Extreme Ultraviolet Lithography Market by Equipment Type (High-Na EUV Scanner, Low-Na EUV Scanner), Application (Logic Devices, Memory Devices), Wafer Size, End User, Resist Material - Global Forecast 2025-2032
Description
The Extreme Ultraviolet Lithography Market was valued at USD 9.87 billion in 2024 and is projected to grow to USD 10.83 billion in 2025, with a CAGR of 9.92%, reaching USD 21.04 billion by 2032.
An authoritative framing of extreme ultraviolet lithography's technological advancement, operational demands, supplier dependencies, and strategic industry implications
Extreme ultraviolet lithography has transitioned from an experimental technology to a central enabler of advanced semiconductor patterning, and this introduction frames the technical, commercial, and policy currents shaping that evolution. Over recent product cycles, advances in source power, scanner throughput, and resist sensitivity have collectively driven considerations around integration complexity, capital intensity, and cross‑industry collaborations. In parallel, supply chain dependencies for critical optics, light sources, and resist chemistries have become increasingly visible, prompting manufacturers and equipment suppliers to reevaluate sourcing strategies and secondary capabilities to sustain production continuity.
As a consequence, decision-makers must reconcile the technical benefits of finer feature resolution with the operational demands of long lead times, specialized maintenance, and workforce skills development. Looking ahead, the interplay between innovation in scanner performance and materials science will determine how rapidly fabs can adopt next-generation nodes while maintaining yield stability. Therefore, this analysis situates extreme ultraviolet lithography within an ecosystem that includes equipment vendors, materials providers, wafer fabricators, and policy environments that influence capital flows and cross-border collaboration.
How technical advances, commercial adoption patterns, and geopolitical realignment are jointly reshaping the global extreme ultraviolet lithography ecosystem and competitive positioning
The landscape for extreme ultraviolet lithography has undergone transformative shifts driven by technical maturation, commercial adoption patterns, and geopolitical reorientation. Technically, improvements in numerical aperture options and resist performance have enabled new design rules while simultaneously creating bifurcated adoption paths for high-NA and low-NA toolsets. Commercially, leading foundries and integrated device manufacturers have embedded scanner roadmaps into multi‑year capacity plans, which in turn influence supplier investment cycles and aftermarket services. Geopolitical realities have also reshaped sourcing and collaboration models, with supply chain resilience and onshore capabilities gaining prominence among strategic priorities.
Consequently, ecosystems of specialized suppliers and academic partners have proliferated, yielding pockets of accelerated capability while exposing new single‑point dependencies. As a result, firms are increasingly balancing the benefits of early adoption against the operational and financial burdens of pioneering nascent configurations. In transition, these shifts are creating differentiated pathways for incumbents and challengers alike, where strategic partnerships, materials innovation, and flexible manufacturing approaches will determine competitive positioning over the coming technology generations.
A detailed exploration of the 2025 United States tariff actions and their multi‑dimensional operational, strategic, and policy responses across the extreme ultraviolet lithography supply chain
The imposition of tariffs by the United States in 2025 has created a layered set of operational and strategic effects across the extreme ultraviolet lithography value chain. In the short term, tariff measures have prompted procurement teams to reassess supplier portfolios and contractual terms to minimize exposure to added transactional costs and unpredictable cross-border frictions. This reassessment has led to an emphasis on supplier diversification, more rigorous total cost of ownership calculations, and accelerated negotiation of long‑term service agreements to stabilize maintenance and spare parts availability.
Overlapping with procurement responses, research and development planning has shifted to insulate critical programs from tariff volatility. Engineers and program managers have explored alternative sourcing routes for optics, light sources, and resist precursors, while legal and compliance functions have invested in strengthened customs and trade advisory capabilities. At the industry level, tariffs have also influenced collaboration frameworks; some organizations have pursued localized manufacturing partnerships to mitigate tariff exposure and to reinforce supply continuity for capital equipment and consumables.
Importantly, the tariff environment has prompted renewed dialogue between private sector actors and policymakers, focusing on targeted incentives, export control harmonization, and mechanisms to support pre-competitive research. These conversations reflect an industry intent on balancing national policy objectives with the practical realities of maintaining high-tech manufacturing ecosystems that are resilient, innovation‑focused, and commercially viable.
