Internet of Things Chip Market by Chip Type (Microcontroller Unit, Rf Transceiver, Sensor Chip), Connectivity Technology (Bluetooth, Cellular, Lpwan), Application, End User, Deployment - Global Forecast 2025-2032
Description
The Internet of Things Chip Market was valued at USD 799.86 billion in 2024 and is projected to grow to USD 991.01 billion in 2025, with a CAGR of 23.84%, reaching USD 4,425.43 billion by 2032.
Navigating the Expanding Frontier of Internet of Things Chip Technology to Accelerate Connected Ecosystem Development and Drive Future Innovations
The Internet of Things chip market is at the forefront of a global technological revolution, acting as the foundational catalyst for a vast network of connected devices that span industries and geographies. Microcontrollers and system-on-chip solutions are increasingly embedded into everyday objects, transforming traditional processes into intelligent, data-driven experiences. From smart cities and industrial automation to healthcare monitoring and consumer wearables, these miniature semiconductors are reshaping how we interact with our environment.
As digital transformation initiatives gain momentum, the demand for high-performance, energy-efficient, and secure chipsets has never been greater. Innovations in materials science, semiconductor architecture, and fabrication techniques are enabling unprecedented functionality within ever-smaller footprints. Meanwhile, evolving communication standards such as 5G and LPWAN are expanding the reach of IoT deployments, creating new opportunities and complexities for chip manufacturers and device integrators alike. This introduction provides a comprehensive overview of the key market drivers, technological enablers, and strategic imperatives that define the current and future state of the Internet of Things chip ecosystem.
Unraveling the Transformative Technological Shifts Shaping the Internet of Things Chip Landscape to Empower Smarter, More Adaptive Solutions Across Industries
Over the past several years, the Internet of Things chip landscape has undergone transformative shifts driven by the convergence of miniaturization trends, advanced packaging techniques, and the integration of artificial intelligence acceleration cores directly on silicon. Energy-constrained applications have spurred breakthroughs in ultra-low-power design, enabling devices to operate for years on coin-cell batteries. Meanwhile, heterogeneous integration strategies-combining digital signal processing blocks, RF front ends, power management units, and embedded security modules on a single die-have drastically reduced system complexity and time to market.
On the connectivity front, the proliferation of 5G-enabled IoT devices alongside established LPWAN standards like LoRa and Sigfox has expanded network options for developers, encouraging more robust and scalable deployments. Security considerations have similarly matured; hardware-based root of trust architectures and on-chip cryptographic accelerators are becoming standard to counter increasingly sophisticated threat vectors. As a result, chip architectures are evolving from simple communication bridges to intelligent nodes capable of local data processing, predictive maintenance routines, and adaptive power management, setting the stage for the next wave of smart edge innovation.
Assessing the Widespread Effects of 2025 United States Tariffs on Global Internet of Things Chip Supply Chains, Cost Structures, and Strategic Realignments
The implementation of United States tariffs in 2025 has generated significant repercussions across the global Internet of Things chip supply chain. Manufacturers heavily reliant on cross-border semiconductor fabrication have faced elevated input costs that are gradually passed through to device assemblers and end customers. These increased duties have prompted some chip producers to reassess their sourcing strategies, fostering a gradual shift toward localized manufacturing partnerships in regions with favorable trade agreements.
As capital investment decisions are recalibrated, stakeholders are exploring regional diversification to mitigate tariff exposure. Companies that previously depended on single-source foundries are now negotiating dual or multi-regional production footprints to maintain cost discipline. Simultaneously, inventory management practices are evolving; strategic stockpiling and just-in-time ordering models are being balanced to minimize carrying costs while ensuring resilience against potential tariff escalations or supply disruptions. Collectively, these adaptations underscore the intricate relationship between trade policy and the economics of next-generation IoT chip production.
