Integrated Passive Devices Market by Device Type (Baluns, Capacitor, Couplers), Material (Glass-based IPD, Silicon-based IPD), Application, End-User Industry - Global Forecast 2025-2032
Description
The Integrated Passive Devices Market was valued at USD 1.48 billion in 2024 and is projected to grow to USD 1.59 billion in 2025, with a CAGR of 8.22%, reaching USD 2.79 billion by 2032.
A strategic orientation to integrated passive devices that synthesizes technical fundamentals with market-relevant implications for product and procurement leaders
The integrated passive devices sector sits at the intersection of miniaturization, performance optimization, and system-level integration, and it has steadily become a central enabler of compact, high-frequency, and low-power electronic subsystems. As end products demand smaller footprints and higher reliability, IPD technology responds by embedding passive functionality directly into substrates and semiconductor platforms, thereby reducing assembly complexity and improving electrical performance. This report opens with a focused orientation that clarifies the core device families, material platforms, and application contexts that define contemporary IPD design and manufacturing.
Moving from fundamentals to strategic relevance, the introduction frames why IPDs matter to product teams, procurement officers, and systems architects. It lays out key technical differentiators such as parasitic reduction, thermal behavior, and integration density while explaining how these translate into system-level advantages for wireless front-ends, automotive electronics, and high-reliability medical devices. In addition, the introduction highlights the value chain dynamics from wafer fabrication to assembly and test, and it sets the stage for the subsequent sections by identifying the critical technology and market drivers that will shape supplier strategies and buyer adoption in the near term.
How materials innovation and system-level integration are redefining supplier roles and accelerating adoption of integrated passive device architectures
The landscape for integrated passive devices is undergoing transformative shifts driven by advances in materials science, substrate engineering, and system architecture. Glass- and silicon-based integration approaches have matured in parallel, enabling designers to trade off between performance characteristics and cost profiles with unprecedented precision. As a result, companies are no longer constrained to incremental component substitution; they are reimagining module architectures to exploit IPD-enabled reductions in parasitic losses and interconnect complexity. In turn, this shift allows faster time-to-market for high-frequency and mixed-signal modules while opening new pathways for reliability improvements under harsh environmental conditions.
Concurrently, the push for functional consolidation is reshaping supplier and OEM relationships. Whereas previously passive components were sourced as discrete items and managed through multi-tier procurement chains, IPD adoption encourages closer collaboration between substrate suppliers, design houses, and final integrators. This evolution affects ecosystem roles and creates opportunities for differentiated service offerings such as co-design partnerships and just-in-time wafer supply. Moreover, regulatory and standards activity is nudging system designers toward architectures that prioritize electromagnetic compatibility and power efficiency, reinforcing the strategic value of integrated passive solutions in next-generation electronic systems.
Assessing how recent tariff policies are reshaping sourcing strategies and prompting manufacturers to diversify production footprints for supply chain resilience
Policy shifts in international trade and tariff regimes are an important external influence on supply chain resilience and sourcing decisions in the integrated passive device domain. Recent adjustments to tariffs and trade policies have prompted device manufacturers and electronics assemblers to reassess supplier footprints and near-term procurement strategies. Across the ecosystem, firms are evaluating the cumulative operational impact of tariff measures on component routing, production scheduling, and total landed cost, and they are exploring mitigation tactics that preserve continuity for high-reliability applications.
In response, many companies have prioritized supplier diversification and localized capacity investments to reduce exposure to tariff volatility. Capital allocation has shifted toward flexible manufacturing arrangements and regional distribution hubs, which help smooth lead times and diminish the risk of abrupt cost increases tied to cross-border levies. Furthermore, regulatory uncertainty has intensified interest in dual-sourcing strategies and in qualifying alternative material platforms or fabrication partners. While such adjustments increase short-term planning complexity, they also strengthen long-term supply chain robustness and enable manufacturers to meet stringent performance and compliance requirements despite an evolving tariff landscape.
Detailed segmentation insights that connect device types, material platforms, applications, and end-user industries to practical design and procurement decisions
A granular view of the integrated passive devices landscape recognizes multiple axes of segmentation that influence technology choices and commercial outcomes. When analysts examine device type distinctions, they consider baluns, capacitors, couplers, diplexers, inductors, and resistors because each category imposes specific design constraints, reliability requirements, and test protocols that inform fabrication and packaging approaches. By contrast, material differentiation between glass-based IPD and silicon-based IPD plays a pivotal role in thermal behavior, dielectric properties, and integration compatibility, which in turn affects application suitability and long-term performance trade-offs.
