DC-DC Converter Market by Topology (Boost, Buck, Buck-Boost), Architecture (Isolated, Non Isolated), End Use, Output Power Range, Input Voltage Range, Mounting Type, Switching Frequency - Global Forecast 2025-2032
Description
The DC-DC Converter Market was valued at USD 5.63 billion in 2024 and is projected to grow to USD 5.99 billion in 2025, with a CAGR of 6.43%, reaching USD 9.28 billion by 2032.
A comprehensive introduction that frames technological evolution, application demands, and strategic considerations shaping contemporary DC‑DC converter decisions
This executive summary opens with a clear framing of the DC‑DC converter domain, establishing context for technology evolution, application demands, and supply chain dynamics that shape today’s decisions. The industry’s technical trajectory centers on higher power density, improved thermal management, and the adoption of wide‑bandgap semiconductors, which together are redefining design tradeoffs across power conversion solutions. In parallel, end‑use sectors drive divergent requirements: automotive systems emphasize functional safety and temperature resilience, consumer electronics prioritize size and efficiency, healthcare demands reliability and regulatory compliance, industrial markets seek robustness and serviceability, and telecommunications benefit from modularity and high switching frequencies.
Against this backdrop, regulatory environments and trade policies are prompting procurement and engineering teams to reassess sourcing, qualification timelines, and lifecycle strategies. Rapid innovation in control architectures and packaging compels firms to balance short‑term cost pressures with long‑term platform investments. Throughout this introduction, the emphasis remains practical: understand the intersection of materials, topology choices, architecture selection, and application constraints to make informed product, sourcing, and partnership decisions without relying on assumptions about future volumes.
How advances in wide‑bandgap semiconductors, digital control, and modular integration are reshaping design choices and supply strategies for DC‑DC converters
The landscape for DC‑DC converters is undergoing transformative shifts driven by materials science, control electronics, and systemic integration. Wide‑bandgap devices such as gallium nitride and silicon carbide are accelerating transitions to higher switching frequencies and reduced losses, thereby enabling smaller passives and more compact thermal solutions. Concurrently, digital control and adaptive power management are enabling converters to respond dynamically to load transients, enhancing efficiency across varying operating points.
System architects are also rethinking converter placement and topology to support distributed power architectures in automotive electrification and data center edge deployments. Design-for-manufacturability and modularity have surged in importance as companies seek to shorten qualification cycles and improve aftermarket serviceability. Moreover, environmental and regulatory pressures are raising expectations for lifecycle impact, recyclability, and energy efficiency, which in turn influence supply chain selection and component sourcing. These shifts force a reevaluation of product roadmaps, partnership models, and investment priorities to remain competitive and resilient.
Assessing the cumulative operational and strategic effects of United States tariff measures through 2025 on DC‑DC converter sourcing, manufacturing, and qualification timelines
Cumulative tariff actions enacted in the United States through 2025 have introduced new layers of complexity across global supply chains for electronic components and assemblies. Suppliers and OEMs have responded with a mix of strategic measures including nearshoring, multi‑sourcing, and greater inventory buffer strategies to mitigate exposure to tariff volatility and transit disruptions. As a result, procurement teams face higher landed costs for certain imports while engineering departments encounter constraints when preferred components are temporarily restricted or rerouted.
Beyond immediate cost implications, tariffs have driven longer‑term supplier qualification initiatives within regions that benefit from preferential trade terms or domestic manufacturing incentives. This has accelerated conversations about local assembly, alternative bill‑of‑materials choices, and deeper collaboration with contract manufacturers capable of dual‑sourcing key passive and active components. Importantly, firms that proactively integrated tariff scenarios into their supplier risk assessments and product roadmaps have reduced time‑to‑market friction and preserved margin flexibility, while those that delayed adaptation experienced protracted qualification cycles and unpredictable procurement lead times.
Detailed segmentation analysis revealing how topology, architecture, application requirements, power and voltage bands, mounting options, and switching frequencies drive product differentiation
A granular understanding of segmentation highlights where technical differentiation and commercial opportunity intersect across topology, architecture, end uses, output power ranges, input voltage ranges, mounting types, and switching frequency bands. Designers choose between boost, buck, buck‑boost, Cuk, and Sepic topologies based on conversion direction, transient response requirements, and efficiency targets, while the choice between isolated and non‑isolated architectures is driven by safety isolation needs, grounding schemes, and system integration constraints. Application contexts such as automotive, consumer electronics, healthcare, industrial, and telecommunication impose unique reliability, regulatory, and performance criteria that must be reconciled with product cost and lifecycle considerations.
