Atomic Layer Deposition Equipment Market by Equipment Type (Batch ALD Equipment, Modular ALD Equipment, Single-Wafer ALD Equipment), Technology Type (Plasma-Enhanced ALD, Thermal ALD), Application, End-User Industry - Global Forecast 2025-2032
Description
The Atomic Layer Deposition Equipment Market was valued at USD 2.66 billion in 2024 and is projected to grow to USD 3.15 billion in 2025, with a CAGR of 19.79%, reaching USD 11.31 billion by 2032.
A concise and authoritative orientation to atomic layer deposition equipment, clarifying its expanding role across semiconductor, energy, and advanced coating value chains
Atomic layer deposition equipment stands at the intersection of material science precision and manufacturing scalability, enabling sub-nanometer control over thin films that underpin modern semiconductor nodes, energy devices, sensors, and advanced coatings. This introduction frames the technology’s role as an enabling platform that extends beyond traditional wafer fabs to emerging domains such as battery electrode engineering, diagnostics, and protective barrier applications. The discussion emphasizes process flexibility, material portfolio expansion, and the shifting balance between throughput and film uniformity as central themes that influence capital allocation and engineering road maps.
In recent years, the ALD landscape has matured from a niche research tool to an industrial asset, driven by advances in precursor chemistries, reactor architectures, and process integration strategies. The narrative that follows positions ALD equipment not merely as capital expenditure but as a strategic lever for product differentiation, yield improvement, and lifecycle performance. As customers increasingly demand modularity, tighter process control, and lower total cost of ownership, equipment providers and end users must align on interoperability, serviceability, and data-driven process optimization to seize near-term opportunities and manage long-term technological transitions.
How technological innovation, modular system design, and sustainability priorities are collectively reshaping procurement priorities and operational models across the ALD ecosystem
The landscape for atomic layer deposition equipment is undergoing transformative shifts driven by converging technological, operational, and strategic forces. Process innovation such as plasma-enhanced approaches and novel precursor chemistries has broadened the materials palette and shortened cycle times, enabling applications that demand both high conformity and selective deposition. At the same time, advances in reactor design-including single-wafer architectures and modular platforms-have redefined trade-offs between throughput, footprint, and process reproducibility. These shifts are altering procurement criteria, prompting stakeholders to value flexibility and uptime as highly as raw deposition performance.
Operational paradigms are changing as well. Digitalization and in-situ analytics are being incorporated into process control loops, enabling predictive maintenance and tighter film property consistency. Industry players are responding to heterogeneous demand by offering configurable systems that can be retrofitted or upgraded as processes evolve. Finally, sustainability considerations-such as reduced precursor waste, lower energy consumption, and recycling of process byproducts-are influencing both equipment design and purchasing decisions, accelerating adoption among customers with aggressive environmental and lifecycle targets.
An assessment of how successive tariff measures and trade policy shifts have reshaped procurement, localization, and capital allocation behavior in ALD equipment supply chains
The cumulative regulatory and trade landscape through 2025 has placed tariffs and related trade measures at the forefront of capital planning and supply chain strategy for equipment manufacturers and end users. Tariff-driven cost pressures have increased the effective landed cost of imported capital goods, which in turn affects depreciation calculations, payback expectations, and timing for equipment refresh cycles. Beyond direct cost impacts, tariffs have created incentives to reassess supplier portfolios, prioritize localized manufacturing or final assembly, and cultivate regional service networks to mitigate exposure to cross-border friction.
These dynamics also influence the cadence of innovation adoption. When import-related uncertainties rise, buyers often delay nonessential upgrades and favor flexible, upgradeable platforms that stretch existing investments. Conversely, strategic programs that are tightly coupled to national technology priorities-such as domestic semiconductor initiatives or energy storage resilience projects-may receive expedited support and localized procurement preferences. In response, manufacturers are adapting by diversifying supplier bases, offering enhanced after-sales support, and exploring joint ventures or local partnerships to align with shifting policy and procurement landscapes.
Distinct segmentation pathways that clarify equipment trade-offs and application-specific requirements across technology choices, applications, and end-user industries
Segmentation analysis reveals distinct commercial and technical pathways that both suppliers and end users must navigate. Based on equipment type, there are clear operational trade-offs between batch ALD equipment, which offers economies of scale for compatible substrates; modular ALD equipment, which emphasizes flexibility and phased capacity expansion; and single-wafer ALD equipment, which targets highest uniformity and tight process control for advanced node semiconductor and critical sensor applications. These equipment choices translate directly into factory layouts, maintenance models, and integration costs that procurement teams must evaluate in light of process road maps.