Delving into Critical Market Segmentation Patterns to Reveal Key Growth Drivers Across Chip Types, Connectivity Technologies, Applications, End Users, and Deployment Models
An in-depth examination of chip type segmentation reveals that microcontroller unit solutions span diverse performance tiers, encompassing 8-bit, 16-bit, and 32-bit architectures tailored to applications ranging from simple sensor hubs to complex control systems. RF transceiver offerings cover frequency bands from Sub-GHz through 2.4 GHz to high-band mmWave, addressing the connectivity requirements of both low-power wide-area networks and high-bandwidth short-range links. Sensor chips are further disaggregated into motion, pressure, temperature, and gas sensing modules, each optimized for specific environmental monitoring use cases. System-on-chip platforms bifurcate into application-specific and general-purpose variants, the latter subdivided into Arm-based and RISC-V-based cores to meet varying degrees of programmability and performance.
Connectivity technology segmentation illustrates parallel diversity. Bluetooth implementations are differentiated into Classic and Low Energy stacks, while cellular networks encompass 5G, LTE-M, and NB-IoT standards. LPWAN protocols such as LoRa and Sigfox accommodate extended range at minimal power budgets. Wi-Fi chipsets advance through the Wi-Fi 5, Wi-Fi 6, and Wi-Fi 6E specifications, all coexisting with Zigbee radio solutions for mesh network topologies. Application segmentation traverses sectors including automotive, consumer electronics, healthcare, industrial, and smart home, each imposing unique performance, security, and reliability demands on chip vendors. End users span automotive commercial vehicles and passenger cars, energy utilities covering oil & gas and smart grid infrastructures, healthcare diagnostic equipment and wearable devices, manufacturing use cases across automotive, discrete, and process operations, and retail environments integrating inventory management and point-of-sale systems. Finally, deployment modalities split between cloud-native models-private and public cloud environments-and edge solutions, from device-edge microcontrollers to on-premises edge servers, underscoring the importance of flexible architectures in distributed IoT ecosystems.
Comparative Analysis of Regional Dynamics Illuminating Market Opportunities and Challenges Across the Americas, Europe Middle East & Africa, and Asia-Pacific Internet of Things Chip Sectors
Regional dynamics in the Internet of Things chip market reveal distinct opportunity landscapes and competitive pressures. In the Americas, robust investment in industrial automation and smart agriculture has driven demand for high-reliability microcontrollers and LPWAN solutions. North American automotive OEMs are integrating advanced driver assistance systems that rely on heterogeneous SoC architectures, while Latin American utilities are piloting smart grid pilots that leverage cellular and LoRa connectivity.
Across Europe, Middle East and Africa, regulatory emphasis on data sovereignty and energy efficiency shapes chipset adoption. European initiatives around smart city deployments prioritize secure, standards-compliant modules, and Middle Eastern infrastructure projects demand scalable, ruggedized solutions. African remote monitoring applications underscore the need for low-power LPWAN and satellite-connectivity hybrids. In the Asia-Pacific corridor, aggressive 5G rollouts, burgeoning consumer electronics manufacturing, and expansive industrial automation programs are fueling rapid uptake of multi-protocol RF transceivers and AI-capable edge SoCs. These regional distinctions highlight the strategic importance of tailored product portfolios and localized support ecosystems.
Illuminating the Competitive Strategies and Technological Innovations of Leading Industry Players Driving Growth in the Internet of Things Chip Market
Leading semiconductor firms are leveraging differentiated strategies to maintain market leadership in the Internet of Things chip domain. Global technology giants prioritize the integration of AI inference engines alongside cryptographic hardware accelerators, targeting high-growth IoT verticals such as autonomous mobility and smart manufacturing. Established analog specialists are enhancing their mixed-signal portfolios to support next-generation sensor nodes with ultra-low noise and adaptive power regulation. Challenger startups are capitalizing on open-source architectures, particularly RISC-V cores, to deliver customizable, royalty-free SoC platforms that appeal to niche industrial and academic applications.
Collaborative engagements with ecosystem partners are also pivotal. Strategic alliances between device OEMs and cloud service providers accelerate the deployment of end-to-end solutions, while acquisitions of IP houses and fabless design houses expand addressable markets. Furthermore, foundry partnerships continue to evolve, with emerging players in Asia seeking to narrow the technology gap through advanced process nodes and specialized packaging techniques. Together, these competitive maneuvers underscore a dynamic environment where innovation velocity and ecosystem integration dictate long-term success.