Integrated segmentation insights revealing how equipment architecture, application demands, wafer dimensions, customer models, and resist chemistries together dictate adoption strategies and supplier focus
Segmentation reveals differentiated adoption pathways and demand drivers across equipment, application, wafer size, end user, and resist material choices, and these dimensions together define strategic priorities for suppliers and fabs. Based on equipment type, the market differentiates between High-NA EUV scanners, which target the most advanced node scaling and require extensive integration support, and Low-NA EUV scanners, which continue to enable incremental node improvements with lower integration complexity and higher throughput profiles. Based on application, lithography deployment is shaped by the distinct requirements of logic devices and memory devices; the logic device segment further subdivides into microprocessors and system-on-chip products where transistor density and interconnect patterns drive tighter overlay tolerances, whereas the memory segment further splits into DRAM and NAND where cost per bit and periodic refresh of architecture drive different process window priorities.
Based on wafer size, strategic decisions vary across 200mm, 300mm, and 450mm substrates, with 450mm currently represented primarily in prototype environments and therefore affecting investment timing and pilot production strategies. Based on end user, differentiation arises between foundry and IDM models; foundries include global pure‑play fabrication service providers such as GlobalFoundries, Samsung, and TSMC that centralize capital intensity across customers, while IDM strategies exemplified by Intel and Micron balance internal product roadmaps with in-house manufacturing optimization. Based on resist material, the split between chemically amplified resists and metal‑oxide resists is significant; chemically amplified resists break down further into negative CAR and positive CAR formulations with distinct process controls, whereas metal‑oxide resists include hafnium‑based and zirconium‑based chemistries that offer alternative tradeoffs in sensitivity and line edge roughness. Taken together, these segmentation layers inform product roadmaps, customer engagement models, and aftermarket support strategies for ecosystem participants.
How regional manufacturing clusters, regulatory frameworks, talent concentrations, and supply chain proximities across major geographies shape strategic execution and resilience
Regional dynamics exert a profound influence on supply chains, talent development, and policy interactions across the Americas, Europe Middle East & Africa, and Asia-Pacific, each presenting distinct operational realities and strategic levers. In the Americas, manufacturing investments and R&D clusters have emphasized advanced packaging, design‑to‑fab collaboration, and efforts to bolster domestic capabilities, leading firms to prioritize vertically integrated supply chains and localized service footprints. Meanwhile, Europe Middle East & Africa displays a mosaic of specialized research hubs, materials science expertise, and regulatory frameworks that affect cross-border collaboration and constrain the pace of large capital deployments, prompting stakeholders to seek consortium approaches for pre‑competitive development.
Across the Asia-Pacific region, concentration of wafer fabrication capacity, supplier ecosystems, and talent pools has created an environment where scale economies and dense supplier networks accelerate adoption and iteration. Consequently, firms operating across these regions must calibrate their commercial and technical strategies to account for differing regulatory regimes, workforce skill sets, infrastructure readiness, and proximity to key customers. Cross‑regional coordination, therefore, becomes essential for mitigating lead‑time variability, aligning qualification cycles, and ensuring that lifecycle services are available where high uptime and rapid recovery are business‑critical.
Key competitive drivers and company capabilities that determine success in extreme ultraviolet lithography, spanning innovation, service models, materials partnerships, and customer co‑development
Competitive dynamics in the extreme ultraviolet lithography ecosystem are shaped by a combination of technological leadership, service capabilities, materials partnerships, and customer alignment. Leading equipment suppliers have invested in differentiated scanner architectures and uptime optimization programs that extend beyond initial sales to include predictive maintenance and lifecycle engineering. At the same time, materials providers that can deliver resist chemistries with optimized sensitivity, line edge roughness, and process window robustness command strategic partnerships with both toolmakers and fabs, creating multi‑stakeholder integration challenges that successful suppliers address through co‑development and joint qualification programs.