Output power expectations spanning less than 10 W through 10–50 W, 50–150 W, and greater than 150 W dictate cooling strategies, component stress margins, and packaging form factors. Input voltage ranges from less than 12 V to 12–24 V, 24–48 V, and greater than 48 V influence inrush behavior, start‑up sequencing, and fault management. Mounting choices between chassis mount, surface mount, and through hole reflect assembly processes, mechanical stability, and thermal pathways, while switching frequency decisions-below 500 kHz, between 500 kHz and 1 MHz, and above 1 MHz-balance inductor size, EMI mitigation, and switching losses. When considered together, these segmentation vectors inform prioritized R&D focus, qualification plans, and commercialization strategies that align with specific target markets.
Regional dynamics and operational imperatives shaping DC‑DC converter sourcing, certification, and commercialization across the Americas, Europe Middle East & Africa, and Asia‑Pacific
Regional dynamics materially affect supply chain design, regulatory compliance, and go‑to‑market approaches across the Americas, Europe, Middle East & Africa, and Asia‑Pacific. Market participants operating in the Americas often emphasize responsiveness, localized assembly, and close collaboration with automotive and industrial OEMs to meet stringent functional safety and reliability expectations. In contrast, Europe, Middle East & Africa features a regulatory environment that elevates energy efficiency and environmental compliance considerations, prompting suppliers to highlight lifecycle performance and certification readiness in their value propositions.
Asia‑Pacific remains a critical manufacturing and innovation hub where close proximity to semiconductor fabs, passive component suppliers, and contract manufacturers supports rapid iteration and scale. Nevertheless, regional trade policies, logistics constraints, and labor dynamics compel multinational firms to tailor their supplier networks, intellectual property protections, and qualification roadmaps by geography. Across regions, firms that combine local regulatory know‑how with cross‑regional sourcing flexibility reduce risk and accelerate adoption among geographically diverse customers.
Competitive and collaborative company insights that illustrate the interplay between semiconductor integration, modular packaging, and application engineering in DC‑DC converter innovation
Competitive dynamics center on firms that blend semiconductor integration, power module packaging, and application‑specific system engineering to deliver differentiated reliability and efficiency. Established analog and power semiconductor companies lead in controller and FET integration, while specialized power module manufacturers focus on thermal architecture, mechanical robustness, and high‑density packaging that serve demanding applications. Newer entrants leverage wide‑bandgap technologies and modular power architectures to offer compelling tradeoffs in power density and efficiency, but they must validate long‑term reliability to win adoption in safety‑critical sectors.
Partnerships between device manufacturers, magnetics specialists, and contract assemblers have emerged as a common route to accelerate time to market and reduce qualification friction. Meanwhile, incumbents are responding by streamlining reference designs, expanding evaluation ecosystems, and offering application engineering services to shorten customer integration cycles. For decision‑makers, supplier selection increasingly hinges on demonstrated manufacturing maturity, multi‑geography support, and a willingness to co‑develop tailored solutions that address thermal, EMI, and compliance constraints specific to the end application.
Actionable strategic recommendations for product leaders and procurement executives to accelerate innovation, build resilience, and optimize DC‑DC converter portfolios
Industry leaders should pursue a set of actionable moves to protect margin, accelerate innovation, and meet evolving customer expectations. First, invest selectively in wide‑bandgap device adoption and partner closely with semiconductor vendors to co‑validate topologies that exploit higher switching speeds without compromising reliability. Second, redesign platforms for modularity and serviceability so that upgrades to power stages or control firmware can be deployed with minimal requalification effort. Third, diversify component sources and qualify second‑source passives and magnetics early in the design process to shorten risk windows tied to trade policy shifts and supply shortages.
In addition, companies should strengthen thermal management and EMI strategies to preserve efficiency gains as switching frequencies increase, while also formalizing lifecycle assessments and compliance workflows to meet regional regulatory expectations. Finally, prioritize strategic partnerships with contract manufacturers that offer multi‑site production, robust quality management, and transparent traceability to support accelerated scale‑up when demand materializes. These combined steps create resilience and preserve strategic optionality across product, supply, and commercial dimensions.
