New Energy Vehicle Sensing Chip Market by Sensor Type (Current/Voltage Sensors, Lidar Sensor, Position Sensors), Vehicle Type (Battery Electric Vehicle, Fuel Cell Electric Vehicle, Plug-In Hybrid Electric Vehicle), Driving Automation Level, Application, D
Description
The New Energy Vehicle Sensing Chip Market was valued at USD 15.24 billion in 2025 and is projected to grow to USD 17.15 billion in 2026, with a CAGR of 13.99%, reaching USD 38.11 billion by 2032.
Setting the stage for why sensing semiconductor strategies are decisive for vehicle performance safety autonomy and cross-functional governance
The introduction frames the accelerating integration of sensing chips as a foundational enabler of new energy vehicle performance, safety, and user experience. Advances in semiconductor design, sensor fusion algorithms, and power-efficient packaging have converged to elevate sensing capabilities across battery electric vehicles, fuel cell electric vehicles, and plug-in hybrid electric vehicles. As a result, automotive architects now view sensing chips not merely as components but as strategic control points that materially influence vehicle range, thermal management, and autonomy functions.
Furthermore, the proliferation of high-resolution lidar, radar, ultrasonic, position, current/voltage, and temperature sensors is redefining signal processing requirements and system partitioning. Consequently, hardware teams and software integrators must coordinate more closely than ever to optimize latency, electromagnetic compatibility, and secure data paths. In parallel, regulatory emphasis on safety and cybersecurity is increasing verification and lifecycle management burdens. Therefore, executives must appreciate that sensing chip strategy intersects product engineering, supply chain planning, and compliance processes, forming a multidimensional challenge that requires cross-functional governance and a clear technology roadmap.
How the convergence of sensor fusion compute localized supply strategies and platform-led offerings is reshaping product roadmaps and procurement imperatives
The landscape for sensing chips in new energy vehicles is undergoing transformative shifts driven by technological maturation, supply chain realignment, and evolving use cases. First, the transition from single-sensor architectures to tightly coupled sensor fusion stacks has raised performance thresholds for latency, determinism, and power efficiency. Designers now favor chips that natively support multi-sensor inputs while enabling scalable compute for advanced driver assistance system workloads and higher levels of driving automation. As a result, chip design roadmaps are prioritizing heterogeneous compute elements and robust on-chip security.
Second, manufacturing and sourcing strategies are changing as OEMs and tier-one suppliers seek greater control over critical semiconductor capabilities. This trend manifests as longer-term partnerships, co-development agreements, and targeted investment in localized capacity. In addition, software-defined vehicle concepts are shifting the value proposition from individual sensors to the entire sensing-to-decision pipeline, thus prompting suppliers to offer integrated solutions that bundle sensing, compute, and software validation services. Together, these shifts indicate a market moving from component sales to platform-based offerings that better support continuous feature updates, over-the-air calibration, and lifecycle management.
Assessing how recent tariff measures have accelerated localization and supply diversification while reshaping procurement and compliance priorities
The cumulative effects of tariff actions and trade measures announced through 2025 have prompted automotive stakeholders to reassess sourcing strategies for sensing chip components and subassemblies. Increased import duties on certain electronic components have elevated landed costs and compressed supplier margins, compelling both OEMs and tier suppliers to intensify localization efforts and diversify their supplier base. Consequently, procurement teams have accelerated qualification programs for alternate foundries and contract manufacturers while increasing emphasis on total landed cost modeling rather than unit price alone.
Moreover, policy-driven shifts have intensified collaboration between design houses and regional manufacturing partners to mitigate exposure to trade frictions. In practice, this has led to a two-track approach: near-term cost containment through supplier renegotiation and inventory optimization, and medium-term resilience investments such as multi-sourcing of critical die, dual-sourcing of packaged assemblies, and expanded testing capacity within preferential trade zones. In addition, regulatory compliance and customs classification complexity has increased administrative overhead, prompting companies to invest in specialized trade compliance capabilities. As a result, leaders must balance the imperative to contain costs with the strategic necessity of securing long-term access to advanced sensing technologies.
