasis on rapid cycle time, cost-effective scaling, and integrated manufacturing ecosystems has driven localized supply chain development, strong aftermarket service networks, and close collaboration between equipment suppliers and device manufacturers to accelerate process maturity. Taken together, regional contrasts highlight the importance of tailoring deployment strategies to localized operational priorities, ensuring that instrument selection, service models, and software integration align with regional production rhythms and regulatory expectations.
Why competitive advantage now hinges on integrated hardware-software platforms, service ecosystems, and strategic partnerships to deliver measurable operational outcomes
Competitive dynamics among suppliers have shifted from pure instrumentation performance to platform-level differentiation that pairs hardware with software ecosystems and global service capabilities. Leading providers increasingly invest in modular instrument architectures, open data standards, and machine learning toolchains that facilitate multi-instrument data fusion and enable closed-loop process control. This strategic pivot recognizes that long-term customer value derives not only from precision hardware but also from the ability to lower cost-per-measurement, reduce downtime through predictive maintenance, and accelerate process qualification through integrated analytics.
Strategic partnerships and selective acquisitions remain prevalent as vendors seek complementary competencies in optics, detectors, and software analytics. Service models have evolved to include outcome-oriented contracts, remote diagnostics, and lifecycle management offerings that lock in recurring revenue while delivering operational predictability for customers. At the same time, specialized innovators continue to introduce disruptive sensing modalities and probe technologies, forcing incumbents to prioritize rapid product development cycles and tighter customer engagement. For procurement and engineering leaders, supplier evaluation therefore extends beyond immediate instrument specifications to include roadmaps for software integration, support capacity in key regions, and demonstrated ability to co-develop solutions with fabrication partners.
Actionable operational and procurement measures that executive teams can implement to strengthen resilience, accelerate yield, and optimize long-term equipment value delivery
Industry leaders should adopt a pragmatic set of actions that protect margins while accelerating process capability and equipment uptime. First, align capital planning with integration readiness by prioritizing instruments that support open data interoperability and API-based connectivity; this reduces friction during deployment and accelerates the value realized from analytics investments. Second, expand supplier diversification and qualification protocols to include assessments of regional service availability, spare parts logistics, and software update cadences, thereby reducing operational risk associated with geopolitical and tariff volatility.
Third, invest in internal capabilities for advanced data analytics and instrument lifecycle management so that teams can extract more value from existing equipment through predictive maintenance and closed-loop control. Fourth, pursue strategic collaborations with measurement vendors and academic partners to co-develop specialized metrology workflows for emerging device architectures, which accelerates time-to-yield while sharing technical risk. Finally, redesign procurement agreements to emphasize total operational value over near-term price metrics; include service-level commitments, upgrade pathways, and clear definitions of data ownership and integration responsibilities to ensure long-term alignment between tool vendors and fabs.
A rigorous mixed-methods approach combining practitioner interviews, technical validation, and scenario analysis to ensure operationally grounded insights and recommendations
The research methodology for this analysis combined primary engagement with domain experts, technical validation of instrument capabilities, and synthesis of recent public-facing technical literature. Primary inputs included structured interviews with process engineers, metrology specialists, and procurement leaders across fabrication and research environments to capture real-world deployment considerations, service expectations, and integration challenges. These practitioner insights provided nuanced perspectives on throughput imperatives, environmental control constraints, and software interoperability requirements.
Secondary validation drew from peer-reviewed publications, conference proceedings, and vendor technical data that describe method-specific performance characteristics and deployment case studies. Cross-comparison of these sources with practitioner feedback ensured that instrument capability claims were weighed against operational realities, such as factory uptime targets, cleanroom constraints, and calibration regimes. Finally, scenario analysis techniques were applied to explore the implications of supply chain disruptions and policy shifts, enabling the development of practical recommendations that remain robust across plausible operational conditions.
Concluding synthesis that emphasizes integrated metrology solutions, service resilience, and analytic-enabled process control as the determinants of future manufacturing success
In conclusion, lithography metrology is maturing into a solutions-driven domain where instrument precision remains necessary but insufficient alone to meet industry needs. The most impactful advances arise when high-performance hardware is coupled with interoperable software, scalable service models, and resilient supply chains. As device architectures diversify and process control windows narrow, the ability to integrate multi-modal measurement data and to automate actionable feedback will determine which organizations achieve sustainable yield advantages.
Stakeholders must therefore evaluate investments through a broader lens that includes integration complexity, service readiness, and supplier agility in response to policy and supply chain shifts. By focusing on open interfaces, advanced analytics, and regional service capabilities, manufacturing organizations can both mitigate near-term risks and capture long-term operational gains. Ultimately, those who treat metrology as an integral component of the manufacturing ecosystem rather than a discrete procurement item will be best positioned to navigate the technical and commercial challenges ahead.