Foundries and IDMs play a determinative role in shaping roadmaps through their capital allocation decisions and process integration priorities; collaboration with these customers on pilot programs, yield ramps, and design enablement enhances supplier credibility. Additionally, aftermarket service providers and specialized optics manufacturers form a critical second tier of competitiveness by reducing downtime risk and shortening recovery times. Taken together, the most successful companies combine technical innovation with disciplined operational execution, transparent qualification pathways, and the ability to scale global support without sacrificing local responsiveness.
Pragmatic, actionable recommendations for suppliers and manufacturers to balance advanced capability deployment with supply chain resilience, workforce development, and policy engagement
Industry leaders should adopt an actionable strategy that balances investment in cutting‑edge capability with pragmatic operational safeguards to manage complexity and geopolitical exposure. First, suppliers and fabs should institutionalize supplier diversification and dual‑sourcing strategies for critical optics, light sources, and resist precursors to reduce single‑point dependencies while maintaining qualification rigor. Second, organizations should deepen collaborative R&D engagements that accelerate co‑qualification of resist and scanner pairings, thereby compressing time to stable production and enhancing joint intellectual property frameworks. Third, commercial teams must evolve pricing and service models to account for lifecycle value, offering bundled maintenance and spare parts agreements that align incentives around uptime and yield stability.
Moreover, executives should prioritize workforce development programs that cultivate the specialized skills required for next‑generation scanner operation and in‑field maintenance, including cross‑training between engineering and servicing disciplines. Simultaneously, firms must engage proactively with policymakers to help shape trade and incentive frameworks that enable resilient supply chains without undermining competitive access to advanced tools. Finally, leaders should consider staged adoption roadmaps that pilot high‑NA implementations in controlled environments, thereby balancing performance ambition with operational learning and risk mitigation. These recommendations together create a pragmatic, action-oriented pathway for sustaining innovation while preserving manufacturing continuity.
A transparent, multi‑method research approach combining expert interviews, technical literature review, supply chain triangulation, and scenario analysis to underpin strategic findings
This research employed a structured, multi‑method approach that combined technical literature synthesis, expert interviews, and supply chain mapping to generate a robust and actionable analysis. Primary inputs included in‑depth interviews with equipment engineers, materials scientists, fab operations leads, and procurement specialists, which provided qualitative perspectives on adoption barriers, integration challenges, and service expectations. Secondary inputs encompassed peer‑reviewed technical papers, conference proceedings, and publicly available regulatory filings that informed the technical baseline for scanner architectures, resist chemistries, and wafer handling systems.
Analytical methods included cross‑validation of supply chain dependencies through vendor and customer triangulation, scenario analysis to surface plausible operational responses to policy shifts, and capability mapping to identify concentration points in optics, light sources, and materials production. Throughout the research, attention was given to verifying assertions across independent sources and to documenting assumptions that underpin strategic implications. Where possible, historic adoption patterns and technical milestones were used to contextualize current dynamics without extrapolating explicit future projections. This methodology ensures that findings are grounded in observable evidence and practitioner insight, providing a defensible foundation for strategic decision-making.
A conclusive synthesis emphasizing the need to harmonize technological innovation, supply chain resilience, and strategic collaboration to realize the benefits of next‑generation lithography
In conclusion, extreme ultraviolet lithography occupies a pivotal role in the continued scaling and differentiation of semiconductor devices, yet its broader adoption is mediated by a complex set of technical, operational, and policy factors. The interplay between high‑precision scanner architectures, evolving resist materials, wafer ecosystem choices, and concentrated supplier capabilities means that stakeholders must manage both technological ambition and operational risk. In response, successful strategies will balance early technical adoption with rigorous qualification, supplier diversification, and purposeful workforce and service investments.
Moreover, regional dynamics and recent trade policy developments underscore the need for strategic flexibility and enhanced public‑private dialogue to sustain innovation while protecting supply continuity. Ultimately, the path forward for participants in this ecosystem will be defined by their ability to integrate technical excellence with resilient commercial models, collaborative R&D partnerships, and disciplined execution across global operations. This synthesis provides executives with a clear framework to prioritize initiatives, align internal stakeholders, and mobilize resources to capture the benefits of next‑generation lithography technologies while mitigating attendant risks.