Deep segmentation lenses that reveal distinct engineering validation commercialization and service imperatives across sensor types vehicle architectures and automation tiers
Segment-level analysis reveals where technological and commercial dynamics intersect and where leaders should deploy differentiated strategies. Based on sensor type, design attention concentrates on current/voltage sensors, lidar sensors, position sensors, radar sensors, temperature sensors, and ultrasonic sensors, each presenting unique reliability and calibration challenges that influence packaging, signal conditioning, and thermal management decisions. Based on vehicle type, development and integration priorities differ markedly across battery electric vehicles, fuel cell electric vehicles, and plug-in hybrid electric vehicles, with battery-centric systems demanding stringent thermal oversight and fuel cell architectures requiring specialized sensors for hydrogen monitoring. Based on driving automation level, requirements range from deterministic, latency-sensitive architectures for Level 2 systems to highly redundant, safety-certified stacks that support Level 4 and Level 5 autonomy, necessitating scalable compute and rigorous verification regimes.
Based on application, deployment complexity varies across advanced driver assistance system functions, autonomous driving stacks, battery management system implementations, and powertrain control modules; each application drives distinct accuracy, sampling rate, and functional safety requirements. Finally, based on distribution channel, aftermarket and original equipment manufacturer pathways create divergent product lifecycles and service models, with OEM channels favoring long-term validation, integration support, and software update frameworks, while aftermarket offerings prioritize interoperability, retrofit simplicity, and cost-effectiveness. Taken together, these segmentation lenses indicate that a one-size-fits-all product approach will underperform; instead, suppliers must align design, testing, and commercialization strategies to the specific constraints and value drivers of each segment.
Regional strategic differentiators that determine where to build capabilities partnerships and manufacturing footprints for sustained advantage
Regional dynamics are shaping where investment, partnerships, and production scale will concentrate over the next several years. In the Americas, demand patterns emphasize software integration, cloud-connected diagnostics, and a strong emphasis on domestic validation labs, encouraging local suppliers to scale engineering services and Tier 1 partnerships. This region also shows pronounced interest in electrification initiatives tied to energy transition policies and incentives, which elevates demand for robust battery management sensing solutions. In contrast, Europe, Middle East & Africa presents a regulatory-forward environment where safety certification and emissions regulations drive higher standards for sensor reliability and lifecycle traceability, while localized supply chain clusters support collaborative R&D between OEMs and semiconductor specialists.
Asia-Pacific remains a hub for semiconductor manufacturing capacity and systems integration expertise, offering scale advantages and a rich ecosystem of electronics suppliers. Consequently, many design houses prioritize rapid prototyping and cost-optimized production runs there, but they must concurrently manage regional policy shifts and intellectual property considerations. As companies evaluate market entry and expansion plans across these regions, they should weigh factors such as regional certification timelines, ecosystem readiness for over-the-air updates, and the availability of skilled test and validation resources. Ultimately, regional strategies should align manufacturing footprints, supplier partnerships, and compliance roadmaps with product roadmaps to minimize time-to-deployment risk.
Competitive archetypes and partnership strategies that reveal how leading companies secure integration advantages and long-term customer commitments
A review of key companies highlights differentiated approaches to product architecture, go-to-market strategy, and partnership models. Some firms concentrate on high-performance analog front-end and signal conditioning IP that serves as the baseline for temperature, current/voltage, and position sensing, delivering proven reliability in harsh automotive environments. Other players emphasize integrated perception stacks that combine lidar, radar, and ultrasonic inputs with edge compute optimized for deterministic inference; these vendors often co-develop algorithms with OEMs to meet specific system-level performance targets. A third cohort focuses on semiconductor manufacturing scale and packaging innovations that lower cost and improve thermal performance, thereby enabling broader adoption in mass-market segments.
Across these approaches, successful companies demonstrate strong cross-functional alignment between silicon design, software toolchains, and field validation teams. They invest in functional safety certification, robust supply continuity programs, and post-sale software support to enable feature updates and calibration over the vehicle lifecycle. Partnerships between IP providers, foundries, and systems integrators are increasingly common, reflecting a realization that end-to-end value often accrues to those who can bundle hardware, software, and validation services in a way that reduces integration friction for OEMs and tier suppliers.