Equally important, application-centric segmentation sheds light on where IPDs deliver the most value: digital and mixed signal circuits benefit from reduced parasitics and tighter impedance control; EMS and EMI protection solutions leverage integrated filtering and shielding to meet regulatory mandates; LED lighting systems exploit compact passive networks for power management; and radio frequency protection requires precision passive elements for front-end stability. Finally, end-user industry segmentation clarifies demand drivers and qualification cycles across aerospace and defense, automotive, consumer electronics, healthcare and lifesciences, and telecommunication, each of which imposes unique certification, reliability, and volume expectations that shape commercialization pathways.
Regional dynamics and strategic considerations that drive manufacturing footprints, qualification cycles, and supplier selection across global markets
Geographic dynamics significantly influence technology diffusion, investment patterns, and supply chain architectures in the integrated passive devices sector. In the Americas, OEMs and defense contractors emphasize rapid prototyping, system validation, and high-reliability qualification, which drives regional demand for advanced integration and customized passive networks. Meanwhile, the Europe, Middle East & Africa landscape features a mix of high-end industrial and automotive customers with rigorous standards for electromagnetic compatibility and thermal management, promoting innovations in both material science and testing protocols. Asia-Pacific remains a focal point for scaling manufacturing capacity and for close coupling between substrate producers and electronics assemblers, supported by extensive supplier networks and well-established contract manufacturing ecosystems.
These regional distinctions affect sourcing strategies, time-to-market expectations, and investment choices. For example, design centers located near advanced manufacturing clusters can iterate more rapidly on substrate-process co-optimization, whereas regions with concentrated end markets may prioritize localized qualification labs and application-specific validation services. Consequently, firms seeking global reach weigh the advantages of proximity to customers against the operational efficiencies of centralized production, and they often adopt hybrid models that combine regional responsiveness with the economies of scale afforded by distributed manufacturing footprints.
How technical differentiation, supply chain resilience, and value-added services define competitive advantage among integrated passive device providers
Competitive positioning in the integrated passive devices ecosystem reflects capabilities across design-for-manufacturability, substrate engineering, and end-to-end test regimes. Leading firms differentiate through integrated design services, advanced material partnerships, and investments in process control that lower variability and improve yield for complex passive networks. In addition, companies that offer robust reliability testing, failure analysis, and qualification pipelines gain a competitive edge with customers in sectors where certification and longevity are mission-critical. Collaboration between IPD specialists and systems integrators remains a core source of innovation, enabling joint roadmaps that align component capabilities with module- and system-level performance goals.
Strategic partnerships for supply chain resilience also shape competitive dynamics. Firms that cultivate multi-regional fabrication options and maintain long-term material supply agreements mitigate disruption risk and can offer predictable lead times to OEMs. Moreover, value-added services such as co-development programs, rapid prototyping support, and customized packaging solutions strengthen customer relationships and create higher switching costs. As the sector matures, the most successful players blend technical excellence with flexible commercial models, positioning themselves as trusted partners for complex, high-reliability electronic programs.
Practical strategic actions for leaders to accelerate IPD adoption, secure resilient supply chains, and institutionalize cross-functional design and qualification practices
Industry leaders must take decisive, actionable steps to capture the benefits of integrated passive devices while managing implementation risk. First, they should prioritize cross-functional co-design between system architects and substrate vendors to accelerate integration cycles and to tailor passive networks for target thermal and electromagnetic environments. Building these collaborations early reduces redesign frequency and shortens qualification timelines. Second, executives should diversify production footprints by qualifying multiple fabrication partners across regions to hedge against geopolitical or tariff-driven disruptions while preserving the ability to scale rapidly in response to demand shifts.
Third, investing in standardized qualification and test suites will streamline certification across verticals such as automotive and aerospace, and it will reduce customer friction during procurement. Fourth, companies should adopt product roadmaps that explicitly evaluate glass-based and silicon-based material trade-offs for each application, creating clear technology decision matrices to guide selection. Finally, leaders ought to explore commercial models that combine core product sales with co-development agreements and post-sale support offerings, thereby deepening customer engagement and creating recurring revenue streams that reinforce competitive positioning.