Note: PDF & Excel + Online Access - 1 Year
An authoritative framing of extreme ultraviolet lithography's technological advancement, operational demands, supplier dependencies, and strategic industry implications
Extreme ultraviolet lithography has transitioned from an experimental technology to a central enabler of advanced semiconductor patterning, and this introduction frames the technical, commercial, and policy currents shaping that evolution. Over recent product cycles, advances in source power, scanner throughput, and resist sensitivity have collectively driven considerations around integration complexity, capital intensity, and cross‑industry collaborations. In parallel, supply chain dependencies for critical optics, light sources, and resist chemistries have become increasingly visible, prompting manufacturers and equipment suppliers to reevaluate sourcing strategies and secondary capabilities to sustain production continuity.
As a consequence, decision-makers must reconcile the technical benefits of finer feature resolution with the operational demands of long lead times, specialized maintenance, and workforce skills development. Looking ahead, the interplay between innovation in scanner performance and materials science will determine how rapidly fabs can adopt next-generation nodes while maintaining yield stability. Therefore, this analysis situates extreme ultraviolet lithography within an ecosystem that includes equipment vendors, materials providers, wafer fabricators, and policy environments that influence capital flows and cross-border collaboration.
How technical advances, commercial adoption patterns, and geopolitical realignment are jointly reshaping the global extreme ultraviolet lithography ecosystem and competitive positioning
The landscape for extreme ultraviolet lithography has undergone transformative shifts driven by technical maturation, commercial adoption patterns, and geopolitical reorientation. Technically, improvements in numerical aperture options and resist performance have enabled new design rules while simultaneously creating bifurcated adoption paths for high-NA and low-NA toolsets. Commercially, leading foundries and integrated device manufacturers have embedded scanner roadmaps into multi‑year capacity plans, which in turn influence supplier investment cycles and aftermarket services. Geopolitical realities have also reshaped sourcing and collaboration models, with supply chain resilience and onshore capabilities gaining prominence among strategic priorities.
Consequently, ecosystems of specialized suppliers and academic partners have proliferated, yielding pockets of accelerated capability while exposing new single‑point dependencies. As a result, firms are increasingly balancing the benefits of early adoption against the operational and financial burdens of pioneering nascent configurations. In transition, these shifts are creating differentiated pathways for incumbents and challengers alike, where strategic partnerships, materials innovation, and flexible manufacturing approaches will determine competitive positioning over the coming technology generations.
A detailed exploration of the 2025 United States tariff actions and their multi‑dimensional operational, strategic, and policy responses across the extreme ultraviolet lithography supply chain
The imposition of tariffs by the United States in 2025 has created a layered set of operational and strategic effects across the extreme ultraviolet lithography value chain. In the short term, tariff measures have prompted procurement teams to reassess supplier portfolios and contractual terms to minimize exposure to added transactional costs and unpredictable cross-border frictions. This reassessment has led to an emphasis on supplier diversification, more rigorous total cost of ownership calculations, and accelerated negotiation of long‑term service agreements to stabilize maintenance and spare parts availability.
Overlapping with procurement responses, research and development planning has shifted to insulate critical programs from tariff volatility. Engineers and program managers have explored alternative sourcing routes for optics, light sources, and resist precursors, while legal and compliance functions have invested in strengthened customs and trade advisory capabilities. At the industry level, tariffs have also influenced collaboration frameworks; some organizations have pursued localized manufacturing partnerships to mitigate tariff exposure and to reinforce supply continuity for capital equipment and consumables.
Importantly, the tariff environment has prompted renewed dialogue between private sector actors and policymakers, focusing on targeted incentives, export control harmonization, and mechanisms to support pre-competitive research. These conversations reflect an industry intent on balancing national policy objectives with the practical realities of maintaining high-tech manufacturing ecosystems that are resilient, innovation‑focused, and commercially viable.