Concrete strategic initiatives for executives to align engineering procurement and regulatory teams and fortify supply chain resilience while unlocking system-level value
Industry leaders should pursue a set of actionable moves to capture strategic value while reducing execution risk. First, prioritize investment in modular, safety-oriented silicon architectures that support multi-sensor fusion and scale across different driving automation levels, thereby enabling reuse across vehicle lines and speeding time to market. Second, accelerate qualification of secondary manufacturing partners and diversify packaging and assembly sources to reduce supply concentration risk while maintaining strict quality oversight. Third, adopt a product strategy that bundles sensing hardware with calibration, software update, and lifecycle support services to shift the value proposition from one-time sales to recurring engagement.
In parallel, leaders should establish robust trade compliance and customs classification capabilities to navigate evolving tariff environments and to reclaim margin through better duty optimization. Additionally, embed cross-functional governance that aligns engineering, procurement, and regulatory teams around common milestones and risk metrics. Finally, pursue strategic partnerships with tier suppliers and compute platform providers to co-develop validated stacks for key applications such as battery management systems and higher-level autonomous driving functions. By executing these recommendations, organizations can both protect near-term deliveries and position themselves to capture higher-value system-level opportunities over the medium term.
A rigorous evidence-driven approach that blends executive interviews technical literature and scenario analysis to validate actionable engineering and commercial insights
The research methodology combines primary industry engagement with rigorous secondary analysis to ensure robustness and relevance of insights. Primary work included structured interviews with executives across semiconductor design houses, automotive OEMs, tier-one suppliers, and manufacturing partners to capture real-world constraints around validation, sourcing, and deployment. These engagements provided context on engineering trade-offs, certification timelines, and go-to-market priorities. Secondary review entailed a systematic synthesis of publicly available technical literature, regulatory publications, and corporate filings to corroborate interview findings and to identify emergent patterns in sensor fusion architectures and packaging innovations.
Analytical rigor was maintained through triangulation between qualitative insights and technical specifications, ensuring that observed trends reflect reproducible engineering decisions rather than isolated vendor claims. In addition, scenario analysis helped clarify the operational implications of policy shifts and procurement responses. Throughout the process, a focus on functional safety, supply chain resilience, and integration complexity guided prioritization of evidence, ensuring that recommendations align with the practical constraints and strategic objectives faced by industry decision-makers.
Concluding synthesis that clarifies how integrated sensing platforms resilient sourcing and cross-functional governance converge to create competitive advantage
In conclusion, sensing chips are at the intersection of several high-stakes vectors: vehicle electrification, automation ambitions, and supply chain realignment. The industry is moving toward integrated sensing and compute platforms that reduce integration friction and enable continuous feature evolution, while policy and trade dynamics are accelerating localization and supplier diversification. As a result, companies that marry resilient sourcing strategies with modular, safety-certified silicon and strong software support will secure disproportionate advantage. Conversely, organizations that treat sensors as interchangeable commodities risk higher total integration costs and longer validation cycles.
Therefore, the imperative for leaders is clear: align product roadmaps with regional supply realities, embed cross-functional governance to manage complexity, and pursue partnerships that extend capabilities beyond discrete components to system-level assurances. By doing so, firms can both mitigate near-term disruptions and position themselves to capture the long-term value created as vehicles become more software-defined, sensor-rich, and connected.
Note: PDF & Excel + Online Access - 1 Year
Setting the stage for why sensing semiconductor strategies are decisive for vehicle performance safety autonomy and cross-functional governance
The introduction frames the accelerating integration of sensing chips as a foundational enabler of new energy vehicle performance, safety, and user experience. Advances in semiconductor design, sensor fusion algorithms, and power-efficient packaging have converged to elevate sensing capabilities across battery electric vehicles, fuel cell electric vehicles, and plug-in hybrid electric vehicles. As a result, automotive architects now view sensing chips not merely as components but as strategic control points that materially influence vehicle range, thermal management, and autonomy functions.
