Chip Resistors Market by Product Type (Thick Film, Thin Film), Type (Surface Mount, Through Hole), Resistance, Voltage Range, Application - Global Forecast 2025-2032
Description
The Chip Resistors Market was valued at USD 1.17 billion in 2024 and is projected to grow to USD 1.23 billion in 2025, with a CAGR of 5.94%, reaching USD 1.85 billion by 2032.
A concise and authoritative orientation to the chip resistor ecosystem clarifying technology types, application drivers, and strategic supply chain considerations
The chip resistor sector underpins virtually every modern electronic system, delivering the fundamental function of precise resistance in compact, reliable packages. Recent advances in materials, process control, and packaging have sharpened the distinction between thick film and thin film technologies, while surface-mount device architectures continue to dominate board-level assembly for high-volume consumer and industrial products. At the same time, discrete through-hole components retain relevance in select uses where mechanical robustness and repairability are paramount.
This introduction frames the discussion by highlighting core technology characteristics, the interplay between application demands and design choices, and the principal supply chain variables that define supplier and buyer strategies. It emphasizes how engineering constraints, cost pressures, and regulatory drivers converge to shape component selection across automotive electronics, telecommunications, consumer devices, and manufacturing systems. By establishing a concise baseline of terminology and functional roles, this section sets up the deeper analysis that follows and equips technical leaders and commercial strategists with a clear orientation to the factors that matter most in procurement and product development.
How technological advancement, supply chain reconfiguration, and regulatory emphasis are reshaping component selection and supplier strategies across global electronics industries
The chip resistor landscape has undergone transformative shifts driven by evolving application requirements, material science breakthroughs, and the reconfiguration of global supply chains. Higher power-density electronics and increasing emphasis on miniaturization have accelerated adoption of thin film offerings in precision applications, while innovations in metallization and passivation methods have improved stability and reliability across environments. Concurrently, assembly trends favor surface-mount packages to enable automated, high-throughput production, but demand for through-hole parts endures in segments requiring enhanced mechanical anchoring.
Supply chain restructuring and diversification strategies have become central to commercial planning as buyers seek multiple qualified sources and closer regional supply ties. Digitization in component traceability and quality assurance has increased transparency and reduced lead-time uncertainties, enabling faster failure analysis and supplier performance benchmarking. Regulatory and sustainability pressures are also reshaping manufacturing practices, prompting greater scrutiny of materials selection, end-of-life considerations, and supplier environmental compliance. Taken together, these shifts require cross-functional coordination between engineering, procurement, and regulatory teams to translate capability advantages into commercially viable products.
Assessing the cumulative and multifaceted consequences of tariff measures on procurement strategies, supply chain resilience, and component sourcing dynamics in 2025
Tariff actions introduced in recent policy cycles have produced a cumulative set of impacts that ripple through sourcing, pricing dynamics, and strategic supplier decisions for chip resistor stakeholders. Increased duties on imported passive components have elevated landed costs for specific supply routes, prompting many buyers to reassess their procurement maps and evaluate onshore or nearshore alternatives where feasible. This shift toward supply diversification has in turn influenced minimum order quantities, lead-time buffers, and inventory policies as organizations balance cost exposure with the imperative to maintain uninterrupted production.
The tariff environment has also accelerated supplier negotiations around cost-sharing, duty optimization, and contractual terms to preserve margins and predictability. Manufacturers with vertically integrated capabilities or regional capacity have found opportunities to deepen customer relationships, while independent distributors have adapted by offering value-added services around customs optimization and bonded inventory solutions. At the product level, teams have reexamined bill-of-materials structures and component specifications to identify candidates for local sourcing or alternative technologies that deliver comparable performance with more favorable trade treatment. In parallel, compliance burdens have increased: documentation, classification accuracy, and audit readiness now require closer collaboration between procurement, legal, and logistics functions. Overall, the cumulative tariff effects have catalyzed strategic realignment rather than a single, uniform response, and successful firms are those that combine operational agility with rigorous cost-to-serve analysis.
Clear and actionable segmentation analysis revealing how product, package type, and application priorities determine technical requirements, sourcing strategies, and supplier qualifications
Segmentation insights reveal how technical choices and end-use demands create distinct value pools across the chip resistor domain. Based on product type, thick film devices continue to offer cost-effective general-purpose performance for high-volume consumer and industrial assemblies, whereas thin film variants provide superior precision, stability, and temperature coefficient control for instrumentation, telecommunications, and advanced automotive electronics. These material and process differences inform design trade-offs between long-term reliability and short-term unit cost.
