Electrodeposited Copper Foils Market by Product Type (Flexible Foil, Rigid Foil), Foil Thickness (18–50 µm, <18 µm, >50 µm), Substrate Material, Surface Treatment, End Use Industry - Global Forecast 2025-2032
Description
The Electrodeposited Copper Foils Market was valued at USD 8.98 billion in 2024 and is projected to grow to USD 9.43 billion in 2025, with a CAGR of 5.21%, reaching USD 13.48 billion by 2032.
Introduction to electrodeposited copper foils covering core technologies, performance considerations, supply dynamics, and cross-industry strategic relevance
Electrodeposited copper foil represents a foundational material in a broad spectrum of advanced manufacturing applications, serving as a critical conductor, structural element, and functional interface in modern devices. Its production combines metallurgical control with precision surface engineering to deliver foils that meet demanding electrical, mechanical, and thermal requirements. As industries pursue higher performance, lower weight, and greater energy efficiency, the role of electrodeposited copper foil has shifted from a passive commodity to a strategic material whose properties materially influence product capability and system reliability.
Across sectors such as aerospace, automotive, electronics, and energy storage, design teams increasingly treat foil selection as an active lever for differentiation. This trend arises from tighter packaging constraints, increased power densities, and faster switching speeds that place greater emphasis on conductor integrity, surface uniformity, and adhesion to substrate materials. Moreover, supply chain considerations, including raw material sourcing and production footprint, now factor into procurement decisions alongside technical specifications. As a result, manufacturers and buyers must navigate a complex interplay of technology choices, supplier capabilities, and regulatory constraints to secure foils that meet present needs and anticipate future performance demands.
Shifts reshaping electrodeposited copper foil markets driven by electrification, microelectronics scaling, surface innovation, and a stronger sustainability focus
The landscape for electrodeposited copper foil is undergoing several simultaneous transformations that are reshaping supply chains, product design, and value propositions. Electrification and the rise of high-density power electronics are increasing demand for foils with superior thermal conductivity and lower resistivity, while miniaturization in microelectronics requires ever-finer control of thickness and surface patterning. These forces collectively accelerate innovation in foil metallurgy, plating chemistries, and post-deposition treatments, prompting manufacturers to invest in more precise process control and inline metrology.
At the same time, surface engineering is emerging as a differentiator; patterned and coated foils enable reliable bonding, improved signal integrity, and targeted mechanical properties. Coupled with that, sustainability pressures are driving adoption of lower-energy production techniques, closed-loop waste treatment, and increased transparency around material provenance. Finally, geopolitical and trade dynamics are redirecting sourcing strategies, encouraging buyers to diversify supplier bases and to seek partners with resilient manufacturing footprints. Together, these shifts are converging to create a market environment where technical performance, environmental stewardship, and supply-chain robustness define competitive advantage.
Analysis of the cumulative impact of United States tariffs in 2025 on electrodeposited copper foil supply chains, procurement choices, and resilience strategies
The imposition of tariffs by the United States in 2025 introduced a new variable that reverberated across electrodeposited copper foil supply chains and procurement practices. Suppliers and buyers responded by reassessing sourcing geographies, re-evaluating inventory strategies, and accelerating supplier qualification processes to mitigate exposure. In practice, this meant companies prioritized dual-sourcing arrangements and sought local or regional manufacturing partners to reduce transit times, customs complexity, and tariff-related cost volatility.
Procurement teams shifted emphasis from lowest initial price to total landed cost and supply continuity, integrating tariff scenarios into supplier scorecards and contractual terms. For manufacturing operations, the change prompted reviews of production footprints, with some firms advancing investment in localized capacity or capacity-sharing agreements to protect critical supply lines. Importantly, the tariff environment also heightened attention to product differentiation: buyers looked for higher-value foils with specialty surface treatments or performance characteristics that justified a premium and reduced the sensitivity of purchasing decisions to tariff movements. As such, resilience and strategic sourcing became central themes for stakeholders navigating the post-tariff environment.
Segmentation insights revealing how end-use industries, foil thicknesses, product types, substrate materials, and surface treatments influence demand patterns
Segment-level dynamics reveal how specific applications and product attributes drive differing requirements and adoption patterns for electrodeposited copper foil. When viewed by end-use industry, demand originates from Aerospace, Automotive, Electronics, and Energy Storage, each imposing unique performance and qualification regimes. Within Electronics, needs diverge further across Connectors, Integrated Circuits, and Printed Circuit Boards, with the latter category splitting into Flexible PCBs and Rigid PCBs to reflect distinct mechanical and thermal stresses. Energy Storage applications differentiate between Lithium Ion Batteries and Supercapacitors, where electrode behavior, cycle life, and thermal management inform foil selection.