Integrated segmentation insights revealing how equipment architecture, application demands, wafer dimensions, customer models, and resist chemistries together dictate adoption strategies and supplier focus
Segmentation reveals differentiated adoption pathways and demand drivers across equipment, application, wafer size, end user, and resist material choices, and these dimensions together define strategic priorities for suppliers and fabs. Based on equipment type, the market differentiates between High-NA EUV scanners, which target the most advanced node scaling and require extensive integration support, and Low-NA EUV scanners, which continue to enable incremental node improvements with lower integration complexity and higher throughput profiles. Based on application, lithography deployment is shaped by the distinct requirements of logic devices and memory devices; the logic device segment further subdivides into microprocessors and system-on-chip products where transistor density and interconnect patterns drive tighter overlay tolerances, whereas the memory segment further splits into DRAM and NAND where cost per bit and periodic refresh of architecture drive different process window priorities.
Based on wafer size, strategic decisions vary across 200mm, 300mm, and 450mm substrates, with 450mm currently represented primarily in prototype environments and therefore affecting investment timing and pilot production strategies. Based on end user, differentiation arises between foundry and IDM models; foundries include global pure‑play fabrication service providers such as GlobalFoundries, Samsung, and TSMC that centralize capital intensity across customers, while IDM strategies exemplified by Intel and Micron balance internal product roadmaps with in-house manufacturing optimization. Based on resist material, the split between chemically amplified resists and metal‑oxide resists is significant; chemically amplified resists break down further into negative CAR and positive CAR formulations with distinct process controls, whereas metal‑oxide resists include hafnium‑based and zirconium‑based chemistries that offer alternative tradeoffs in sensitivity and line edge roughness. Taken together, these segmentation layers inform product roadmaps, customer engagement models, and aftermarket support strategies for ecosystem participants.
How regional manufacturing clusters, regulatory frameworks, talent concentrations, and supply chain proximities across major geographies shape strategic execution and resilience
Regional dynamics exert a profound influence on supply chains, talent development, and policy interactions across the Americas, Europe Middle East & Africa, and Asia-Pacific, each presenting distinct operational realities and strategic levers. In the Americas, manufacturing investments and R&D clusters have emphasized advanced packaging, design‑to‑fab collaboration, and efforts to bolster domestic capabilities, leading firms to prioritize vertically integrated supply chains and localized service footprints. Meanwhile, Europe Middle East & Africa displays a mosaic of specialized research hubs, materials science expertise, and regulatory frameworks that affect cross-border collaboration and constrain the pace of large capital deployments, prompting stakeholders to seek consortium approaches for pre‑competitive development.
Across the Asia-Pacific region, concentration of wafer fabrication capacity, supplier ecosystems, and talent pools has created an environment where scale economies and dense supplier networks accelerate adoption and iteration. Consequently, firms operating across these regions must calibrate their commercial and technical strategies to account for differing regulatory regimes, workforce skill sets, infrastructure readiness, and proximity to key customers. Cross‑regional coordination, therefore, becomes essential for mitigating lead‑time variability, aligning qualification cycles, and ensuring that lifecycle services are available where high uptime and rapid recovery are business‑critical.
Key competitive drivers and company capabilities that determine success in extreme ultraviolet lithography, spanning innovation, service models, materials partnerships, and customer co‑development
Competitive dynamics in the extreme ultraviolet lithography ecosystem are shaped by a combination of technological leadership, service capabilities, materials partnerships, and customer alignment. Leading equipment suppliers have invested in differentiated scanner architectures and uptime optimization programs that extend beyond initial sales to include predictive maintenance and lifecycle engineering. At the same time, materials providers that can deliver resist chemistries with optimized sensitivity, line edge roughness, and process window robustness command strategic partnerships with both toolmakers and fabs, creating multi‑stakeholder integration challenges that successful suppliers address through co‑development and joint qualification programs.
Foundries and IDMs play a determinative role in shaping roadmaps through their capital allocation decisions and process integration priorities; collaboration with these customers on pilot programs, yield ramps, and design enablement enhances supplier credibility. Additionally, aftermarket service providers and specialized optics manufacturers form a critical second tier of competitiveness by reducing downtime risk and shortening recovery times. Taken together, the most successful companies combine technical innovation with disciplined operational execution, transparent qualification pathways, and the ability to scale global support without sacrificing local responsiveness.