Based on type, surface mount configurations dominate board-level integration due to compatibility with automated pick-and-place assembly, lower parasitics, and smaller footprints that suit miniaturized devices. Conversely, through-hole components preserve relevance in heavy-duty applications, power electronics, and contexts where mechanical stress or repeated servicing is expected. Based on application, demand patterns vary significantly: Automotive & Transportation imposes stringent reliability, qualification, and traceability requirements; Consumer Electronics prioritizes unit cost, form factor, and supply velocity; IT & Telecommunication emphasizes precision, thermal performance, and signal integrity; and Manufacturing applications often require ruggedness and broad environmental tolerance. Understanding these segmentation-driven performance and procurement nuances is essential for product managers, sourcing leaders, and design engineers when defining supplier qualifications and component roadmaps.
Distinct regional dynamics and operational priorities across the Americas, Europe Middle East & Africa, and Asia-Pacific that shape sourcing, qualification, and supplier engagement strategies
Regional dynamics shape the operational and strategic choices of chip resistor suppliers and buyers in distinct ways. In the Americas, procurement decisions increasingly reflect a preference for supply chain transparency, localized inventory models, and stronger collaboration between engineering and purchasing to mitigate cross-border disruption. Regional manufacturers and distribution partners are often evaluated for their ability to support rapid qualification cycles and aftermarket support for industrial and automotive customers.
Across Europe, Middle East & Africa, regulatory compliance, environmental standards, and long-term component qualification protocols are primary considerations. Suppliers serving these regions are expected to provide detailed material declarations, lifecycle data, and evidence of conformity to stringent automotive and industrial quality regimes. In the Asia-Pacific region, dense manufacturing ecosystems continue to drive volume production and rapid iteration, with a concentration of capacity across both thick film and thin film processes. Asia-Pacific also hosts many of the world’s assembly centers, which makes coordination of lead times, quality audits, and capacity planning critical for global OEMs. Each region presents a unique risk-reward profile and requires tailored engagement models that align commercial terms, qualification timelines, and logistics capabilities with end-customer needs.
How suppliers differentiate through process control, value-added services, and strategic partnerships to secure design wins and long-term commercial relationships
Competitive positioning in the chip resistor arena increasingly hinges on a blend of technological differentiation, supply reliability, and customer-centric services. Leading suppliers invest in process control, materials science, and automated inspection to raise first-pass yields and reduce in-field failures. They also extend services beyond component delivery, offering engineering support for qualification testing, failure analysis, and lifecycle documentation to accelerate time-to-production for major customers.
Strategic partnerships and alliances, including long-term supply agreements and co-development programs, have become common as OEMs seek predictable access to key component types and custom variants. Downstream distributors and value-added resellers play a key role in smoothing logistics complexity, bundling testing services, and enabling smaller customers to access certified supplies. At the same time, small and medium-sized manufacturers compete by focusing on niche capabilities, rapid sample-to-production cycles, and flexible minimum order quantities. Across tiers, a clear emphasis on demonstrable quality systems, ISO and automotive qualifications, and transparent traceability practices differentiates successful suppliers from those that struggle to scale in regulated and safety-critical segments.
Practical and prioritized actions for manufacturers and buyers to enhance supply resilience, optimize costs, and accelerate qualification of alternative sources
Industry leaders should adopt a multi-dimensional strategy that balances short-term operational resilience with long-term technology and customer alignment. First, prioritize supplier diversification that preserves performance specifications while reducing single-source exposure; identify alternate manufacturers across different regions and qualify them early to avoid costly disruptions. Complement diversification with advanced inventory strategies, including risk-based safety stock and regional buffer hubs, to shorten recovery time for critical production lines.
Second, strengthen cross-functional collaboration by embedding procurement specialists within engineering qualification cycles and by standardizing documentation and test protocols to accelerate approvals. Third, pursue value capture through joint cost-reduction initiatives with suppliers, focusing on process yield improvements, packaging optimization, and logistics consolidation. Fourth, build a tariff and trade compliance playbook that integrates tariff classification reviews, origin documentation, and commercial terms that allocate duty risk transparently. Finally, invest in supplier performance analytics and predictive maintenance for production assets to improve uptime and quality consistency; these capabilities support better negotiation outcomes and reduce total cost of ownership for high-reliability applications.