A transparent mixed-methods research methodology integrating primary stakeholder interviews, technical literature review, and standards analysis to support robust insights
The research approach deployed to assemble this analysis combines primary engagement with industry participants and rigorous secondary synthesis of open technical sources, standards documentation, and regulatory guidance. Primary methods included structured interviews with design engineers, procurement leaders, and fabrication specialists to capture first-hand perspectives on technology adoption drivers, reliability expectations, and supply chain constraints. These conversations informed the thematic framing and allowed the analysis to surface real-world trade-offs that organizations confront when integrating passive elements into complex electronic assemblies.
Secondary research complemented primary insights through careful review of peer-reviewed literature, patent filings, materials datasheets, and vendor technical notes to validate performance characteristics and manufacturing considerations. Where applicable, industry standards and certification protocols were examined to ensure the analysis addresses compliance requirements relevant to aerospace, automotive, medical, and telecommunications applications. Throughout, the methodology emphasized triangulation of multiple independent information sources to enhance the robustness of insights and to reduce single-source bias, and it documented key assumptions to support transparent interpretation of findings.
Concluding synthesis that ties technical promise to operational realities and prescribes oriented approaches for pragmatic adoption of integrated passive devices
Integrated passive devices represent a strategic lever for electronics designers seeking improved density, reliability, and electromagnetic performance in compact systems. Across device types and material platforms, IPD solutions enable meaningful system-level benefits that translate into simpler assembly flows and, in many cases, improved performance for sensitive RF and mixed-signal circuits. At the same time, adoption requires careful assessment of qualification pathways, supply chain resilience, and cost-to-benefit trade-offs, particularly in regulated end markets where certification timelines can be substantial.
Looking ahead, stakeholders who align technical roadmaps with regional manufacturing strategies and who invest in cross-functional co-design will capture the most value from IPD technologies. While no single approach fits all applications, disciplined evaluation against application-specific requirements-combined with flexible sourcing, standardized testing, and collaborative supplier relationships-will position firms to exploit the full potential of integrated passive devices. Ultimately, the technology’s promise lies in its ability to simplify complex systems while meeting the reliability and performance standards that modern electronics demand.
Note: PDF & Excel + Online Access - 1 Year
A strategic orientation to integrated passive devices that synthesizes technical fundamentals with market-relevant implications for product and procurement leaders
The integrated passive devices sector sits at the intersection of miniaturization, performance optimization, and system-level integration, and it has steadily become a central enabler of compact, high-frequency, and low-power electronic subsystems. As end products demand smaller footprints and higher reliability, IPD technology responds by embedding passive functionality directly into substrates and semiconductor platforms, thereby reducing assembly complexity and improving electrical performance. This report opens with a focused orientation that clarifies the core device families, material platforms, and application contexts that define contemporary IPD design and manufacturing.
Moving from fundamentals to strategic relevance, the introduction frames why IPDs matter to product teams, procurement officers, and systems architects. It lays out key technical differentiators such as parasitic reduction, thermal behavior, and integration density while explaining how these translate into system-level advantages for wireless front-ends, automotive electronics, and high-reliability medical devices. In addition, the introduction highlights the value chain dynamics from wafer fabrication to assembly and test, and it sets the stage for the subsequent sections by identifying the critical technology and market drivers that will shape supplier strategies and buyer adoption in the near term.
How materials innovation and system-level integration are redefining supplier roles and accelerating adoption of integrated passive device architectures
The landscape for integrated passive devices is undergoing transformative shifts driven by advances in materials science, substrate engineering, and system architecture. Glass- and silicon-based integration approaches have matured in parallel, enabling designers to trade off between performance characteristics and cost profiles with unprecedented precision. As a result, companies are no longer constrained to incremental component substitution; they are reimagining module architectures to exploit IPD-enabled reductions in parasitic losses and interconnect complexity. In turn, this shift allows faster time-to-market for high-frequency and mixed-signal modules while opening new pathways for reliability improvements under harsh environmental conditions.
Concurrently, the push for functional consolidation is reshaping supplier and OEM relationships. Whereas previously passive components were sourced as discrete items and managed through multi-tier procurement chains, IPD adoption encourages closer collaboration between substrate suppliers, design houses, and final integrators. This evolution affects ecosystem roles and creates opportunities for differentiated service offerings such as co-design partnerships and just-in-time wafer supply. Moreover, regulatory and standards activity is nudging system designers toward architectures that prioritize electromagnetic compatibility and power efficiency, reinforcing the strategic value of integrated passive solutions in next-generation electronic systems.