Furthermore, the proliferation of high-resolution lidar, radar, ultrasonic, position, current/voltage, and temperature sensors is redefining signal processing requirements and system partitioning. Consequently, hardware teams and software integrators must coordinate more closely than ever to optimize latency, electromagnetic compatibility, and secure data paths. In parallel, regulatory emphasis on safety and cybersecurity is increasing verification and lifecycle management burdens. Therefore, executives must appreciate that sensing chip strategy intersects product engineering, supply chain planning, and compliance processes, forming a multidimensional challenge that requires cross-functional governance and a clear technology roadmap.
How the convergence of sensor fusion compute localized supply strategies and platform-led offerings is reshaping product roadmaps and procurement imperatives
The landscape for sensing chips in new energy vehicles is undergoing transformative shifts driven by technological maturation, supply chain realignment, and evolving use cases. First, the transition from single-sensor architectures to tightly coupled sensor fusion stacks has raised performance thresholds for latency, determinism, and power efficiency. Designers now favor chips that natively support multi-sensor inputs while enabling scalable compute for advanced driver assistance system workloads and higher levels of driving automation. As a result, chip design roadmaps are prioritizing heterogeneous compute elements and robust on-chip security.
Second, manufacturing and sourcing strategies are changing as OEMs and tier-one suppliers seek greater control over critical semiconductor capabilities. This trend manifests as longer-term partnerships, co-development agreements, and targeted investment in localized capacity. In addition, software-defined vehicle concepts are shifting the value proposition from individual sensors to the entire sensing-to-decision pipeline, thus prompting suppliers to offer integrated solutions that bundle sensing, compute, and software validation services. Together, these shifts indicate a market moving from component sales to platform-based offerings that better support continuous feature updates, over-the-air calibration, and lifecycle management.
Assessing how recent tariff measures have accelerated localization and supply diversification while reshaping procurement and compliance priorities
The cumulative effects of tariff actions and trade measures announced through 2025 have prompted automotive stakeholders to reassess sourcing strategies for sensing chip components and subassemblies. Increased import duties on certain electronic components have elevated landed costs and compressed supplier margins, compelling both OEMs and tier suppliers to intensify localization efforts and diversify their supplier base. Consequently, procurement teams have accelerated qualification programs for alternate foundries and contract manufacturers while increasing emphasis on total landed cost modeling rather than unit price alone.
Moreover, policy-driven shifts have intensified collaboration between design houses and regional manufacturing partners to mitigate exposure to trade frictions. In practice, this has led to a two-track approach: near-term cost containment through supplier renegotiation and inventory optimization, and medium-term resilience investments such as multi-sourcing of critical die, dual-sourcing of packaged assemblies, and expanded testing capacity within preferential trade zones. In addition, regulatory compliance and customs classification complexity has increased administrative overhead, prompting companies to invest in specialized trade compliance capabilities. As a result, leaders must balance the imperative to contain costs with the strategic necessity of securing long-term access to advanced sensing technologies.
Deep segmentation lenses that reveal distinct engineering validation commercialization and service imperatives across sensor types vehicle architectures and automation tiers
Segment-level analysis reveals where technological and commercial dynamics intersect and where leaders should deploy differentiated strategies. Based on sensor type, design attention concentrates on current/voltage sensors, lidar sensors, position sensors, radar sensors, temperature sensors, and ultrasonic sensors, each presenting unique reliability and calibration challenges that influence packaging, signal conditioning, and thermal management decisions. Based on vehicle type, development and integration priorities differ markedly across battery electric vehicles, fuel cell electric vehicles, and plug-in hybrid electric vehicles, with battery-centric systems demanding stringent thermal oversight and fuel cell architectures requiring specialized sensors for hydrogen monitoring. Based on driving automation level, requirements range from deterministic, latency-sensitive architectures for Level 2 systems to highly redundant, safety-certified stacks that support Level 4 and Level 5 autonomy, necessitating scalable compute and rigorous verification regimes.
Based on application, deployment complexity varies across advanced driver assistance system functions, autonomous driving stacks, battery management system implementations, and powertrain control modules; each application drives distinct accuracy, sampling rate, and functional safety requirements. Finally, based on distribution channel, aftermarket and original equipment manufacturer pathways create divergent product lifecycles and service models, with OEM channels favoring long-term validation, integration support, and software update frameworks, while aftermarket offerings prioritize interoperability, retrofit simplicity, and cost-effectiveness. Taken together, these segmentation lenses indicate that a one-size-fits-all product approach will underperform; instead, suppliers must align design, testing, and commercialization strategies to the specific constraints and value drivers of each segment.