A robust mixed-method research approach combining stakeholder interviews, technical validation, and triangulated secondary sources to ensure practical and verifiable insights
The research approach employed a combination of primary engagement with industry stakeholders and rigorous secondary validation to ensure findings reflect operational realities and current industry practices. Primary methods included structured interviews with design engineers, procurement leaders, quality managers, and logistics professionals from OEMs, contract manufacturers, and component suppliers. These conversations focused on qualification criteria, supplier selection processes, inventory strategies, and responses to trade policy changes to capture first-hand perspectives and tactical practices.
Secondary validation entailed analysis of publicly available technical literature, regulatory documentation, and manufacturing process descriptions to corroborate claims about technology performance and qualification standards. Data triangulation was applied by cross-referencing supplier technical datasheets, reliability test protocols, and procurement policy statements to ensure consistency. The methodology also incorporated case-based reviews of supplier transitions and tariff mitigation initiatives to draw practical lessons. Where applicable, laboratory test methods and failure-mode analyses were reviewed to align technical implications with commercial decision points, ensuring that recommendations are grounded in verifiable engineering evidence.
Consolidated conclusions emphasizing strategic integration of procurement, engineering, and compliance to protect product performance and supply continuity
In summary, the chip resistor sector is characterized by nuanced trade-offs among technology choice, assembly architecture, and application-specific requirements, all set against a backdrop of evolving trade policies and regional manufacturing dynamics. The cumulative effect of tariff measures, supply chain restructuring, and accelerated technical requirements has prompted organizations to re-evaluate procurement strategies, deepen supplier partnerships, and invest in qualification agility. These shifts underscore the need for close integration between engineering, procurement, and compliance functions to manage cost, risk, and performance simultaneously.
Looking ahead, companies that combine disciplined supplier diversification, rigorous technical qualification procedures, and proactive tariff mitigation tactics will be best positioned to control total cost of ownership and deliver reliable products to end customers. Equally important is the emphasis on traceability and demonstrable quality systems that underpin acceptance in automotive and industrial segments. By translating the insights and recommendations in this report into cross-functional actions, organizations can reduce vulnerability to external shocks while preserving the technical performance demanded by next-generation electronic systems.
Note: PDF & Excel + Online Access - 1 Year
A concise and authoritative orientation to the chip resistor ecosystem clarifying technology types, application drivers, and strategic supply chain considerations
The chip resistor sector underpins virtually every modern electronic system, delivering the fundamental function of precise resistance in compact, reliable packages. Recent advances in materials, process control, and packaging have sharpened the distinction between thick film and thin film technologies, while surface-mount device architectures continue to dominate board-level assembly for high-volume consumer and industrial products. At the same time, discrete through-hole components retain relevance in select uses where mechanical robustness and repairability are paramount.
This introduction frames the discussion by highlighting core technology characteristics, the interplay between application demands and design choices, and the principal supply chain variables that define supplier and buyer strategies. It emphasizes how engineering constraints, cost pressures, and regulatory drivers converge to shape component selection across automotive electronics, telecommunications, consumer devices, and manufacturing systems. By establishing a concise baseline of terminology and functional roles, this section sets up the deeper analysis that follows and equips technical leaders and commercial strategists with a clear orientation to the factors that matter most in procurement and product development.
How technological advancement, supply chain reconfiguration, and regulatory emphasis are reshaping component selection and supplier strategies across global electronics industries
The chip resistor landscape has undergone transformative shifts driven by evolving application requirements, material science breakthroughs, and the reconfiguration of global supply chains. Higher power-density electronics and increasing emphasis on miniaturization have accelerated adoption of thin film offerings in precision applications, while innovations in metallization and passivation methods have improved stability and reliability across environments. Concurrently, assembly trends favor surface-mount packages to enable automated, high-throughput production, but demand for through-hole parts endures in segments requiring enhanced mechanical anchoring.
Supply chain restructuring and diversification strategies have become central to commercial planning as buyers seek multiple qualified sources and closer regional supply ties. Digitization in component traceability and quality assurance has increased transparency and reduced lead-time uncertainties, enabling faster failure analysis and supplier performance benchmarking. Regulatory and sustainability pressures are also reshaping manufacturing practices, prompting greater scrutiny of materials selection, end-of-life considerations, and supplier environmental compliance. Taken together, these shifts require cross-functional coordination between engineering, procurement, and regulatory teams to translate capability advantages into commercially viable products.