Assessing how recent tariff policies are reshaping sourcing strategies and prompting manufacturers to diversify production footprints for supply chain resilience
Policy shifts in international trade and tariff regimes are an important external influence on supply chain resilience and sourcing decisions in the integrated passive device domain. Recent adjustments to tariffs and trade policies have prompted device manufacturers and electronics assemblers to reassess supplier footprints and near-term procurement strategies. Across the ecosystem, firms are evaluating the cumulative operational impact of tariff measures on component routing, production scheduling, and total landed cost, and they are exploring mitigation tactics that preserve continuity for high-reliability applications.
In response, many companies have prioritized supplier diversification and localized capacity investments to reduce exposure to tariff volatility. Capital allocation has shifted toward flexible manufacturing arrangements and regional distribution hubs, which help smooth lead times and diminish the risk of abrupt cost increases tied to cross-border levies. Furthermore, regulatory uncertainty has intensified interest in dual-sourcing strategies and in qualifying alternative material platforms or fabrication partners. While such adjustments increase short-term planning complexity, they also strengthen long-term supply chain robustness and enable manufacturers to meet stringent performance and compliance requirements despite an evolving tariff landscape.
Detailed segmentation insights that connect device types, material platforms, applications, and end-user industries to practical design and procurement decisions
A granular view of the integrated passive devices landscape recognizes multiple axes of segmentation that influence technology choices and commercial outcomes. When analysts examine device type distinctions, they consider baluns, capacitors, couplers, diplexers, inductors, and resistors because each category imposes specific design constraints, reliability requirements, and test protocols that inform fabrication and packaging approaches. By contrast, material differentiation between glass-based IPD and silicon-based IPD plays a pivotal role in thermal behavior, dielectric properties, and integration compatibility, which in turn affects application suitability and long-term performance trade-offs.
Equally important, application-centric segmentation sheds light on where IPDs deliver the most value: digital and mixed signal circuits benefit from reduced parasitics and tighter impedance control; EMS and EMI protection solutions leverage integrated filtering and shielding to meet regulatory mandates; LED lighting systems exploit compact passive networks for power management; and radio frequency protection requires precision passive elements for front-end stability. Finally, end-user industry segmentation clarifies demand drivers and qualification cycles across aerospace and defense, automotive, consumer electronics, healthcare and lifesciences, and telecommunication, each of which imposes unique certification, reliability, and volume expectations that shape commercialization pathways.
Regional dynamics and strategic considerations that drive manufacturing footprints, qualification cycles, and supplier selection across global markets
Geographic dynamics significantly influence technology diffusion, investment patterns, and supply chain architectures in the integrated passive devices sector. In the Americas, OEMs and defense contractors emphasize rapid prototyping, system validation, and high-reliability qualification, which drives regional demand for advanced integration and customized passive networks. Meanwhile, the Europe, Middle East & Africa landscape features a mix of high-end industrial and automotive customers with rigorous standards for electromagnetic compatibility and thermal management, promoting innovations in both material science and testing protocols. Asia-Pacific remains a focal point for scaling manufacturing capacity and for close coupling between substrate producers and electronics assemblers, supported by extensive supplier networks and well-established contract manufacturing ecosystems.
These regional distinctions affect sourcing strategies, time-to-market expectations, and investment choices. For example, design centers located near advanced manufacturing clusters can iterate more rapidly on substrate-process co-optimization, whereas regions with concentrated end markets may prioritize localized qualification labs and application-specific validation services. Consequently, firms seeking global reach weigh the advantages of proximity to customers against the operational efficiencies of centralized production, and they often adopt hybrid models that combine regional responsiveness with the economies of scale afforded by distributed manufacturing footprints.
How technical differentiation, supply chain resilience, and value-added services define competitive advantage among integrated passive device providers
Competitive positioning in the integrated passive devices ecosystem reflects capabilities across design-for-manufacturability, substrate engineering, and end-to-end test regimes. Leading firms differentiate through integrated design services, advanced material partnerships, and investments in process control that lower variability and improve yield for complex passive networks. In addition, companies that offer robust reliability testing, failure analysis, and qualification pipelines gain a competitive edge with customers in sectors where certification and longevity are mission-critical. Collaboration between IPD specialists and systems integrators remains a core source of innovation, enabling joint roadmaps that align component capabilities with module- and system-level performance goals.