Strategic Initiatives and Roadmap for Industry Leaders to Capitalize on Emerging Internet of Things Chip Trends, Navigate Risks, and Foster Sustainable Growth
Industry leaders should consider several strategic imperatives to navigate the evolving Internet of Things chip landscape successfully. First, diversifying manufacturing footprints across multiple foundries and regions can mitigate trade policy risks and optimize cost structures. Investing in joint development agreements for advanced packaging and wafer-level integration will accelerate time to market for compact multi-die assemblies. Second, prioritizing security by design-embedding hardware root of trust, secure boot protocols, and post-quantum cryptography support-will address mounting regulatory and end-user concerns.
Third, establishing robust partnerships within the IoT ecosystem, including sensor providers, connectivity module vendors, and cloud platforms, will facilitate seamless solution offerings. Emphasizing modular, software-defined architectures will enable rapid feature updates and customization, enhancing long-term product viability. Fourth, channeling R&D resources toward AI-enabled edge processing and energy-harvesting circuits will unlock new use cases in remote or power-constrained environments. By aligning product roadmaps with emerging industry standards and sustainability goals, organizations can differentiate themselves and capitalize on growth opportunities while maintaining resilience against market volatility.
Overview of the Rigorous Research Methodology Employed in Analyzing Market Trends, Data Collection, Validation Processes, and Analytical Frameworks
This report’s findings are grounded in a comprehensive research methodology that integrates both qualitative and quantitative analyses. Primary research efforts included in-depth interviews with industry stakeholders such as chip designers, foundry representatives, device manufacturers, and system integrators to capture real-world insights on technology adoption, investment priorities, and supply chain challenges. Secondary research involved an extensive review of public company filings, patent databases, conference proceedings, and government trade data to validate market trends and regulatory developments.
Data triangulation techniques ensured consistency between industry interviews and published sources, while expert panel reviews provided additional scrutiny of key assumptions and analytical models. Market segmentation frameworks were developed through iterative consultations with domain experts, aligning chip types, connectivity standards, application verticals, end-user categories, and deployment modes to reflect the current industrial taxonomy. Finally, scenario analysis explored the potential impact of macroeconomic fluctuations, tariff policy changes, and emerging technology breakthroughs on the Internet of Things chip market trajectory.
Synthesis of Key Findings and Future Outlook on Internet of Things Chip Evolution to Inform Decision-Making and Guide Next-Generation Technology Adoption
The Internet of Things chip market stands at a pivotal juncture, propelled by rapid innovation in device intelligence, connectivity protocols, and security architectures. As tariffs and trade dynamics continue to shape global supply chains, stakeholders who proactively adapt their manufacturing and sourcing strategies will be best positioned to unlock value. Segmentation insights underscore the necessity of versatile chip portfolios that span performance tiers, communication standards, and deployment environments.
Regional analysis highlights the imperative of localized support structures, ecosystem partnerships, and tailored product offerings to meet diverse regulatory and application demands. Leading companies are demonstrating that agility in R&D, strategic collaborations, and ecosystem orchestration are critical to sustaining competitive advantage. By embracing security by design, modular architectures, and AI-capable edge solutions, organizations can drive differentiation and capture emerging opportunities. This conclusion synthesizes the report’s core findings and sets the stage for informed decision-making as the market evolves toward greater complexity and integration.