Assessing the cumulative and multifaceted consequences of tariff measures on procurement strategies, supply chain resilience, and component sourcing dynamics in 2025
Tariff actions introduced in recent policy cycles have produced a cumulative set of impacts that ripple through sourcing, pricing dynamics, and strategic supplier decisions for chip resistor stakeholders. Increased duties on imported passive components have elevated landed costs for specific supply routes, prompting many buyers to reassess their procurement maps and evaluate onshore or nearshore alternatives where feasible. This shift toward supply diversification has in turn influenced minimum order quantities, lead-time buffers, and inventory policies as organizations balance cost exposure with the imperative to maintain uninterrupted production.
The tariff environment has also accelerated supplier negotiations around cost-sharing, duty optimization, and contractual terms to preserve margins and predictability. Manufacturers with vertically integrated capabilities or regional capacity have found opportunities to deepen customer relationships, while independent distributors have adapted by offering value-added services around customs optimization and bonded inventory solutions. At the product level, teams have reexamined bill-of-materials structures and component specifications to identify candidates for local sourcing or alternative technologies that deliver comparable performance with more favorable trade treatment. In parallel, compliance burdens have increased: documentation, classification accuracy, and audit readiness now require closer collaboration between procurement, legal, and logistics functions. Overall, the cumulative tariff effects have catalyzed strategic realignment rather than a single, uniform response, and successful firms are those that combine operational agility with rigorous cost-to-serve analysis.
Clear and actionable segmentation analysis revealing how product, package type, and application priorities determine technical requirements, sourcing strategies, and supplier qualifications
Segmentation insights reveal how technical choices and end-use demands create distinct value pools across the chip resistor domain. Based on product type, thick film devices continue to offer cost-effective general-purpose performance for high-volume consumer and industrial assemblies, whereas thin film variants provide superior precision, stability, and temperature coefficient control for instrumentation, telecommunications, and advanced automotive electronics. These material and process differences inform design trade-offs between long-term reliability and short-term unit cost.
Based on type, surface mount configurations dominate board-level integration due to compatibility with automated pick-and-place assembly, lower parasitics, and smaller footprints that suit miniaturized devices. Conversely, through-hole components preserve relevance in heavy-duty applications, power electronics, and contexts where mechanical stress or repeated servicing is expected. Based on application, demand patterns vary significantly: Automotive & Transportation imposes stringent reliability, qualification, and traceability requirements; Consumer Electronics prioritizes unit cost, form factor, and supply velocity; IT & Telecommunication emphasizes precision, thermal performance, and signal integrity; and Manufacturing applications often require ruggedness and broad environmental tolerance. Understanding these segmentation-driven performance and procurement nuances is essential for product managers, sourcing leaders, and design engineers when defining supplier qualifications and component roadmaps.
Distinct regional dynamics and operational priorities across the Americas, Europe Middle East & Africa, and Asia-Pacific that shape sourcing, qualification, and supplier engagement strategies
Regional dynamics shape the operational and strategic choices of chip resistor suppliers and buyers in distinct ways. In the Americas, procurement decisions increasingly reflect a preference for supply chain transparency, localized inventory models, and stronger collaboration between engineering and purchasing to mitigate cross-border disruption. Regional manufacturers and distribution partners are often evaluated for their ability to support rapid qualification cycles and aftermarket support for industrial and automotive customers.
Across Europe, Middle East & Africa, regulatory compliance, environmental standards, and long-term component qualification protocols are primary considerations. Suppliers serving these regions are expected to provide detailed material declarations, lifecycle data, and evidence of conformity to stringent automotive and industrial quality regimes. In the Asia-Pacific region, dense manufacturing ecosystems continue to drive volume production and rapid iteration, with a concentration of capacity across both thick film and thin film processes. Asia-Pacific also hosts many of the world’s assembly centers, which makes coordination of lead times, quality audits, and capacity planning critical for global OEMs. Each region presents a unique risk-reward profile and requires tailored engagement models that align commercial terms, qualification timelines, and logistics capabilities with end-customer needs.