Strategic partnerships for supply chain resilience also shape competitive dynamics. Firms that cultivate multi-regional fabrication options and maintain long-term material supply agreements mitigate disruption risk and can offer predictable lead times to OEMs. Moreover, value-added services such as co-development programs, rapid prototyping support, and customized packaging solutions strengthen customer relationships and create higher switching costs. As the sector matures, the most successful players blend technical excellence with flexible commercial models, positioning themselves as trusted partners for complex, high-reliability electronic programs.
Practical strategic actions for leaders to accelerate IPD adoption, secure resilient supply chains, and institutionalize cross-functional design and qualification practices
Industry leaders must take decisive, actionable steps to capture the benefits of integrated passive devices while managing implementation risk. First, they should prioritize cross-functional co-design between system architects and substrate vendors to accelerate integration cycles and to tailor passive networks for target thermal and electromagnetic environments. Building these collaborations early reduces redesign frequency and shortens qualification timelines. Second, executives should diversify production footprints by qualifying multiple fabrication partners across regions to hedge against geopolitical or tariff-driven disruptions while preserving the ability to scale rapidly in response to demand shifts.
Third, investing in standardized qualification and test suites will streamline certification across verticals such as automotive and aerospace, and it will reduce customer friction during procurement. Fourth, companies should adopt product roadmaps that explicitly evaluate glass-based and silicon-based material trade-offs for each application, creating clear technology decision matrices to guide selection. Finally, leaders ought to explore commercial models that combine core product sales with co-development agreements and post-sale support offerings, thereby deepening customer engagement and creating recurring revenue streams that reinforce competitive positioning.
A transparent mixed-methods research methodology integrating primary stakeholder interviews, technical literature review, and standards analysis to support robust insights
The research approach deployed to assemble this analysis combines primary engagement with industry participants and rigorous secondary synthesis of open technical sources, standards documentation, and regulatory guidance. Primary methods included structured interviews with design engineers, procurement leaders, and fabrication specialists to capture first-hand perspectives on technology adoption drivers, reliability expectations, and supply chain constraints. These conversations informed the thematic framing and allowed the analysis to surface real-world trade-offs that organizations confront when integrating passive elements into complex electronic assemblies.
Secondary research complemented primary insights through careful review of peer-reviewed literature, patent filings, materials datasheets, and vendor technical notes to validate performance characteristics and manufacturing considerations. Where applicable, industry standards and certification protocols were examined to ensure the analysis addresses compliance requirements relevant to aerospace, automotive, medical, and telecommunications applications. Throughout, the methodology emphasized triangulation of multiple independent information sources to enhance the robustness of insights and to reduce single-source bias, and it documented key assumptions to support transparent interpretation of findings.
Concluding synthesis that ties technical promise to operational realities and prescribes oriented approaches for pragmatic adoption of integrated passive devices
Integrated passive devices represent a strategic lever for electronics designers seeking improved density, reliability, and electromagnetic performance in compact systems. Across device types and material platforms, IPD solutions enable meaningful system-level benefits that translate into simpler assembly flows and, in many cases, improved performance for sensitive RF and mixed-signal circuits. At the same time, adoption requires careful assessment of qualification pathways, supply chain resilience, and cost-to-benefit trade-offs, particularly in regulated end markets where certification timelines can be substantial.
Looking ahead, stakeholders who align technical roadmaps with regional manufacturing strategies and who invest in cross-functional co-design will capture the most value from IPD technologies. While no single approach fits all applications, disciplined evaluation against application-specific requirements-combined with flexible sourcing, standardized testing, and collaborative supplier relationships-will position firms to exploit the full potential of integrated passive devices. Ultimately, the technology’s promise lies in its ability to simplify complex systems while meeting the reliability and performance standards that modern electronics demand.