Market Segmentation & Coverage
This research report categorizes to forecast the revenues and analyze trends in each of the following sub-segmentations:
Chip Type
Microcontroller Unit
16 Bit
32 Bit
8 Bit
Rf Transceiver
24 Ghz
Mmwave
Sub Ghz
Sensor Chip
Gas Sensor
Motion Sensor
Pressure Sensor
Temperature Sensor
System On Chip
Application Specific Soc
General Purpose Soc
Arm Based
Risc V
Connectivity Technology
Bluetooth
Bluetooth Classic
Bluetooth Low Energy
Cellular
5G
Lte M
Nb Iot
Lpwan
Lora
Sigfox
Wi Fi
Wi Fi 5
Wi Fi 6
Wi Fi 6E
Zigbee
Application
Automotive
Consumer Electronics
Healthcare
Industrial
Smart Home
End User
Automotive
Commercial Vehicles
Passenger Cars
Energy Utilities
Oil Gas
Smart Grid
Healthcare
Diagnostic Equipment
Wearables
Manufacturing
Automotive Manufacturing
Discrete Manufacturing
Process Manufacturing
Retail
Inventory Management
Pos Systems
Deployment
Cloud
Private Cloud
Public Cloud
Edge
Device Edge
On Premise Edge
This research report categorizes to forecast the revenues and analyze trends in each of the following sub-regions:
Americas
North America
United States
Canada
Mexico
Latin America
Brazil
Argentina
Chile
Colombia
Peru
Europe, Middle East & Africa
Europe
United Kingdom
Germany
France
Russia
Italy
Spain
Netherlands
Sweden
Poland
Switzerland
Middle East
United Arab Emirates
Saudi Arabia
Qatar
Turkey
Israel
Africa
South Africa
Nigeria
Egypt
Kenya
Asia-Pacific
China
India
Japan
Australia
South Korea
Indonesia
Thailand
Malaysia
Singapore
Taiwan
This research report categorizes to delves into recent significant developments and analyze trends in each of the following companies:
Qualcomm Incorporated
Intel Corporation
MediaTek Inc.
NXP Semiconductors N.V.
Texas Instruments Incorporated
Broadcom Inc.
STMicroelectronics N.V.
Infineon Technologies AG
Renesas Electronics Corporation
Microchip Technology Incorporated
Note: PDF & Excel + Online Access - 1 Year
Navigating the Expanding Frontier of Internet of Things Chip Technology to Accelerate Connected Ecosystem Development and Drive Future Innovations
The Internet of Things chip market is at the forefront of a global technological revolution, acting as the foundational catalyst for a vast network of connected devices that span industries and geographies. Microcontrollers and system-on-chip solutions are increasingly embedded into everyday objects, transforming traditional processes into intelligent, data-driven experiences. From smart cities and industrial automation to healthcare monitoring and consumer wearables, these miniature semiconductors are reshaping how we interact with our environment.
As digital transformation initiatives gain momentum, the demand for high-performance, energy-efficient, and secure chipsets has never been greater. Innovations in materials science, semiconductor architecture, and fabrication techniques are enabling unprecedented functionality within ever-smaller footprints. Meanwhile, evolving communication standards such as 5G and LPWAN are expanding the reach of IoT deployments, creating new opportunities and complexities for chip manufacturers and device integrators alike. This introduction provides a comprehensive overview of the key market drivers, technological enablers, and strategic imperatives that define the current and future state of the Internet of Things chip ecosystem.
Unraveling the Transformative Technological Shifts Shaping the Internet of Things Chip Landscape to Empower Smarter, More Adaptive Solutions Across Industries
Over the past several years, the Internet of Things chip landscape has undergone transformative shifts driven by the convergence of miniaturization trends, advanced packaging techniques, and the integration of artificial intelligence acceleration cores directly on silicon. Energy-constrained applications have spurred breakthroughs in ultra-low-power design, enabling devices to operate for years on coin-cell batteries. Meanwhile, heterogeneous integration strategies-combining digital signal processing blocks, RF front ends, power management units, and embedded security modules on a single die-have drastically reduced system complexity and time to market.
On the connectivity front, the proliferation of 5G-enabled IoT devices alongside established LPWAN standards like LoRa and Sigfox has expanded network options for developers, encouraging more robust and scalable deployments. Security considerations have similarly matured; hardware-based root of trust architectures and on-chip cryptographic accelerators are becoming standard to counter increasingly sophisticated threat vectors. As a result, chip architectures are evolving from simple communication bridges to intelligent nodes capable of local data processing, predictive maintenance routines, and adaptive power management, setting the stage for the next wave of smart edge innovation.