Regional strategic differentiators that determine where to build capabilities partnerships and manufacturing footprints for sustained advantage
Regional dynamics are shaping where investment, partnerships, and production scale will concentrate over the next several years. In the Americas, demand patterns emphasize software integration, cloud-connected diagnostics, and a strong emphasis on domestic validation labs, encouraging local suppliers to scale engineering services and Tier 1 partnerships. This region also shows pronounced interest in electrification initiatives tied to energy transition policies and incentives, which elevates demand for robust battery management sensing solutions. In contrast, Europe, Middle East & Africa presents a regulatory-forward environment where safety certification and emissions regulations drive higher standards for sensor reliability and lifecycle traceability, while localized supply chain clusters support collaborative R&D between OEMs and semiconductor specialists.
Asia-Pacific remains a hub for semiconductor manufacturing capacity and systems integration expertise, offering scale advantages and a rich ecosystem of electronics suppliers. Consequently, many design houses prioritize rapid prototyping and cost-optimized production runs there, but they must concurrently manage regional policy shifts and intellectual property considerations. As companies evaluate market entry and expansion plans across these regions, they should weigh factors such as regional certification timelines, ecosystem readiness for over-the-air updates, and the availability of skilled test and validation resources. Ultimately, regional strategies should align manufacturing footprints, supplier partnerships, and compliance roadmaps with product roadmaps to minimize time-to-deployment risk.
Competitive archetypes and partnership strategies that reveal how leading companies secure integration advantages and long-term customer commitments
A review of key companies highlights differentiated approaches to product architecture, go-to-market strategy, and partnership models. Some firms concentrate on high-performance analog front-end and signal conditioning IP that serves as the baseline for temperature, current/voltage, and position sensing, delivering proven reliability in harsh automotive environments. Other players emphasize integrated perception stacks that combine lidar, radar, and ultrasonic inputs with edge compute optimized for deterministic inference; these vendors often co-develop algorithms with OEMs to meet specific system-level performance targets. A third cohort focuses on semiconductor manufacturing scale and packaging innovations that lower cost and improve thermal performance, thereby enabling broader adoption in mass-market segments.
Across these approaches, successful companies demonstrate strong cross-functional alignment between silicon design, software toolchains, and field validation teams. They invest in functional safety certification, robust supply continuity programs, and post-sale software support to enable feature updates and calibration over the vehicle lifecycle. Partnerships between IP providers, foundries, and systems integrators are increasingly common, reflecting a realization that end-to-end value often accrues to those who can bundle hardware, software, and validation services in a way that reduces integration friction for OEMs and tier suppliers.
Concrete strategic initiatives for executives to align engineering procurement and regulatory teams and fortify supply chain resilience while unlocking system-level value
Industry leaders should pursue a set of actionable moves to capture strategic value while reducing execution risk. First, prioritize investment in modular, safety-oriented silicon architectures that support multi-sensor fusion and scale across different driving automation levels, thereby enabling reuse across vehicle lines and speeding time to market. Second, accelerate qualification of secondary manufacturing partners and diversify packaging and assembly sources to reduce supply concentration risk while maintaining strict quality oversight. Third, adopt a product strategy that bundles sensing hardware with calibration, software update, and lifecycle support services to shift the value proposition from one-time sales to recurring engagement.
In parallel, leaders should establish robust trade compliance and customs classification capabilities to navigate evolving tariff environments and to reclaim margin through better duty optimization. Additionally, embed cross-functional governance that aligns engineering, procurement, and regulatory teams around common milestones and risk metrics. Finally, pursue strategic partnerships with tier suppliers and compute platform providers to co-develop validated stacks for key applications such as battery management systems and higher-level autonomous driving functions. By executing these recommendations, organizations can both protect near-term deliveries and position themselves to capture higher-value system-level opportunities over the medium term.