Note: PDF & Excel + Online Access - 1 Year
Table of Contents
193 Pages
- 1. Preface
- 1.1. Objectives of the Study
- 1.2. Market Segmentation & Coverage
- 1.3. Years Considered for the Study
- 1.4. Currency
- 1.5. Language
- 1.6. Stakeholders
- 2. Research Methodology
- 3. Executive Summary
- 4. Market Overview
- 5. Market Insights
- 5.1. Rapid expansion of 5G and mmWave applications driving demand for high-frequency integrated passive devices
- 5.2. Increased adoption of wafer-level packaging techniques for miniaturized IPD modules in smartphones
- 5.3. Growing integration of IPDs in automotive radar and LIDAR systems for advanced driver assistance
- 5.4. Shift toward high-density multilayer ceramic substrates to support compact system-in-package designs
- 5.5. Rising use of IPDs in IoT sensor nodes for industrial automation and smart city deployments
- 5.6. Emergence of fan-out wafer level packaging enabling improved electrical performance and form factor
- 5.7. Development of low-temperature cofired ceramic materials for enhanced high-frequency IPD reliability
- 5.8. Focus on sustainable manufacturing and lead-free processes within integrated passive device production
- 5.9. Surge in demand for embedded EMI filters to comply with stringent emission regulations in electronics
- 6. Cumulative Impact of United States Tariffs 2025
- 7. Cumulative Impact of Artificial Intelligence 2025
- 8. Integrated Passive Devices Market, by Device Type
- 8.1. Baluns
- 8.2. Capacitor
- 8.3. Couplers
- 8.4. Diplexers
- 8.5. Inductor
- 8.6. Resistor
- 9. Integrated Passive Devices Market, by Material
- 9.1. Glass-based IPD
- 9.2. Silicon-based IPD
- 10. Integrated Passive Devices Market, by Application
- 10.1. Digital & Mixed Signal
- 10.2. EMS & EMI Protection
- 10.3. LED Lighting
- 10.4. Radio Frequency Protection
- 11. Integrated Passive Devices Market, by End-User Industry
- 11.1. Aerospace & Defense
- 11.2. Automotive
- 11.3. Consumer Electronics
- 11.4. Healthcare & Lifesciences
- 11.5. Telecommunication
- 12. Integrated Passive Devices Market, by Region
- 12.1. Americas
- 12.1.1. North America
- 12.1.2. Latin America
- 12.2. Europe, Middle East & Africa
- 12.2.1. Europe
- 12.2.2. Middle East
- 12.2.3. Africa
- 12.3. Asia-Pacific
- 13. Integrated Passive Devices Market, by Group
- 13.1. ASEAN
- 13.2. GCC
- 13.3. European Union
- 13.4. BRICS
- 13.5. G7
- 13.6. NATO
- 14. Integrated Passive Devices Market, by Country
- 14.1. United States
- 14.2. Canada
- 14.3. Mexico
- 14.4. Brazil
- 14.5. United Kingdom
- 14.6. Germany
- 14.7. France
- 14.8. Russia
- 14.9. Italy
- 14.10. Spain
- 14.11. China
- 14.12. India
- 14.13. Japan
- 14.14. Australia
- 14.15. South Korea
- 15. Competitive Landscape
- 15.1. Market Share Analysis, 2024
- 15.2. FPNV Positioning Matrix, 2024
- 15.3. Competitive Analysis
- 15.3.1. 3DGS Inc.
- 15.3.2. 3DiS Technologies.
- 15.3.3. Advanced Furnace Systems Corp.
- 15.3.4. Amkor Technology, Inc.
- 15.3.5. Ansys Canada Ltd.
- 15.3.6. Broadcom Inc.
- 15.3.7. Cadence Design Systems, Inc.
- 15.3.8. CTS Corporation
- 15.3.9. Global Communication Semiconductors, LLC
- 15.3.10. Infineon Technologies AG
- 15.3.11. JCET Group Co., Ltd.
- 15.3.12. Johanson Technology Inc.
- 15.3.13. Knowles Corporation
- 15.3.14. MACOM Technology Solutions Inc.
- 15.3.15. Murata Manufacturing Co., Ltd
- 15.3.16. NXP B.V
- 15.3.17. ON Semiconductor Corporation
- 15.3.18. Qorvo, Inc.
- 15.3.19. Samsung Electro-Mechanics Co., Ltd
- 15.3.20. SGS-Thomson Microelectronics N.V.
- 15.3.21. Taiwan Semiconductor Manufacturing Company Limited
- 15.3.22. Taiyo Yuden Co., Ltd.
- 15.3.23. Texas Instruments Incorporated
- 15.3.24. Vishay Intertechnology, Inc.
- 15.3.25. Yageo Corporation
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