Foil thickness also shapes application suitability: categories spanning 18–50 μm, below 18 μm, and greater than 50 μm correspond to different manufacturing processes and end-use tolerances, influencing decisions in design for manufacturability and assembly. Product type-whether Flexible Foil or Rigid Foil-further conditions substrate pairing, handling protocols, and finishing operations. The choice of substrate material, including Epoxy Resin, Polyester, and Polyimide, interacts with foil properties to determine adhesion performance, thermal expansion compatibility, and end-product reliability. Finally, surface treatment options such as Coated, Patterned, and Untreated finishes alter interfacial chemistry, solderability, and mechanical bonding capabilities, thereby allowing material suppliers and OEMs to tailor solutions to exacting functional and processing requirements. Taken together, these segmentation lenses provide a framework for aligning material selection with design objectives, production realities, and end-customer expectations.
Regional insights identifying strategic opportunities and supply chain considerations across the Americas, Europe, Middle East & Africa, and Asia-Pacific
Regional dynamics shape both demand profiles and supply-side strategies across the electrodeposited copper foil ecosystem. In the Americas, customers emphasize rapid time-to-market and localized support for high-reliability sectors such as aerospace and advanced automotive systems, which places a premium on quality certifications and responsive technical collaboration. Supply chain resilience and the ability to meet stringent regulatory expectations are recurring priorities for buyers in this region, and as a result regional suppliers focus heavily on compliance, quality systems, and agile logistics.
In Europe, Middle East & Africa, product specifications are influenced by stringent environmental standards and an emphasis on energy efficiency, creating demand for foils that can support low-loss power electronics and meet exacting lifecycle requirements. Suppliers in this geography often highlight traceability, eco-design, and partnerships with system integrators to capture opportunities in renewable energy and industrial automation. Meanwhile, the Asia-Pacific region remains central to global production networks for electronics and energy storage, with a strong emphasis on scale, process integration, and cost efficiency. Manufacturers there continue to invest in capacity, advanced surface treatments, and close collaboration with downstream PCB and battery producers to support rapid product iteration and high-volume manufacturing. Collectively, these regional characteristics drive differentiated go-to-market approaches and inform where investments in capacity, quality systems, and customer engagement yield the greatest returns.
Company insights on competitive positioning, technology investment, partnership strategies, and operational priorities shaping the copper foil industry
Competitive dynamics among companies in the electrodeposited copper foil space are shaped by technological capabilities, vertical integration, and strategic partnerships. Leading manufacturers invest in advanced plating lines, automated quality inspection, and specialized surface treatments to meet the nuanced requirements of high-performance electronics and energy storage applications. These investments support tighter tolerances, enhanced adhesion properties, and improved surface uniformity that benefit downstream processes such as lamination, bonding, and microfabrication.
Partnerships with substrate suppliers, PCB fabricators, and battery makers enable closer co-development and faster qualification cycles, reducing time-to-adoption for novel foil formulations. Operational priorities focus on yield improvement, traceability, and environmental compliance, while competitive positioning often emphasizes the ability to deliver application-specific solutions rather than generic commodity foils. In addition, some companies pursue geographic diversification to serve regional demand quickly and to hedge against trade disruptions. Taken together, these company-level strategies highlight a market where technical differentiation and integrated supply relationships increasingly determine long-term competitiveness.
Practical recommendations for leaders to boost supply resilience, refine product differentiation, optimize sourcing, and accelerate sustainable process adoption
Industry leaders should adopt a balanced strategy that simultaneously protects supply continuity and fosters product differentiation. First, diversifying the supply base and qualifying multiple suppliers across different regions will reduce single-point exposure and support continuity in periods of trade disruption. Complementary to this, leaders should prioritize partnerships that enable co-development of specialty foils and surface treatments that align with high-value applications, creating defensible product niches.