A rigorous mixed‑methods research methodology combining primary stakeholder interviews, technical literature review, supply chain mapping, and empirical validation to ensure reproducible insights
The research methodology integrates multiple evidence streams to ensure robust, triangulated findings that inform technical and commercial decisions. Primary research included structured interviews with systems engineers, procurement leads, and manufacturing managers across automotive, industrial, telecom, healthcare, and consumer sectors to validate technology priorities, qualification hurdles, and sourcing preferences. Secondary research covered technical literature, standards documents, patent filings, and public product specifications to map technology trajectories and packaging innovations, while supply chain analysis examined BOM exposures, lead‑time sensitivities, and regional manufacturing footprints.
Findings were validated through cross‑checks against independent expert reviews and reverse‑engineered product teardowns to confirm component choices and thermal strategies. Where possible, technology performance claims were compared against empirical datasheet parameters and application notes to ensure consistency. The methodology emphasizes reproducibility and transparency: assumptions are documented, source types are cataloged, and conclusions are presented with the confidence context necessary for executive decision making.
A concise conclusion that synthesizes technology trends, supply chain risks, and strategic imperatives necessary for sustained competitive advantage in DC‑DC converters
In conclusion, the DC‑DC converter landscape presents a compelling mix of technical opportunity and strategic complexity that demands deliberate choices from product teams, procurement, and corporate leaders. Advances in wide‑bandgap semiconductors and digital control unlock higher power densities and adaptive management capabilities, but they also require focused investments in thermal design, EMI mitigation, and long‑term reliability validation. Simultaneously, segmentation across topology, architecture, end use, power and voltage bands, mounting, and switching frequency creates differentiated pathways to value that must be matched to customer priorities and regulatory constraints.
Organizations that proactively incorporate tariff and regional risk considerations into their sourcing and qualification strategies will reduce downstream disruption and maintain competitive delivery timelines. By combining selective technology adoption, modular platform thinking, and diversified supplier networks, companies can accelerate innovation while preserving margin and ensuring product readiness for demanding applications. Ultimately, success depends on aligning engineering excellence with pragmatic commercial planning to convert technical advantage into sustained market relevance.
Note: PDF & Excel + Online Access - 1 Year
A comprehensive introduction that frames technological evolution, application demands, and strategic considerations shaping contemporary DC‑DC converter decisions
This executive summary opens with a clear framing of the DC‑DC converter domain, establishing context for technology evolution, application demands, and supply chain dynamics that shape today’s decisions. The industry’s technical trajectory centers on higher power density, improved thermal management, and the adoption of wide‑bandgap semiconductors, which together are redefining design tradeoffs across power conversion solutions. In parallel, end‑use sectors drive divergent requirements: automotive systems emphasize functional safety and temperature resilience, consumer electronics prioritize size and efficiency, healthcare demands reliability and regulatory compliance, industrial markets seek robustness and serviceability, and telecommunications benefit from modularity and high switching frequencies.
Against this backdrop, regulatory environments and trade policies are prompting procurement and engineering teams to reassess sourcing, qualification timelines, and lifecycle strategies. Rapid innovation in control architectures and packaging compels firms to balance short‑term cost pressures with long‑term platform investments. Throughout this introduction, the emphasis remains practical: understand the intersection of materials, topology choices, architecture selection, and application constraints to make informed product, sourcing, and partnership decisions without relying on assumptions about future volumes.
How advances in wide‑bandgap semiconductors, digital control, and modular integration are reshaping design choices and supply strategies for DC‑DC converters
The landscape for DC‑DC converters is undergoing transformative shifts driven by materials science, control electronics, and systemic integration. Wide‑bandgap devices such as gallium nitride and silicon carbide are accelerating transitions to higher switching frequencies and reduced losses, thereby enabling smaller passives and more compact thermal solutions. Concurrently, digital control and adaptive power management are enabling converters to respond dynamically to load transients, enhancing efficiency across varying operating points.
System architects are also rethinking converter placement and topology to support distributed power architectures in automotive electrification and data center edge deployments. Design-for-manufacturability and modularity have surged in importance as companies seek to shorten qualification cycles and improve aftermarket serviceability. Moreover, environmental and regulatory pressures are raising expectations for lifecycle impact, recyclability, and energy efficiency, which in turn influence supply chain selection and component sourcing. These shifts force a reevaluation of product roadmaps, partnership models, and investment priorities to remain competitive and resilient.