Pragmatic, actionable recommendations for suppliers and manufacturers to balance advanced capability deployment with supply chain resilience, workforce development, and policy engagement
Industry leaders should adopt an actionable strategy that balances investment in cutting‑edge capability with pragmatic operational safeguards to manage complexity and geopolitical exposure. First, suppliers and fabs should institutionalize supplier diversification and dual‑sourcing strategies for critical optics, light sources, and resist precursors to reduce single‑point dependencies while maintaining qualification rigor. Second, organizations should deepen collaborative R&D engagements that accelerate co‑qualification of resist and scanner pairings, thereby compressing time to stable production and enhancing joint intellectual property frameworks. Third, commercial teams must evolve pricing and service models to account for lifecycle value, offering bundled maintenance and spare parts agreements that align incentives around uptime and yield stability.
Moreover, executives should prioritize workforce development programs that cultivate the specialized skills required for next‑generation scanner operation and in‑field maintenance, including cross‑training between engineering and servicing disciplines. Simultaneously, firms must engage proactively with policymakers to help shape trade and incentive frameworks that enable resilient supply chains without undermining competitive access to advanced tools. Finally, leaders should consider staged adoption roadmaps that pilot high‑NA implementations in controlled environments, thereby balancing performance ambition with operational learning and risk mitigation. These recommendations together create a pragmatic, action-oriented pathway for sustaining innovation while preserving manufacturing continuity.
A transparent, multi‑method research approach combining expert interviews, technical literature review, supply chain triangulation, and scenario analysis to underpin strategic findings
This research employed a structured, multi‑method approach that combined technical literature synthesis, expert interviews, and supply chain mapping to generate a robust and actionable analysis. Primary inputs included in‑depth interviews with equipment engineers, materials scientists, fab operations leads, and procurement specialists, which provided qualitative perspectives on adoption barriers, integration challenges, and service expectations. Secondary inputs encompassed peer‑reviewed technical papers, conference proceedings, and publicly available regulatory filings that informed the technical baseline for scanner architectures, resist chemistries, and wafer handling systems.
Analytical methods included cross‑validation of supply chain dependencies through vendor and customer triangulation, scenario analysis to surface plausible operational responses to policy shifts, and capability mapping to identify concentration points in optics, light sources, and materials production. Throughout the research, attention was given to verifying assertions across independent sources and to documenting assumptions that underpin strategic implications. Where possible, historic adoption patterns and technical milestones were used to contextualize current dynamics without extrapolating explicit future projections. This methodology ensures that findings are grounded in observable evidence and practitioner insight, providing a defensible foundation for strategic decision-making.
A conclusive synthesis emphasizing the need to harmonize technological innovation, supply chain resilience, and strategic collaboration to realize the benefits of next‑generation lithography
In conclusion, extreme ultraviolet lithography occupies a pivotal role in the continued scaling and differentiation of semiconductor devices, yet its broader adoption is mediated by a complex set of technical, operational, and policy factors. The interplay between high‑precision scanner architectures, evolving resist materials, wafer ecosystem choices, and concentrated supplier capabilities means that stakeholders must manage both technological ambition and operational risk. In response, successful strategies will balance early technical adoption with rigorous qualification, supplier diversification, and purposeful workforce and service investments.
Moreover, regional dynamics and recent trade policy developments underscore the need for strategic flexibility and enhanced public‑private dialogue to sustain innovation while protecting supply continuity. Ultimately, the path forward for participants in this ecosystem will be defined by their ability to integrate technical excellence with resilient commercial models, collaborative R&D partnerships, and disciplined execution across global operations. This synthesis provides executives with a clear framework to prioritize initiatives, align internal stakeholders, and mobilize resources to capture the benefits of next‑generation lithography technologies while mitigating attendant risks.