Operationally, investing in advanced process control, inline metrology, and yield improvement programs will lower defect rates and support consistent performance across batches. Procurement teams should integrate total landed cost assessments and scenario-based contracting into supplier selection to reflect the full cost implications of tariffs, logistics, and lead times. From a sustainability standpoint, companies must accelerate initiatives that reduce energy intensity, tighten waste controls, and increase transparency around material origins to satisfy both regulatory requirements and customer expectations. Finally, executives should foster cross-functional collaboration among R&D, manufacturing, and commercial teams to translate material innovations into credible value propositions that can be effectively communicated to OEM partners and system integrators.
Research methodology outlining data collection, primary and secondary approaches, validation techniques, and analytical processes applied in the study
The research approach relies on a layered methodology that combines primary interviews, technical document review, and rigorous secondary-source validation to form a coherent evidence base. Primary engagement included structured discussions with material scientists, procurement leads, and manufacturing engineers to capture firsthand perspectives on technical requirements, qualification hurdles, and supply dynamics. These conversations were complemented by a systematic review of product specifications, patent filings, and supplier technical literature to map technological differentiators and process capabilities.
Analytical processes emphasized triangulation: findings from interviews were cross-validated against documented process parameters and supplier disclosures to ensure consistency and to identify areas requiring deeper technical review. Validation techniques included comparative assessment of reported material properties, supplier quality systems, and production methods. Where appropriate, technical claims were evaluated in the context of industry standards and common testing protocols. Together, these methodological elements provide a robust foundation for the insights presented, supporting defensible conclusions while highlighting areas where further primary testing or supplier audits may be warranted.
Conclusion synthesizing technical, commercial, and regulatory implications for electrodeposited copper foils to guide strategic decisions, operational priorities
The synthesis of technical, commercial, and regulatory perspectives yields a clear set of implications for stakeholders engaged with electrodeposited copper foil. Technically, advances in surface engineering and process control are elevating the minimum performance expectations for foils used in high-density electronics and energy storage. Commercially, procurement strategies are evolving to prioritize resilience and total cost visibility, and suppliers that can offer differentiated, application-ready solutions are best positioned to capture premium opportunities. Regulatory and sustainability considerations increasingly influence sourcing and process decisions, making environmental performance an inseparable component of supplier evaluation.
In sum, the intersection of material innovation, regional supply dynamics, and evolving customer expectations suggests a landscape where strategic partnerships and targeted investment in capability deliver the most durable advantage. Organizations that align technical development with resilient sourcing and clear sustainability credentials will be positioned to move from commodity buying cycles into collaborative, value-creating relationships with OEMs and integrators.
Note: PDF & Excel + Online Access - 1 Year
Introduction to electrodeposited copper foils covering core technologies, performance considerations, supply dynamics, and cross-industry strategic relevance
Electrodeposited copper foil represents a foundational material in a broad spectrum of advanced manufacturing applications, serving as a critical conductor, structural element, and functional interface in modern devices. Its production combines metallurgical control with precision surface engineering to deliver foils that meet demanding electrical, mechanical, and thermal requirements. As industries pursue higher performance, lower weight, and greater energy efficiency, the role of electrodeposited copper foil has shifted from a passive commodity to a strategic material whose properties materially influence product capability and system reliability.
Across sectors such as aerospace, automotive, electronics, and energy storage, design teams increasingly treat foil selection as an active lever for differentiation. This trend arises from tighter packaging constraints, increased power densities, and faster switching speeds that place greater emphasis on conductor integrity, surface uniformity, and adhesion to substrate materials. Moreover, supply chain considerations, including raw material sourcing and production footprint, now factor into procurement decisions alongside technical specifications. As a result, manufacturers and buyers must navigate a complex interplay of technology choices, supplier capabilities, and regulatory constraints to secure foils that meet present needs and anticipate future performance demands.
Shifts reshaping electrodeposited copper foil markets driven by electrification, microelectronics scaling, surface innovation, and a stronger sustainability focus
The landscape for electrodeposited copper foil is undergoing several simultaneous transformations that are reshaping supply chains, product design, and value propositions. Electrification and the rise of high-density power electronics are increasing demand for foils with superior thermal conductivity and lower resistivity, while miniaturization in microelectronics requires ever-finer control of thickness and surface patterning. These forces collectively accelerate innovation in foil metallurgy, plating chemistries, and post-deposition treatments, prompting manufacturers to invest in more precise process control and inline metrology.