Assessing the cumulative operational and strategic effects of United States tariff measures through 2025 on DC‑DC converter sourcing, manufacturing, and qualification timelines
Cumulative tariff actions enacted in the United States through 2025 have introduced new layers of complexity across global supply chains for electronic components and assemblies. Suppliers and OEMs have responded with a mix of strategic measures including nearshoring, multi‑sourcing, and greater inventory buffer strategies to mitigate exposure to tariff volatility and transit disruptions. As a result, procurement teams face higher landed costs for certain imports while engineering departments encounter constraints when preferred components are temporarily restricted or rerouted.
Beyond immediate cost implications, tariffs have driven longer‑term supplier qualification initiatives within regions that benefit from preferential trade terms or domestic manufacturing incentives. This has accelerated conversations about local assembly, alternative bill‑of‑materials choices, and deeper collaboration with contract manufacturers capable of dual‑sourcing key passive and active components. Importantly, firms that proactively integrated tariff scenarios into their supplier risk assessments and product roadmaps have reduced time‑to‑market friction and preserved margin flexibility, while those that delayed adaptation experienced protracted qualification cycles and unpredictable procurement lead times.
Detailed segmentation analysis revealing how topology, architecture, application requirements, power and voltage bands, mounting options, and switching frequencies drive product differentiation
A granular understanding of segmentation highlights where technical differentiation and commercial opportunity intersect across topology, architecture, end uses, output power ranges, input voltage ranges, mounting types, and switching frequency bands. Designers choose between boost, buck, buck‑boost, Cuk, and Sepic topologies based on conversion direction, transient response requirements, and efficiency targets, while the choice between isolated and non‑isolated architectures is driven by safety isolation needs, grounding schemes, and system integration constraints. Application contexts such as automotive, consumer electronics, healthcare, industrial, and telecommunication impose unique reliability, regulatory, and performance criteria that must be reconciled with product cost and lifecycle considerations.
Output power expectations spanning less than 10 W through 10–50 W, 50–150 W, and greater than 150 W dictate cooling strategies, component stress margins, and packaging form factors. Input voltage ranges from less than 12 V to 12–24 V, 24–48 V, and greater than 48 V influence inrush behavior, start‑up sequencing, and fault management. Mounting choices between chassis mount, surface mount, and through hole reflect assembly processes, mechanical stability, and thermal pathways, while switching frequency decisions-below 500 kHz, between 500 kHz and 1 MHz, and above 1 MHz-balance inductor size, EMI mitigation, and switching losses. When considered together, these segmentation vectors inform prioritized R&D focus, qualification plans, and commercialization strategies that align with specific target markets.
Regional dynamics and operational imperatives shaping DC‑DC converter sourcing, certification, and commercialization across the Americas, Europe Middle East & Africa, and Asia‑Pacific
Regional dynamics materially affect supply chain design, regulatory compliance, and go‑to‑market approaches across the Americas, Europe, Middle East & Africa, and Asia‑Pacific. Market participants operating in the Americas often emphasize responsiveness, localized assembly, and close collaboration with automotive and industrial OEMs to meet stringent functional safety and reliability expectations. In contrast, Europe, Middle East & Africa features a regulatory environment that elevates energy efficiency and environmental compliance considerations, prompting suppliers to highlight lifecycle performance and certification readiness in their value propositions.
Asia‑Pacific remains a critical manufacturing and innovation hub where close proximity to semiconductor fabs, passive component suppliers, and contract manufacturers supports rapid iteration and scale. Nevertheless, regional trade policies, logistics constraints, and labor dynamics compel multinational firms to tailor their supplier networks, intellectual property protections, and qualification roadmaps by geography. Across regions, firms that combine local regulatory know‑how with cross‑regional sourcing flexibility reduce risk and accelerate adoption among geographically diverse customers.
Competitive and collaborative company insights that illustrate the interplay between semiconductor integration, modular packaging, and application engineering in DC‑DC converter innovation
Competitive dynamics center on firms that blend semiconductor integration, power module packaging, and application‑specific system engineering to deliver differentiated reliability and efficiency. Established analog and power semiconductor companies lead in controller and FET integration, while specialized power module manufacturers focus on thermal architecture, mechanical robustness, and high‑density packaging that serve demanding applications. Newer entrants leverage wide‑bandgap technologies and modular power architectures to offer compelling tradeoffs in power density and efficiency, but they must validate long‑term reliability to win adoption in safety‑critical sectors.