Assessing the Widespread Effects of 2025 United States Tariffs on Global Internet of Things Chip Supply Chains, Cost Structures, and Strategic Realignments
The implementation of United States tariffs in 2025 has generated significant repercussions across the global Internet of Things chip supply chain. Manufacturers heavily reliant on cross-border semiconductor fabrication have faced elevated input costs that are gradually passed through to device assemblers and end customers. These increased duties have prompted some chip producers to reassess their sourcing strategies, fostering a gradual shift toward localized manufacturing partnerships in regions with favorable trade agreements.
As capital investment decisions are recalibrated, stakeholders are exploring regional diversification to mitigate tariff exposure. Companies that previously depended on single-source foundries are now negotiating dual or multi-regional production footprints to maintain cost discipline. Simultaneously, inventory management practices are evolving; strategic stockpiling and just-in-time ordering models are being balanced to minimize carrying costs while ensuring resilience against potential tariff escalations or supply disruptions. Collectively, these adaptations underscore the intricate relationship between trade policy and the economics of next-generation IoT chip production.
Delving into Critical Market Segmentation Patterns to Reveal Key Growth Drivers Across Chip Types, Connectivity Technologies, Applications, End Users, and Deployment Models
An in-depth examination of chip type segmentation reveals that microcontroller unit solutions span diverse performance tiers, encompassing 8-bit, 16-bit, and 32-bit architectures tailored to applications ranging from simple sensor hubs to complex control systems. RF transceiver offerings cover frequency bands from Sub-GHz through 2.4 GHz to high-band mmWave, addressing the connectivity requirements of both low-power wide-area networks and high-bandwidth short-range links. Sensor chips are further disaggregated into motion, pressure, temperature, and gas sensing modules, each optimized for specific environmental monitoring use cases. System-on-chip platforms bifurcate into application-specific and general-purpose variants, the latter subdivided into Arm-based and RISC-V-based cores to meet varying degrees of programmability and performance.
Connectivity technology segmentation illustrates parallel diversity. Bluetooth implementations are differentiated into Classic and Low Energy stacks, while cellular networks encompass 5G, LTE-M, and NB-IoT standards. LPWAN protocols such as LoRa and Sigfox accommodate extended range at minimal power budgets. Wi-Fi chipsets advance through the Wi-Fi 5, Wi-Fi 6, and Wi-Fi 6E specifications, all coexisting with Zigbee radio solutions for mesh network topologies. Application segmentation traverses sectors including automotive, consumer electronics, healthcare, industrial, and smart home, each imposing unique performance, security, and reliability demands on chip vendors. End users span automotive commercial vehicles and passenger cars, energy utilities covering oil & gas and smart grid infrastructures, healthcare diagnostic equipment and wearable devices, manufacturing use cases across automotive, discrete, and process operations, and retail environments integrating inventory management and point-of-sale systems. Finally, deployment modalities split between cloud-native models-private and public cloud environments-and edge solutions, from device-edge microcontrollers to on-premises edge servers, underscoring the importance of flexible architectures in distributed IoT ecosystems.
Comparative Analysis of Regional Dynamics Illuminating Market Opportunities and Challenges Across the Americas, Europe Middle East & Africa, and Asia-Pacific Internet of Things Chip Sectors
Regional dynamics in the Internet of Things chip market reveal distinct opportunity landscapes and competitive pressures. In the Americas, robust investment in industrial automation and smart agriculture has driven demand for high-reliability microcontrollers and LPWAN solutions. North American automotive OEMs are integrating advanced driver assistance systems that rely on heterogeneous SoC architectures, while Latin American utilities are piloting smart grid pilots that leverage cellular and LoRa connectivity.
Across Europe, Middle East and Africa, regulatory emphasis on data sovereignty and energy efficiency shapes chipset adoption. European initiatives around smart city deployments prioritize secure, standards-compliant modules, and Middle Eastern infrastructure projects demand scalable, ruggedized solutions. African remote monitoring applications underscore the need for low-power LPWAN and satellite-connectivity hybrids. In the Asia-Pacific corridor, aggressive 5G rollouts, burgeoning consumer electronics manufacturing, and expansive industrial automation programs are fueling rapid uptake of multi-protocol RF transceivers and AI-capable edge SoCs. These regional distinctions highlight the strategic importance of tailored product portfolios and localized support ecosystems.