How suppliers differentiate through process control, value-added services, and strategic partnerships to secure design wins and long-term commercial relationships
Competitive positioning in the chip resistor arena increasingly hinges on a blend of technological differentiation, supply reliability, and customer-centric services. Leading suppliers invest in process control, materials science, and automated inspection to raise first-pass yields and reduce in-field failures. They also extend services beyond component delivery, offering engineering support for qualification testing, failure analysis, and lifecycle documentation to accelerate time-to-production for major customers.
Strategic partnerships and alliances, including long-term supply agreements and co-development programs, have become common as OEMs seek predictable access to key component types and custom variants. Downstream distributors and value-added resellers play a key role in smoothing logistics complexity, bundling testing services, and enabling smaller customers to access certified supplies. At the same time, small and medium-sized manufacturers compete by focusing on niche capabilities, rapid sample-to-production cycles, and flexible minimum order quantities. Across tiers, a clear emphasis on demonstrable quality systems, ISO and automotive qualifications, and transparent traceability practices differentiates successful suppliers from those that struggle to scale in regulated and safety-critical segments.
Practical and prioritized actions for manufacturers and buyers to enhance supply resilience, optimize costs, and accelerate qualification of alternative sources
Industry leaders should adopt a multi-dimensional strategy that balances short-term operational resilience with long-term technology and customer alignment. First, prioritize supplier diversification that preserves performance specifications while reducing single-source exposure; identify alternate manufacturers across different regions and qualify them early to avoid costly disruptions. Complement diversification with advanced inventory strategies, including risk-based safety stock and regional buffer hubs, to shorten recovery time for critical production lines.
Second, strengthen cross-functional collaboration by embedding procurement specialists within engineering qualification cycles and by standardizing documentation and test protocols to accelerate approvals. Third, pursue value capture through joint cost-reduction initiatives with suppliers, focusing on process yield improvements, packaging optimization, and logistics consolidation. Fourth, build a tariff and trade compliance playbook that integrates tariff classification reviews, origin documentation, and commercial terms that allocate duty risk transparently. Finally, invest in supplier performance analytics and predictive maintenance for production assets to improve uptime and quality consistency; these capabilities support better negotiation outcomes and reduce total cost of ownership for high-reliability applications.
A robust mixed-method research approach combining stakeholder interviews, technical validation, and triangulated secondary sources to ensure practical and verifiable insights
The research approach employed a combination of primary engagement with industry stakeholders and rigorous secondary validation to ensure findings reflect operational realities and current industry practices. Primary methods included structured interviews with design engineers, procurement leaders, quality managers, and logistics professionals from OEMs, contract manufacturers, and component suppliers. These conversations focused on qualification criteria, supplier selection processes, inventory strategies, and responses to trade policy changes to capture first-hand perspectives and tactical practices.
Secondary validation entailed analysis of publicly available technical literature, regulatory documentation, and manufacturing process descriptions to corroborate claims about technology performance and qualification standards. Data triangulation was applied by cross-referencing supplier technical datasheets, reliability test protocols, and procurement policy statements to ensure consistency. The methodology also incorporated case-based reviews of supplier transitions and tariff mitigation initiatives to draw practical lessons. Where applicable, laboratory test methods and failure-mode analyses were reviewed to align technical implications with commercial decision points, ensuring that recommendations are grounded in verifiable engineering evidence.
Consolidated conclusions emphasizing strategic integration of procurement, engineering, and compliance to protect product performance and supply continuity
In summary, the chip resistor sector is characterized by nuanced trade-offs among technology choice, assembly architecture, and application-specific requirements, all set against a backdrop of evolving trade policies and regional manufacturing dynamics. The cumulative effect of tariff measures, supply chain restructuring, and accelerated technical requirements has prompted organizations to re-evaluate procurement strategies, deepen supplier partnerships, and invest in qualification agility. These shifts underscore the need for close integration between engineering, procurement, and compliance functions to manage cost, risk, and performance simultaneously.
Looking ahead, companies that combine disciplined supplier diversification, rigorous technical qualification procedures, and proactive tariff mitigation tactics will be best positioned to control total cost of ownership and deliver reliable products to end customers. Equally important is the emphasis on traceability and demonstrable quality systems that underpin acceptance in automotive and industrial segments. By translating the insights and recommendations in this report into cross-functional actions, organizations can reduce vulnerability to external shocks while preserving the technical performance demanded by next-generation electronic systems.