Partnerships between device manufacturers, magnetics specialists, and contract assemblers have emerged as a common route to accelerate time to market and reduce qualification friction. Meanwhile, incumbents are responding by streamlining reference designs, expanding evaluation ecosystems, and offering application engineering services to shorten customer integration cycles. For decision‑makers, supplier selection increasingly hinges on demonstrated manufacturing maturity, multi‑geography support, and a willingness to co‑develop tailored solutions that address thermal, EMI, and compliance constraints specific to the end application.
Actionable strategic recommendations for product leaders and procurement executives to accelerate innovation, build resilience, and optimize DC‑DC converter portfolios
Industry leaders should pursue a set of actionable moves to protect margin, accelerate innovation, and meet evolving customer expectations. First, invest selectively in wide‑bandgap device adoption and partner closely with semiconductor vendors to co‑validate topologies that exploit higher switching speeds without compromising reliability. Second, redesign platforms for modularity and serviceability so that upgrades to power stages or control firmware can be deployed with minimal requalification effort. Third, diversify component sources and qualify second‑source passives and magnetics early in the design process to shorten risk windows tied to trade policy shifts and supply shortages.
In addition, companies should strengthen thermal management and EMI strategies to preserve efficiency gains as switching frequencies increase, while also formalizing lifecycle assessments and compliance workflows to meet regional regulatory expectations. Finally, prioritize strategic partnerships with contract manufacturers that offer multi‑site production, robust quality management, and transparent traceability to support accelerated scale‑up when demand materializes. These combined steps create resilience and preserve strategic optionality across product, supply, and commercial dimensions.
A rigorous mixed‑methods research methodology combining primary stakeholder interviews, technical literature review, supply chain mapping, and empirical validation to ensure reproducible insights
The research methodology integrates multiple evidence streams to ensure robust, triangulated findings that inform technical and commercial decisions. Primary research included structured interviews with systems engineers, procurement leads, and manufacturing managers across automotive, industrial, telecom, healthcare, and consumer sectors to validate technology priorities, qualification hurdles, and sourcing preferences. Secondary research covered technical literature, standards documents, patent filings, and public product specifications to map technology trajectories and packaging innovations, while supply chain analysis examined BOM exposures, lead‑time sensitivities, and regional manufacturing footprints.
Findings were validated through cross‑checks against independent expert reviews and reverse‑engineered product teardowns to confirm component choices and thermal strategies. Where possible, technology performance claims were compared against empirical datasheet parameters and application notes to ensure consistency. The methodology emphasizes reproducibility and transparency: assumptions are documented, source types are cataloged, and conclusions are presented with the confidence context necessary for executive decision making.
A concise conclusion that synthesizes technology trends, supply chain risks, and strategic imperatives necessary for sustained competitive advantage in DC‑DC converters
In conclusion, the DC‑DC converter landscape presents a compelling mix of technical opportunity and strategic complexity that demands deliberate choices from product teams, procurement, and corporate leaders. Advances in wide‑bandgap semiconductors and digital control unlock higher power densities and adaptive management capabilities, but they also require focused investments in thermal design, EMI mitigation, and long‑term reliability validation. Simultaneously, segmentation across topology, architecture, end use, power and voltage bands, mounting, and switching frequency creates differentiated pathways to value that must be matched to customer priorities and regulatory constraints.
Organizations that proactively incorporate tariff and regional risk considerations into their sourcing and qualification strategies will reduce downstream disruption and maintain competitive delivery timelines. By combining selective technology adoption, modular platform thinking, and diversified supplier networks, companies can accelerate innovation while preserving margin and ensuring product readiness for demanding applications. Ultimately, success depends on aligning engineering excellence with pragmatic commercial planning to convert technical advantage into sustained market relevance.