Illuminating the Competitive Strategies and Technological Innovations of Leading Industry Players Driving Growth in the Internet of Things Chip Market
Leading semiconductor firms are leveraging differentiated strategies to maintain market leadership in the Internet of Things chip domain. Global technology giants prioritize the integration of AI inference engines alongside cryptographic hardware accelerators, targeting high-growth IoT verticals such as autonomous mobility and smart manufacturing. Established analog specialists are enhancing their mixed-signal portfolios to support next-generation sensor nodes with ultra-low noise and adaptive power regulation. Challenger startups are capitalizing on open-source architectures, particularly RISC-V cores, to deliver customizable, royalty-free SoC platforms that appeal to niche industrial and academic applications.
Collaborative engagements with ecosystem partners are also pivotal. Strategic alliances between device OEMs and cloud service providers accelerate the deployment of end-to-end solutions, while acquisitions of IP houses and fabless design houses expand addressable markets. Furthermore, foundry partnerships continue to evolve, with emerging players in Asia seeking to narrow the technology gap through advanced process nodes and specialized packaging techniques. Together, these competitive maneuvers underscore a dynamic environment where innovation velocity and ecosystem integration dictate long-term success.
Strategic Initiatives and Roadmap for Industry Leaders to Capitalize on Emerging Internet of Things Chip Trends, Navigate Risks, and Foster Sustainable Growth
Industry leaders should consider several strategic imperatives to navigate the evolving Internet of Things chip landscape successfully. First, diversifying manufacturing footprints across multiple foundries and regions can mitigate trade policy risks and optimize cost structures. Investing in joint development agreements for advanced packaging and wafer-level integration will accelerate time to market for compact multi-die assemblies. Second, prioritizing security by design-embedding hardware root of trust, secure boot protocols, and post-quantum cryptography support-will address mounting regulatory and end-user concerns.
Third, establishing robust partnerships within the IoT ecosystem, including sensor providers, connectivity module vendors, and cloud platforms, will facilitate seamless solution offerings. Emphasizing modular, software-defined architectures will enable rapid feature updates and customization, enhancing long-term product viability. Fourth, channeling R&D resources toward AI-enabled edge processing and energy-harvesting circuits will unlock new use cases in remote or power-constrained environments. By aligning product roadmaps with emerging industry standards and sustainability goals, organizations can differentiate themselves and capitalize on growth opportunities while maintaining resilience against market volatility.
Overview of the Rigorous Research Methodology Employed in Analyzing Market Trends, Data Collection, Validation Processes, and Analytical Frameworks
This report’s findings are grounded in a comprehensive research methodology that integrates both qualitative and quantitative analyses. Primary research efforts included in-depth interviews with industry stakeholders such as chip designers, foundry representatives, device manufacturers, and system integrators to capture real-world insights on technology adoption, investment priorities, and supply chain challenges. Secondary research involved an extensive review of public company filings, patent databases, conference proceedings, and government trade data to validate market trends and regulatory developments.
Data triangulation techniques ensured consistency between industry interviews and published sources, while expert panel reviews provided additional scrutiny of key assumptions and analytical models. Market segmentation frameworks were developed through iterative consultations with domain experts, aligning chip types, connectivity standards, application verticals, end-user categories, and deployment modes to reflect the current industrial taxonomy. Finally, scenario analysis explored the potential impact of macroeconomic fluctuations, tariff policy changes, and emerging technology breakthroughs on the Internet of Things chip market trajectory.
Synthesis of Key Findings and Future Outlook on Internet of Things Chip Evolution to Inform Decision-Making and Guide Next-Generation Technology Adoption
The Internet of Things chip market stands at a pivotal juncture, propelled by rapid innovation in device intelligence, connectivity protocols, and security architectures. As tariffs and trade dynamics continue to shape global supply chains, stakeholders who proactively adapt their manufacturing and sourcing strategies will be best positioned to unlock value. Segmentation insights underscore the necessity of versatile chip portfolios that span performance tiers, communication standards, and deployment environments.