Note: PDF & Excel + Online Access - 1 Year
Table of Contents
186 Pages
- 1. Preface
- 1.1. Objectives of the Study
- 1.2. Market Segmentation & Coverage
- 1.3. Years Considered for the Study
- 1.4. Currency
- 1.5. Language
- 1.6. Stakeholders
- 2. Research Methodology
- 3. Executive Summary
- 4. Market Overview
- 5. Market Insights
- 5.1. Adoption of AI-driven defect detection and pattern recognition for high-throughput EUV metrology
- 5.2. Integration of real-time hyperspectral imaging and scatterometry for nanoscale critical dimension control
- 5.3. Deployment of high-NA EUV overlay metrology tools to support sub-3nm technology node yield improvement
- 5.4. Implementation of cloud-native data analytics platforms for centralized lithography metrology insights
- 5.5. Development of in-line plasmonic scatterometry techniques for enhanced nanoscale overlay accuracy
- 5.6. Expansion of machine learning–based process control feedback loops in multi-patterning lithography metrology
- 5.7. Growth of automated wafer-level photomask inspection solutions leveraging deep neural networks for defect classification
- 6. Cumulative Impact of United States Tariffs 2025
- 7. Cumulative Impact of Artificial Intelligence 2025
- 8. Lithography Metrology Equipment Market, by Equipment Type
- 8.1. AFM
- 8.1.1. Contact AFM
- 8.1.2. Non Contact AFM
- 8.1.3. Tapping Mode AFM
- 8.2. CD-SEM
- 8.3. Scatterometry
- 8.3.1. Angle Resolved Scatterometry
- 8.3.2. Spectroscopic Scatterometry
- 8.4. X-ray Metrology
- 8.4.1. X-ray Diffraction
- 8.4.2. X-ray Reflectometry
- 9. Lithography Metrology Equipment Market, by Technique
- 9.1. Atomic Force Microscopy
- 9.2. Electron Beam Metrology
- 9.3. Optical Metrology
- 9.4. X-ray Metrology
- 10. Lithography Metrology Equipment Market, by Wavelength
- 10.1. Deep Ultraviolet
- 10.1.1. 157 nm
- 10.1.2. 193 nm
- 10.1.3. 248 nm
- 10.2. Extreme Ultraviolet
- 10.3. Infrared
- 10.3.1. Far Infrared
- 10.3.2. Mid Infrared
- 10.3.3. Near Infrared
- 10.4. Visible
- 11. Lithography Metrology Equipment Market, by Application
- 11.1. Data Storage
- 11.2. Flat Panel Display
- 11.3. MEMS
- 11.4. Semiconductor
- 12. Lithography Metrology Equipment Market, by Region
- 12.1. Americas
- 12.1.1. North America
- 12.1.2. Latin America
- 12.2. Europe, Middle East & Africa
- 12.2.1. Europe
- 12.2.2. Middle East
- 12.2.3. Africa
- 12.3. Asia-Pacific
- 13. Lithography Metrology Equipment Market, by Group
- 13.1. ASEAN
- 13.2. GCC
- 13.3. European Union
- 13.4. BRICS
- 13.5. G7
- 13.6. NATO
- 14. Lithography Metrology Equipment Market, by Country
- 14.1. United States
- 14.2. Canada
- 14.3. Mexico
- 14.4. Brazil
- 14.5. United Kingdom
- 14.6. Germany
- 14.7. France
- 14.8. Russia
- 14.9. Italy
- 14.10. Spain
- 14.11. China
- 14.12. India
- 14.13. Japan
- 14.14. Australia
- 14.15. South Korea
- 15. Competitive Landscape
- 15.1. Market Share Analysis, 2024
- 15.2. FPNV Positioning Matrix, 2024
- 15.3. Competitive Analysis
- 15.3.1. Advantest Corporation
- 15.3.2. Applied Materials, Inc.
- 15.3.3. ASML Holding NV
- 15.3.4. Camtek Ltd.
- 15.3.5. Canon Inc.
- 15.3.6. Carl Zeiss AG
- 15.3.7. DuPont de Nemours Inc.
- 15.3.8. EV Group
- 15.3.9. Hitachi High-Tech Corporation
- 15.3.10. HORIBA Ltd.
- 15.3.11. KLA Corporation
- 15.3.12. Lam Research Corporation
- 15.3.13. Lasertec Corporation
- 15.3.14. Nanometrics Inc.
- 15.3.15. Nikon Metrology Inc.
- 15.3.16. Nova Ltd.
- 15.3.17. Onto Innovation Inc.
- 15.3.18. SCREEN Semiconductor Solutions Co., Ltd.
- 15.3.19. Tokyo Electron Limited
- 15.3.20. Veeco Instruments Inc.
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