At the same time, surface engineering is emerging as a differentiator; patterned and coated foils enable reliable bonding, improved signal integrity, and targeted mechanical properties. Coupled with that, sustainability pressures are driving adoption of lower-energy production techniques, closed-loop waste treatment, and increased transparency around material provenance. Finally, geopolitical and trade dynamics are redirecting sourcing strategies, encouraging buyers to diversify supplier bases and to seek partners with resilient manufacturing footprints. Together, these shifts are converging to create a market environment where technical performance, environmental stewardship, and supply-chain robustness define competitive advantage.
Analysis of the cumulative impact of United States tariffs in 2025 on electrodeposited copper foil supply chains, procurement choices, and resilience strategies
The imposition of tariffs by the United States in 2025 introduced a new variable that reverberated across electrodeposited copper foil supply chains and procurement practices. Suppliers and buyers responded by reassessing sourcing geographies, re-evaluating inventory strategies, and accelerating supplier qualification processes to mitigate exposure. In practice, this meant companies prioritized dual-sourcing arrangements and sought local or regional manufacturing partners to reduce transit times, customs complexity, and tariff-related cost volatility.
Procurement teams shifted emphasis from lowest initial price to total landed cost and supply continuity, integrating tariff scenarios into supplier scorecards and contractual terms. For manufacturing operations, the change prompted reviews of production footprints, with some firms advancing investment in localized capacity or capacity-sharing agreements to protect critical supply lines. Importantly, the tariff environment also heightened attention to product differentiation: buyers looked for higher-value foils with specialty surface treatments or performance characteristics that justified a premium and reduced the sensitivity of purchasing decisions to tariff movements. As such, resilience and strategic sourcing became central themes for stakeholders navigating the post-tariff environment.
Segmentation insights revealing how end-use industries, foil thicknesses, product types, substrate materials, and surface treatments influence demand patterns
Segment-level dynamics reveal how specific applications and product attributes drive differing requirements and adoption patterns for electrodeposited copper foil. When viewed by end-use industry, demand originates from Aerospace, Automotive, Electronics, and Energy Storage, each imposing unique performance and qualification regimes. Within Electronics, needs diverge further across Connectors, Integrated Circuits, and Printed Circuit Boards, with the latter category splitting into Flexible PCBs and Rigid PCBs to reflect distinct mechanical and thermal stresses. Energy Storage applications differentiate between Lithium Ion Batteries and Supercapacitors, where electrode behavior, cycle life, and thermal management inform foil selection.
Foil thickness also shapes application suitability: categories spanning 18–50 μm, below 18 μm, and greater than 50 μm correspond to different manufacturing processes and end-use tolerances, influencing decisions in design for manufacturability and assembly. Product type-whether Flexible Foil or Rigid Foil-further conditions substrate pairing, handling protocols, and finishing operations. The choice of substrate material, including Epoxy Resin, Polyester, and Polyimide, interacts with foil properties to determine adhesion performance, thermal expansion compatibility, and end-product reliability. Finally, surface treatment options such as Coated, Patterned, and Untreated finishes alter interfacial chemistry, solderability, and mechanical bonding capabilities, thereby allowing material suppliers and OEMs to tailor solutions to exacting functional and processing requirements. Taken together, these segmentation lenses provide a framework for aligning material selection with design objectives, production realities, and end-customer expectations.
Regional insights identifying strategic opportunities and supply chain considerations across the Americas, Europe, Middle East & Africa, and Asia-Pacific
Regional dynamics shape both demand profiles and supply-side strategies across the electrodeposited copper foil ecosystem. In the Americas, customers emphasize rapid time-to-market and localized support for high-reliability sectors such as aerospace and advanced automotive systems, which places a premium on quality certifications and responsive technical collaboration. Supply chain resilience and the ability to meet stringent regulatory expectations are recurring priorities for buyers in this region, and as a result regional suppliers focus heavily on compliance, quality systems, and agile logistics.
In Europe, Middle East & Africa, product specifications are influenced by stringent environmental standards and an emphasis on energy efficiency, creating demand for foils that can support low-loss power electronics and meet exacting lifecycle requirements. Suppliers in this geography often highlight traceability, eco-design, and partnerships with system integrators to capture opportunities in renewable energy and industrial automation. Meanwhile, the Asia-Pacific region remains central to global production networks for electronics and energy storage, with a strong emphasis on scale, process integration, and cost efficiency. Manufacturers there continue to invest in capacity, advanced surface treatments, and close collaboration with downstream PCB and battery producers to support rapid product iteration and high-volume manufacturing. Collectively, these regional characteristics drive differentiated go-to-market approaches and inform where investments in capacity, quality systems, and customer engagement yield the greatest returns.