Note: PDF & Excel + Online Access - 1 Year
Table of Contents
185 Pages
- 1. Preface
- 1.1. Objectives of the Study
- 1.2. Market Segmentation & Coverage
- 1.3. Years Considered for the Study
- 1.4. Currency
- 1.5. Language
- 1.6. Stakeholders
- 2. Research Methodology
- 3. Executive Summary
- 4. Market Overview
- 5. Market Insights
- 5.1. Next-generation high-NA EUV scanner integration challenges and expected capacity expansions by 2025
- 5.2. Advanced multilayer mirror coating uniformity improvements driving higher EUV throughput and yield consistency
- 5.3. Deployment of real-time in-situ metrology and feedback control systems for EUV lithography process optimization
- 5.4. Collaborative supply chain risk mitigation strategies for critical EUV source components amid global constraints
- 5.5. Integration of pellicle technology innovations to reduce defectivity and extend mask lifetime in EUV production
- 6. Cumulative Impact of United States Tariffs 2025
- 7. Cumulative Impact of Artificial Intelligence 2025
- 8. Extreme Ultraviolet Lithography Market, by Equipment Type
- 8.1. High-Na EUV Scanner
- 8.2. Low-Na EUV Scanner
- 9. Extreme Ultraviolet Lithography Market, by Application
- 9.1. Logic Devices
- 9.1.1. Microprocessors
- 9.1.2. Soc
- 9.2. Memory Devices
- 9.2.1. Dram
- 9.2.2. Nand
- 10. Extreme Ultraviolet Lithography Market, by Wafer Size
- 10.1. 200Mm
- 10.2. 300Mm
- 10.3. 450Mm
- 11. Extreme Ultraviolet Lithography Market, by End User
- 11.1. Foundry
- 11.2. Idm
- 12. Extreme Ultraviolet Lithography Market, by Resist Material
- 12.1. Chemically Amplified Resist
- 12.2. Metal-Oxide Resist
- 12.2.1. Hafnium-Based
- 12.2.2. Zirconium-Based
- 13. Extreme Ultraviolet Lithography Market, by Region
- 13.1. Americas
- 13.1.1. North America
- 13.1.2. Latin America
- 13.2. Europe, Middle East & Africa
- 13.2.1. Europe
- 13.2.2. Middle East
- 13.2.3. Africa
- 13.3. Asia-Pacific
- 14. Extreme Ultraviolet Lithography Market, by Group
- 14.1. ASEAN
- 14.2. GCC
- 14.3. European Union
- 14.4. BRICS
- 14.5. G7
- 14.6. NATO
- 15. Extreme Ultraviolet Lithography Market, by Country
- 15.1. United States
- 15.2. Canada
- 15.3. Mexico
- 15.4. Brazil
- 15.5. United Kingdom
- 15.6. Germany
- 15.7. France
- 15.8. Russia
- 15.9. Italy
- 15.10. Spain
- 15.11. China
- 15.12. India
- 15.13. Japan
- 15.14. Australia
- 15.15. South Korea
- 16. Competitive Landscape
- 16.1. Market Share Analysis, 2024
- 16.2. FPNV Positioning Matrix, 2024
- 16.3. Competitive Analysis
- 16.3.1. ADVANTEST CORPORATION
- 16.3.2. AGC Inc.
- 16.3.3. Applied Materials Inc.
- 16.3.4. ASML Holding N.V.
- 16.3.5. Carl Zeiss AG
- 16.3.6. Edmund Optics Inc.
- 16.3.7. Energetiq Technology Inc.
- 16.3.8. HOYA Corporation
- 16.3.9. Intel Corporation
- 16.3.10. KLA Corporation
- 16.3.11. Lasertec Corporation
- 16.3.12. MKS Instruments Inc.
- 16.3.13. NTT Advanced Technology Corporation
- 16.3.14. NuFlare Technology Inc.
- 16.3.15. Park Systems
- 16.3.16. Photronics Inc.
- 16.3.17. Rigaku Corporation
- 16.3.18. Samsung Electronics Co. Ltd.
- 16.3.19. SUSS MicroTec SE
- 16.3.20. Taiwan Semiconductor Manufacturing Company Limited
- 16.3.21. TOPPAN Inc.
- 16.3.22. TRUMPF
- 16.3.23. Ushio Inc.
- 16.3.24. Zygo Corporation
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