Regional analysis highlights the imperative of localized support structures, ecosystem partnerships, and tailored product offerings to meet diverse regulatory and application demands. Leading companies are demonstrating that agility in R&D, strategic collaborations, and ecosystem orchestration are critical to sustaining competitive advantage. By embracing security by design, modular architectures, and AI-capable edge solutions, organizations can drive differentiation and capture emerging opportunities. This conclusion synthesizes the report’s core findings and sets the stage for informed decision-making as the market evolves toward greater complexity and integration.
Market Segmentation & Coverage
This research report categorizes to forecast the revenues and analyze trends in each of the following sub-segmentations:
Chip Type
Microcontroller Unit
16 Bit
32 Bit
8 Bit
Rf Transceiver
24 Ghz
Mmwave
Sub Ghz
Sensor Chip
Gas Sensor
Motion Sensor
Pressure Sensor
Temperature Sensor
System On Chip
Application Specific Soc
General Purpose Soc
Arm Based
Risc V
Connectivity Technology
Bluetooth
Bluetooth Classic
Bluetooth Low Energy
Cellular
5G
Lte M
Nb Iot
Lpwan
Lora
Sigfox
Wi Fi
Wi Fi 5
Wi Fi 6
Wi Fi 6E
Zigbee
Application
Automotive
Consumer Electronics
Healthcare
Industrial
Smart Home
End User
Automotive
Commercial Vehicles
Passenger Cars
Energy Utilities
Oil Gas
Smart Grid
Healthcare
Diagnostic Equipment
Wearables
Manufacturing
Automotive Manufacturing
Discrete Manufacturing
Process Manufacturing
Retail
Inventory Management
Pos Systems
Deployment
Cloud
Private Cloud
Public Cloud
Edge
Device Edge
On Premise Edge
This research report categorizes to forecast the revenues and analyze trends in each of the following sub-regions:
Americas
North America
United States
Canada
Mexico
Latin America
Brazil
Argentina
Chile
Colombia
Peru
Europe, Middle East & Africa
Europe
United Kingdom
Germany
France
Russia
Italy
Spain
Netherlands
Sweden
Poland
Switzerland
Middle East
United Arab Emirates
Saudi Arabia
Qatar
Turkey
Israel
Africa
South Africa
Nigeria
Egypt
Kenya
Asia-Pacific
China
India
Japan
Australia
South Korea
Indonesia
Thailand
Malaysia
Singapore
Taiwan
This research report categorizes to delves into recent significant developments and analyze trends in each of the following companies:
Qualcomm Incorporated
Intel Corporation
MediaTek Inc.
NXP Semiconductors N.V.
Texas Instruments Incorporated
Broadcom Inc.
STMicroelectronics N.V.
Infineon Technologies AG
Renesas Electronics Corporation
Microchip Technology Incorporated
Note: PDF & Excel + Online Access - 1 Year
Table of Contents
182 Pages
- 1. Preface
- 1.1. Objectives of the Study
- 1.2. Market Segmentation & Coverage
- 1.3. Years Considered for the Study
- 1.4. Currency & Pricing
- 1.5. Language
- 1.6. Stakeholders
- 2. Research Methodology
- 3. Executive Summary
- 4. Market Overview
- 5. Market Insights
- 5.1. High performance heterogeneous multicore architectures optimizing edge AI for smart sensors
- 5.2. Ultra low power energy harvesting chip designs enabling maintenance free IoT deployments
- 5.3. Integration of secure hardware root of trust modules to prevent firmware tampering in connected devices