Company insights on competitive positioning, technology investment, partnership strategies, and operational priorities shaping the copper foil industry
Competitive dynamics among companies in the electrodeposited copper foil space are shaped by technological capabilities, vertical integration, and strategic partnerships. Leading manufacturers invest in advanced plating lines, automated quality inspection, and specialized surface treatments to meet the nuanced requirements of high-performance electronics and energy storage applications. These investments support tighter tolerances, enhanced adhesion properties, and improved surface uniformity that benefit downstream processes such as lamination, bonding, and microfabrication.
Partnerships with substrate suppliers, PCB fabricators, and battery makers enable closer co-development and faster qualification cycles, reducing time-to-adoption for novel foil formulations. Operational priorities focus on yield improvement, traceability, and environmental compliance, while competitive positioning often emphasizes the ability to deliver application-specific solutions rather than generic commodity foils. In addition, some companies pursue geographic diversification to serve regional demand quickly and to hedge against trade disruptions. Taken together, these company-level strategies highlight a market where technical differentiation and integrated supply relationships increasingly determine long-term competitiveness.
Practical recommendations for leaders to boost supply resilience, refine product differentiation, optimize sourcing, and accelerate sustainable process adoption
Industry leaders should adopt a balanced strategy that simultaneously protects supply continuity and fosters product differentiation. First, diversifying the supply base and qualifying multiple suppliers across different regions will reduce single-point exposure and support continuity in periods of trade disruption. Complementary to this, leaders should prioritize partnerships that enable co-development of specialty foils and surface treatments that align with high-value applications, creating defensible product niches.
Operationally, investing in advanced process control, inline metrology, and yield improvement programs will lower defect rates and support consistent performance across batches. Procurement teams should integrate total landed cost assessments and scenario-based contracting into supplier selection to reflect the full cost implications of tariffs, logistics, and lead times. From a sustainability standpoint, companies must accelerate initiatives that reduce energy intensity, tighten waste controls, and increase transparency around material origins to satisfy both regulatory requirements and customer expectations. Finally, executives should foster cross-functional collaboration among R&D, manufacturing, and commercial teams to translate material innovations into credible value propositions that can be effectively communicated to OEM partners and system integrators.
Research methodology outlining data collection, primary and secondary approaches, validation techniques, and analytical processes applied in the study
The research approach relies on a layered methodology that combines primary interviews, technical document review, and rigorous secondary-source validation to form a coherent evidence base. Primary engagement included structured discussions with material scientists, procurement leads, and manufacturing engineers to capture firsthand perspectives on technical requirements, qualification hurdles, and supply dynamics. These conversations were complemented by a systematic review of product specifications, patent filings, and supplier technical literature to map technological differentiators and process capabilities.
Analytical processes emphasized triangulation: findings from interviews were cross-validated against documented process parameters and supplier disclosures to ensure consistency and to identify areas requiring deeper technical review. Validation techniques included comparative assessment of reported material properties, supplier quality systems, and production methods. Where appropriate, technical claims were evaluated in the context of industry standards and common testing protocols. Together, these methodological elements provide a robust foundation for the insights presented, supporting defensible conclusions while highlighting areas where further primary testing or supplier audits may be warranted.
Conclusion synthesizing technical, commercial, and regulatory implications for electrodeposited copper foils to guide strategic decisions, operational priorities
The synthesis of technical, commercial, and regulatory perspectives yields a clear set of implications for stakeholders engaged with electrodeposited copper foil. Technically, advances in surface engineering and process control are elevating the minimum performance expectations for foils used in high-density electronics and energy storage. Commercially, procurement strategies are evolving to prioritize resilience and total cost visibility, and suppliers that can offer differentiated, application-ready solutions are best positioned to capture premium opportunities. Regulatory and sustainability considerations increasingly influence sourcing and process decisions, making environmental performance an inseparable component of supplier evaluation.
In sum, the intersection of material innovation, regional supply dynamics, and evolving customer expectations suggests a landscape where strategic partnerships and targeted investment in capability deliver the most durable advantage. Organizations that align technical development with resilient sourcing and clear sustainability credentials will be positioned to move from commodity buying cycles into collaborative, value-creating relationships with OEMs and integrators.