Note: PDF & Excel + Online Access - 1 Year
Table of Contents
183 Pages
- 1. Preface
- 1.1. Objectives of the Study
- 1.2. Market Segmentation & Coverage
- 1.3. Years Considered for the Study
- 1.4. Currency
- 1.5. Language
- 1.6. Stakeholders
- 2. Research Methodology
- 3. Executive Summary
- 4. Market Overview
- 5. Market Insights
- 5.1. Adoption of gallium nitride (GaN) power semiconductors to enhance converter efficiency and power density
- 5.2. Integration of intelligent digital control algorithms for rapid transient response in automotive applications
- 5.3. Growing demand for bidirectional DC–DC converters supporting energy recuperation in electric vehicles and microgrids
- 5.4. Emphasis on ultra-wide bandgap silicon carbide converters for high-temperature and high-frequency industrial applications
- 5.5. Development of isolated DC–DC modules with reinforced safety features for medical and aerospace certifications
- 5.6. Trend towards compact magnetics and planar inductor designs to reduce board footprint and EMI emissions
- 5.7. Deployment of automotive-grade DC–DC converters compliant with ISO 26262 functional safety requirements
- 5.8. Shift towards modular multi-output converter architectures for flexible power distribution in data centers
- 5.9. Increasing integration of power management ICs with on-chip MOSFETs to minimize external component count
- 5.10. Advancements in soft-switching techniques like zero-voltage and zero-current switching to lower switching losses
- 6. Cumulative Impact of United States Tariffs 2025
- 7. Cumulative Impact of Artificial Intelligence 2025
- 8. DC-DC Converter Market, by Topology
- 8.1. Boost
- 8.2. Buck
- 8.3. Buck-Boost
- 8.4. Cuk
- 8.5. Sepic
- 9. DC-DC Converter Market, by Architecture
- 9.1. Isolated
- 9.2. Non Isolated
- 10. DC-DC Converter Market, by End Use
- 10.1. Automotive
- 10.2. Consumer Electronics
- 10.3. Healthcare
- 10.4. Industrial
- 10.5. Telecommunication
- 11. DC-DC Converter Market, by Output Power Range
- 11.1. 10-150 W
- 11.2. Greater Than 150 W
- 11.3. Less Than 10 W
- 12. DC-DC Converter Market, by Input Voltage Range
- 12.1. 12-48 V
- 12.2. Greater Than 48 V
- 12.3. Less Than 12 V
- 13. DC-DC Converter Market, by Mounting Type
- 13.1. Chassis Mount
- 13.2. Surface Mount
- 13.3. Through Hole
- 14. DC-DC Converter Market, by Switching Frequency
- 14.1. 500 kHz to 1 MHz
- 14.2. Greater Than 1 MHz
- 14.3. Less Than 500 kHz
- 15. DC-DC Converter Market, by Region
- 15.1. Americas
- 15.1.1. North America
- 15.1.2. Latin America
- 15.2. Europe, Middle East & Africa
- 15.2.1. Europe
- 15.2.2. Middle East
- 15.2.3. Africa
- 15.3. Asia-Pacific
- 16. DC-DC Converter Market, by Group
- 16.1. ASEAN
- 16.2. GCC
- 16.3. European Union
- 16.4. BRICS
- 16.5. G7
- 16.6. NATO
- 17. DC-DC Converter Market, by Country
- 17.1. United States
- 17.2. Canada
- 17.3. Mexico
- 17.4. Brazil
- 17.5. United Kingdom
- 17.6. Germany
- 17.7. France
- 17.8. Russia
- 17.9. Italy
- 17.10. Spain
- 17.11. China
- 17.12. India
- 17.13. Japan
- 17.14. Australia
- 17.15. South Korea
- 18. Competitive Landscape
- 18.1. Market Share Analysis, 2024
- 18.2. FPNV Positioning Matrix, 2024
- 18.3. Competitive Analysis
- 18.3.1. ABB Ltd.
- 18.3.2. Analog Devices, Inc.
- 18.3.3. Artesyn Embedded Power Inc.
- 18.3.4. Bel Fuse Inc.
- 18.3.5. BorgWarner Inc.
- 18.3.6. Cincon Electronics Co., Ltd.
- 18.3.7. Crane Holdings, Co.
- 18.3.8. CUI Inc.
- 18.3.9. Delta Electronics, Inc.
- 18.3.10. Diodes Incorporated
- 18.3.11. Eaton Corporation plc
- 18.3.12. Efficient Power Conversion Corporation
- 18.3.13. Infineon Technologies AG
- 18.3.14. Murata Manufacturing Co., Ltd.
- 18.3.15. NXP Semiconductors N.V.
- 18.3.16. RECOM Power GmbH
- 18.3.17. Renesas Electronics Corporation
- 18.3.18. STMicroelectronics N.V.
- 18.3.19. TDK Corporation (TDK-Lambda)
- 18.3.20. Texas Instruments Incorporated
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