Note: PDF & Excel + Online Access - 1 Year
Table of Contents
195 Pages
- 1. Preface
- 1.1. Objectives of the Study
- 1.2. Market Segmentation & Coverage
- 1.3. Years Considered for the Study
- 1.4. Currency
- 1.5. Language
- 1.6. Stakeholders
- 2. Research Methodology
- 3. Executive Summary
- 4. Market Overview
- 5. Market Insights
- 5.1. Rising demand for ultra low ohmic chip resistors in automotive advanced driver assistance systems
- 5.2. Integration of high precision thin film chip resistors to support 5G infrastructure and satellite communications
- 5.3. Shift towards lead-free terminations in chip resistor manufacturing to meet stringent environmental regulations
- 5.4. Growing adoption of high wattage chip resistors in electric vehicle battery management and charging systems
- 5.5. Development of nanoscale resistor networks for ultra-compact wearable medical diagnostic devices and sensors
- 5.6. Expansion of embedded resistor technologies in multilayer PCBs to drive miniaturization in consumer electronics
- 5.7. Adoption of automated optical inspection and AI-driven quality control in chip resistor production for higher yields
- 6. Cumulative Impact of United States Tariffs 2025
- 7. Cumulative Impact of Artificial Intelligence 2025
- 8. Chip Resistors Market, by Product Type
- 8.1. Thick Film
- 8.2. Thin Film
- 9. Chip Resistors Market, by Type
- 9.1. Surface Mount
- 9.2. Through Hole
- 10. Chip Resistors Market, by Resistance
- 10.1. Less than 10 Ohm
- 10.2. 10-50 Ohm
- 10.3. More than 50 Ohm
- 11. Chip Resistors Market, by Voltage Range
- 11.1. <50 V
- 11.2. 50–200 V
- 11.3. 200–1000 V
- 11.4. >1000 V
- 12. Chip Resistors Market, by Application
- 12.1. Automotive & Transportation
- 12.2. Consumer Electronics
- 12.3. IT & Telecommunication
- 12.4. Manufacturing
- 13. Chip Resistors Market, by Region
- 13.1. Americas
- 13.1.1. North America
- 13.1.2. Latin America
- 13.2. Europe, Middle East & Africa
- 13.2.1. Europe
- 13.2.2. Middle East
- 13.2.3. Africa
- 13.3. Asia-Pacific
- 14. Chip Resistors Market, by Group
- 14.1. ASEAN
- 14.2. GCC
- 14.3. European Union
- 14.4. BRICS
- 14.5. G7
- 14.6. NATO
- 15. Chip Resistors Market, by Country
- 15.1. United States
- 15.2. Canada
- 15.3. Mexico
- 15.4. Brazil
- 15.5. United Kingdom
- 15.6. Germany
- 15.7. France
- 15.8. Russia
- 15.9. Italy
- 15.10. Spain
- 15.11. China
- 15.12. India
- 15.13. Japan
- 15.14. Australia
- 15.15. South Korea
- 16. Competitive Landscape
- 16.1. Market Share Analysis, 2024
- 16.2. FPNV Positioning Matrix, 2024
- 16.3. Competitive Analysis
- 16.3.1. Bourns Inc.
- 16.3.2. Caddock Electronics, Inc
- 16.3.3. CryoCircuits, LLC
- 16.3.4. Cyntec Co., Ltd.
- 16.3.5. Durakool
- 16.3.6. International Manufacturing Services Inc
- 16.3.7. Koa Corporation
- 16.3.8. MEGATRON Elektronik GmbH & Co. KG
- 16.3.9. Murata Manufacturing Co. Ltd.
- 16.3.10. NIC Components Corp.
- 16.3.11. Ohmite Mfg Co
- 16.3.12. Panasonic Corporation
- 16.3.13. Ralec Electronic Corp.
- 16.3.14. ROHM CO., LTD.
- 16.3.15. Royal Electronic Factory Co., Ltd.
- 16.3.16. Samsung Electro-Mechanics Co., Ltd.
- 16.3.17. State of the Art, Inc.
- 16.3.18. Susumu International U.S.A.
- 16.3.19. Ta-i Technology Co. Ltd.
- 16.3.20. TE Connectivity Ltd.
- 16.3.21. TT Electronics Plc
- 16.3.22. Viking Tech Corporation
- 16.3.23. Vishay Intertechnology, Inc.
- 16.3.24. Walsin Technology Corporation
- 16.3.25. Yageo Corporation
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