A rigorous evidence-driven approach that blends executive interviews technical literature and scenario analysis to validate actionable engineering and commercial insights
The research methodology combines primary industry engagement with rigorous secondary analysis to ensure robustness and relevance of insights. Primary work included structured interviews with executives across semiconductor design houses, automotive OEMs, tier-one suppliers, and manufacturing partners to capture real-world constraints around validation, sourcing, and deployment. These engagements provided context on engineering trade-offs, certification timelines, and go-to-market priorities. Secondary review entailed a systematic synthesis of publicly available technical literature, regulatory publications, and corporate filings to corroborate interview findings and to identify emergent patterns in sensor fusion architectures and packaging innovations.
Analytical rigor was maintained through triangulation between qualitative insights and technical specifications, ensuring that observed trends reflect reproducible engineering decisions rather than isolated vendor claims. In addition, scenario analysis helped clarify the operational implications of policy shifts and procurement responses. Throughout the process, a focus on functional safety, supply chain resilience, and integration complexity guided prioritization of evidence, ensuring that recommendations align with the practical constraints and strategic objectives faced by industry decision-makers.
Concluding synthesis that clarifies how integrated sensing platforms resilient sourcing and cross-functional governance converge to create competitive advantage
In conclusion, sensing chips are at the intersection of several high-stakes vectors: vehicle electrification, automation ambitions, and supply chain realignment. The industry is moving toward integrated sensing and compute platforms that reduce integration friction and enable continuous feature evolution, while policy and trade dynamics are accelerating localization and supplier diversification. As a result, companies that marry resilient sourcing strategies with modular, safety-certified silicon and strong software support will secure disproportionate advantage. Conversely, organizations that treat sensors as interchangeable commodities risk higher total integration costs and longer validation cycles.
Therefore, the imperative for leaders is clear: align product roadmaps with regional supply realities, embed cross-functional governance to manage complexity, and pursue partnerships that extend capabilities beyond discrete components to system-level assurances. By doing so, firms can both mitigate near-term disruptions and position themselves to capture the long-term value created as vehicles become more software-defined, sensor-rich, and connected.
Note: PDF & Excel + Online Access - 1 Year
Table of Contents
182 Pages
- 1. Preface
- 1.1. Objectives of the Study
- 1.2. Market Definition
- 1.3. Market Segmentation & Coverage
- 1.4. Years Considered for the Study
- 1.5. Currency Considered for the Study
- 1.6. Language Considered for the Study
- 1.7. Key Stakeholders
- 2. Research Methodology
- 2.1. Introduction
- 2.2. Research Design
- 2.2.1. Primary Research
- 2.2.2. Secondary Research
- 2.3. Research Framework
- 2.3.1. Qualitative Analysis
- 2.3.2. Quantitative Analysis
- 2.4. Market Size Estimation
- 2.4.1. Top-Down Approach
- 2.4.2. Bottom-Up Approach
- 2.5. Data Triangulation
- 2.6. Research Outcomes
- 2.7. Research Assumptions
- 2.8. Research Limitations
- 3. Executive Summary
- 3.1. Introduction
- 3.2. CXO Perspective
- 3.3. Market Size & Growth Trends
- 3.4. Market Share Analysis, 2025