- 5.4. Adoption of RISC-V based open source processors driving customizable IoT chip solutions
- 5.5. Advanced mmWave connectivity features embedded in IoT chips to support next generation 5G networks
- 5.6. Use of flexible and printable semiconductor materials for conformal IoT sensor applications
- 5.7. Incorporation of built in machine learning accelerators for real time anomaly detection on device
- 6. Cumulative Impact of United States Tariffs 2025
- 7. Cumulative Impact of Artificial Intelligence 2025
- 8. Internet of Things Chip Market, by Chip Type
- 8.1. Microcontroller Unit
- 8.1.1. 16 Bit
- 8.1.2. 32 Bit
- 8.1.3. 8 Bit
- 8.2. Rf Transceiver
- 8.2.1. 24 Ghz
- 8.2.2. Mmwave
- 8.2.3. Sub Ghz
- 8.3. Sensor Chip
- 8.3.1. Gas Sensor
- 8.3.2. Motion Sensor
- 8.3.3. Pressure Sensor
- 8.3.4. Temperature Sensor
- 8.4. System On Chip
- 8.4.1. Application Specific Soc
- 8.4.2. General Purpose Soc
- 8.4.2.1. Arm Based
- 8.4.2.2. Risc V
- 9. Internet of Things Chip Market, by Connectivity Technology
- 9.1. Bluetooth
- 9.1.1. Bluetooth Classic
- 9.1.2. Bluetooth Low Energy
- 9.2. Cellular
- 9.2.1. 5G
- 9.2.2. Lte M
- 9.2.3. Nb Iot
- 9.3. Lpwan
- 9.3.1. Lora
- 9.3.2. Sigfox
- 9.4. Wi Fi
- 9.4.1. Wi Fi 5
- 9.4.2. Wi Fi 6
- 9.4.3. Wi Fi 6E
- 9.5. Zigbee
- 10. Internet of Things Chip Market, by Application
- 10.1. Automotive
- 10.2. Consumer Electronics
- 10.3. Healthcare
- 10.4. Industrial
- 10.5. Smart Home
- 11. Internet of Things Chip Market, by End User
- 11.1. Automotive
- 11.1.1. Commercial Vehicles
- 11.1.2. Passenger Cars
- 11.2. Energy Utilities
- 11.2.1. Oil Gas
- 11.2.2. Smart Grid
- 11.3. Healthcare
- 11.3.1. Diagnostic Equipment
- 11.3.2. Wearables
- 11.4. Manufacturing
- 11.4.1. Automotive Manufacturing
- 11.4.2. Discrete Manufacturing
- 11.4.3. Process Manufacturing
- 11.5. Retail
- 11.5.1. Inventory Management
- 11.5.2. Pos Systems
- 12. Internet of Things Chip Market, by Deployment
- 12.1. Cloud
- 12.1.1. Private Cloud
- 12.1.2. Public Cloud
- 12.2. Edge
- 12.2.1. Device Edge
- 12.2.2. On Premise Edge
- 13. Internet of Things Chip Market, by Region
- 13.1. Americas
- 13.1.1. North America
- 13.1.2. Latin America
- 13.2. Europe, Middle East & Africa
- 13.2.1. Europe
- 13.2.2. Middle East
- 13.2.3. Africa
- 13.3. Asia-Pacific
- 14. Internet of Things Chip Market, by Group
- 14.1. ASEAN
- 14.2. GCC
- 14.3. European Union
- 14.4. BRICS
- 14.5. G7
- 14.6. NATO
- 15. Internet of Things Chip Market, by Country
- 15.1. United States
- 15.2. Canada
- 15.3. Mexico
- 15.4. Brazil
- 15.5. United Kingdom
- 15.6. Germany
- 15.7. France
- 15.8. Russia
- 15.9. Italy
- 15.10. Spain
- 15.11. China
- 15.12. India
- 15.13. Japan
- 15.14. Australia
- 15.15. South Korea
- 16. Competitive Landscape
- 16.1. Market Share Analysis, 2024
- 16.2. FPNV Positioning Matrix, 2024
- 16.3. Competitive Analysis
- 16.3.1. Qualcomm Incorporated
- 16.3.2. Intel Corporation
- 16.3.3. MediaTek Inc.
- 16.3.4. NXP Semiconductors N.V.
- 16.3.5. Texas Instruments Incorporated
- 16.3.6. Broadcom Inc.
- 16.3.7. STMicroelectronics N.V.
- 16.3.8. Infineon Technologies AG
- 16.3.9. Renesas Electronics Corporation
- 16.3.10. Microchip Technology Incorporated
Pricing
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