Note: PDF & Excel + Online Access - 1 Year
Table of Contents
197 Pages
- 1. Preface
- 1.1. Objectives of the Study
- 1.2. Market Segmentation & Coverage
- 1.3. Years Considered for the Study
- 1.4. Currency
- 1.5. Language
- 1.6. Stakeholders
- 2. Research Methodology
- 3. Executive Summary
- 4. Market Overview
- 5. Market Insights
- 5.1. Growing demand for thinner electrodeposited copper foils in advanced flexible electronics applications
- 5.2. Adoption of high-strength ultra-thin copper foils to meet next-gen semiconductor packaging requirements
- 5.3. Integration of ecofriendly acid recycling and wastewater treatment in copper foil production lines
- 5.4. Development of high-frequency optimized copper substrates for 5G and data center multilayer PCBs
- 5.5. Surge in automotive-grade electrodeposited copper foils with enhanced thermal stability for EV battery modules
- 5.6. Implementation of roll-to-roll deposition technologies to boost production efficiency and reduce defects
- 5.7. Strategic capacity expansions in Asia-Pacific driven by aggressive EV and renewable energy project rollouts
- 5.8. Collaboration between foil manufacturers and material science startups for graphene-infused copper composites
- 5.9. Rise of digital twins and predictive maintenance in copper foil manufacturing to minimize downtime
- 6. Cumulative Impact of United States Tariffs 2025
- 7. Cumulative Impact of Artificial Intelligence 2025
- 8. Electrodeposited Copper Foils Market, by Product Type
- 8.1. Flexible Foil
- 8.2. Rigid Foil
- 9. Electrodeposited Copper Foils Market, by Foil Thickness
- 9.1. 18–50 μm
- 9.2. <18 μm
- 9.3. >50 μm
- 10. Electrodeposited Copper Foils Market, by Substrate Material
- 10.1. Epoxy Resin
- 10.2. Polyester
- 10.3. Polyimide
- 11. Electrodeposited Copper Foils Market, by Surface Treatment
- 11.1. Coated
- 11.2. Patterned
- 11.3. Untreated
- 12. Electrodeposited Copper Foils Market, by End Use Industry
- 12.1. Aerospace
- 12.2. Automotive
- 12.3. Electronics
- 12.3.1. Connectors
- 12.3.2. Integrated Circuits
- 12.3.3. Printed Circuit Boards
- 12.3.3.1. Flexible Pcbs
- 12.3.3.2. Rigid Pcbs
- 12.4. Energy Storage
- 12.4.1. Lithium Ion Batteries
- 12.4.2. Supercapacitors
- 13. Electrodeposited Copper Foils Market, by Region
- 13.1. Americas
- 13.1.1. North America
- 13.1.2. Latin America
- 13.2. Europe, Middle East & Africa
- 13.2.1. Europe
- 13.2.2. Middle East
- 13.2.3. Africa
- 13.3. Asia-Pacific
- 14. Electrodeposited Copper Foils Market, by Group
- 14.1. ASEAN
- 14.2. GCC
- 14.3. European Union
- 14.4. BRICS
- 14.5. G7
- 14.6. NATO
- 15. Electrodeposited Copper Foils Market, by Country
- 15.1. United States
- 15.2. Canada
- 15.3. Mexico
- 15.4. Brazil
- 15.5. United Kingdom
- 15.6. Germany
- 15.7. France
- 15.8. Russia
- 15.9. Italy
- 15.10. Spain
- 15.11. China
- 15.12. India
- 15.13. Japan
- 15.14. Australia
- 15.15. South Korea
- 16. Competitive Landscape
- 16.1. Market Share Analysis, 2024
- 16.2. FPNV Positioning Matrix, 2024
- 16.3. Competitive Analysis
- 16.3.1. FUKUDA METAL FOIL & POWDER CO., LTD.
- 16.3.2. Furukawa Electric Co., Ltd.
- 16.3.3. Iljin Materials
- 16.3.4. Industrie De Nora S.p.A.
- 16.3.5. Jiangxi Copper Corp.
- 16.3.6. JX Nippon Mining & Metals Corporation
- 16.3.7. Kingboard Copper Foil Holdings Limited
- 16.3.8. LCY TECHNOLOGY CORP.
- 16.3.9. LS Mtron Co., Ltd.
- 16.3.10. Mitsui Mining & Smelting Co., Ltd.
- 16.3.11. Nan Ya Plastics Corporation
- 16.3.12. Nitto Denko Corporation
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