- 3.5. FPNV Positioning Matrix, 2025
- 3.6. New Revenue Opportunities
- 3.7. Next-Generation Business Models
- 3.8. Industry Roadmap
- 4. Market Overview
- 4.1. Introduction
- 4.2. Industry Ecosystem & Value Chain Analysis
- 4.2.1. Supply-Side Analysis
- 4.2.2. Demand-Side Analysis
- 4.2.3. Stakeholder Analysis
- 4.3. Porter’s Five Forces Analysis
- 4.4. PESTLE Analysis
- 4.5. Market Outlook
- 4.5.1. Near-Term Market Outlook (0–2 Years)
- 4.5.2. Medium-Term Market Outlook (3–5 Years)
- 4.5.3. Long-Term Market Outlook (5–10 Years)
- 4.6. Go-to-Market Strategy
- 5. Market Insights
- 5.1. Consumer Insights & End-User Perspective
- 5.2. Consumer Experience Benchmarking
- 5.3. Opportunity Mapping
- 5.4. Distribution Channel Analysis
- 5.5. Pricing Trend Analysis
- 5.6. Regulatory Compliance & Standards Framework
- 5.7. ESG & Sustainability Analysis
- 5.8. Disruption & Risk Scenarios
- 5.9. Return on Investment & Cost-Benefit Analysis
- 6. Cumulative Impact of United States Tariffs 2025
- 7. Cumulative Impact of Artificial Intelligence 2025
- 8. New Energy Vehicle Sensing Chip Market, by Sensor Type
- 8.1. Current/Voltage Sensors
- 8.2. Lidar Sensor
- 8.3. Position Sensors
- 8.4. Radar Sensors
- 8.5. Temperature Sensors
- 8.6. Ultrasonic Sensors
- 9. New Energy Vehicle Sensing Chip Market, by Vehicle Type
- 9.1. Battery Electric Vehicle
- 9.2. Fuel Cell Electric Vehicle
- 9.3. Plug-In Hybrid Electric Vehicle
- 10. New Energy Vehicle Sensing Chip Market, by Driving Automation Level
- 10.1. Level 2
- 10.2. Level 3
- 10.3. Level 4
- 10.4. Level 5
- 11. New Energy Vehicle Sensing Chip Market, by Application
- 11.1. Advanced Driver Assistance System
- 11.2. Autonomous Driving
- 11.3. Battery Management System
- 11.4. Powertrain Control
- 12. New Energy Vehicle Sensing Chip Market, by Distribution Channel
- 12.1. Aftermarket
- 12.2. Original Equipment Manufacturer
- 13. New Energy Vehicle Sensing Chip Market, by Region
- 13.1. Americas
- 13.1.1. North America
- 13.1.2. Latin America
- 13.2. Europe, Middle East & Africa
- 13.2.1. Europe
- 13.2.2. Middle East
- 13.2.3. Africa
- 13.3. Asia-Pacific
- 14. New Energy Vehicle Sensing Chip Market, by Group
- 14.1. ASEAN
- 14.2. GCC
- 14.3. European Union
- 14.4. BRICS
- 14.5. G7
- 14.6. NATO
- 15. New Energy Vehicle Sensing Chip Market, by Country
- 15.1. United States
- 15.2. Canada
- 15.3. Mexico
- 15.4. Brazil
- 15.5. United Kingdom
- 15.6. Germany
- 15.7. France
- 15.8. Russia
- 15.9. Italy
- 15.10. Spain
- 15.11. China
- 15.12. India
- 15.13. Japan
- 15.14. Australia
- 15.15. South Korea
- 16. United States New Energy Vehicle Sensing Chip Market
- 17. China New Energy Vehicle Sensing Chip Market
- 18. Competitive Landscape
- 18.1. Market Concentration Analysis, 2025
- 18.1.1. Concentration Ratio (CR)
- 18.1.2. Herfindahl Hirschman Index (HHI)
- 18.2. Recent Developments & Impact Analysis, 2025
- 18.3. Product Portfolio Analysis, 2025
- 18.4. Benchmarking Analysis, 2025
- 18.5. Allegro MicroSystems, Inc.
- 18.6. Amphenol Advanced Sensors
- 18.7. Analog Devices, Inc.
- 18.8. BYD Semiconductor Co., Ltd.
- 18.9. Continental AG
- 18.10. Delphi Technologies, LLC by BorgWarner Inc.
- 18.11. Denso Corporation
- 18.12. Forvia Germany GmbH
- 18.13. Infineon Technologies AG
- 18.14. Melexis N.V.
- 18.15. Murata Manufacturing Co., Ltd.
- 18.16. NXP Semiconductors N.V.
- 18.17. ON Semiconductor Corporation
- 18.18. Panasonic Automotive Systems Company
- 18.19. Robert Bosch GmbH
- 18.20. ROHM Co., Ltd.
- 18.21. Sensata Technologies, Inc.
- 18.22. STMicroelectronics N.V.
- 18.23. TDK Corporation
- 18.24. TE Connectivity Ltd.
- 18.25. Texas Instruments Incorporated
- 18.26. Valeo SA
- 18.27. ZF Friedrichshafen AG
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