Based on technology type, process differentiation between plasma-enhanced ALD and thermal ALD defines key material and performance boundaries: plasma-enhanced approaches often enable lower-temperature processes and enhanced reactivity for certain materials, whereas thermal ALD remains a robust choice where precursor stability and simplicity are paramount. Based on application, the technology’s reach spans battery applications, diagnostics equipment, energy cells, protective coatings, semiconductor manufacturing, sensor coatings, and thin film and display markets, each with unique film specifications, contamination tolerances, and throughput expectations. Based on end-user industry, adoption patterns differ significantly across aerospace, automotive, electronics and semiconductor, energy and power, and textile sectors, where regulatory regimes, production scales, and lifecycle expectations drive distinct purchasing behaviors and service demands.
How differing industrial priorities and supply chain structures across the Americas, Europe Middle East & Africa, and Asia-Pacific are influencing equipment adoption and service models
Regional dynamics play a pivotal role in shaping investment, adoption, and supplier strategies across the ALD landscape. In the Americas, demand is often driven by high-value semiconductor fabs, energy storage innovation clusters, and advanced research institutions that prize rapid iteration and strong local service ecosystems. Investment tends to prioritize advanced single-wafer systems and turnkey solutions that integrate readily with existing fab automation and quality management systems, and local suppliers and service partners are frequently engaged to reduce lead times.
Across Europe, the Middle East and Africa, disparate industrial priorities and regulatory environments create heterogeneous pockets of adoption. Western European manufacturing centers emphasize sustainability, materials traceability, and precision engineering, which supports both modular and single-wafer system deployment. In parts of the Middle East and Africa, targeted infrastructure investments and industrial diversification programs can stimulate demand for protective coatings and energy-focused applications. In the Asia-Pacific region, the market is shaped by a broad spectrum of activities from high-volume semiconductor fabs to consumer electronics and display manufacturing, which collectively drive large-scale adoption of both batch and single-wafer platforms and encourage rapid supplier scale-up and localization strategies.
Clarifying competitive differentiators among equipment suppliers, service models, and integrated material partnerships that determine long-term operational resilience
Competitive dynamics among equipment providers are defined by technology leadership, service networks, and the ability to deliver reproducible, scalable processes that meet demanding film specifications. Leading vendors differentiate through proprietary reactor geometries, precursor partnerships, and software-enabled process control that reduce cycle variability and accelerate process ramp. At the same time, nimble entrants and regional equipment makers compete on modularity, lower total cost of ownership, and closer proximity to end-user service teams, creating layered competition that benefits buyers seeking tailored solutions.
Strategic cooperation between equipment manufacturers and materials suppliers has become increasingly important, as co-developed precursor-reaction packages shorten integration timelines and improve process yield. After-sales service capability, parts availability, and remote diagnostics increasingly factor into purchasing decisions, especially when uptime directly affects high-value manufacturing lines. Observing these dynamics, investors and strategic buyers should weigh long-term supportability and upgrade pathways as heavily as initial equipment specifications when selecting partners for critical deployments.
Practical and implementable strategic steps that manufacturers, integrators, and procurement teams can take to lower operational risk and accelerate ALD deployment impact
Industry leaders can take concrete actions to convert market complexity into competitive advantage. First, aligning procurement strategy with modularity and upgradeability reduces stranded capital risk and allows rapid response to evolving process requirements. Rather than committing to monolithic platforms, organizations should prioritize equipment that supports incremental performance upgrades and interoperable control systems. Second, strengthening regional service and parts ecosystems through local partnerships or authorized service centers mitigates lead-time risk and increases effective equipment availability, which is critical for high-value production lines.
Third, companies should invest in digital process controls and in-situ metrology that enable predictive maintenance and tighter process windows, thereby improving yield and lowering overall cost per good unit. Fourth, materials and precursor co-development arrangements can shorten ramp cycles and reduce integration friction; decision-makers should formalize preferred supplier arrangements and collaborative development clauses in procurement contracts. Finally, risk management should explicitly account for trade policy variability by diversifying supplier bases and considering localized assembly or joint ventures in strategic regions, thereby maintaining operational continuity under shifting regulatory environments.
A rigorous mixed-methods approach blending primary stakeholder engagement, technical literature review, patent analysis, and trade data triangulation to validate findings
The research methodology underpinning this analysis combines primary and secondary approaches to ensure robust, triangulated findings. Primary research consisted of structured interviews with equipment OEMs, process engineers in semiconductor and energy sectors, materials suppliers, and service providers to capture first-hand perspectives on technology performance, adoption barriers, and service expectations. These insights were complemented by site visits and demonstrations where feasible, providing practical validation of claimed throughput, uptime metrics, and upgrade pathways.
Secondary research included a systematic review of patent filings, technical conference proceedings, peer-reviewed literature, and publicly available regulatory documents to track innovation trajectories and material developments. Trade data and customs trends were synthesized to understand cross-border flows and policy impacts. Throughout, qualitative findings were validated through cross-referencing multiple independent sources, and any thematic assertions were tested against operational realities reported by end users to minimize bias and ensure practical relevance.
A concise synthesis of why ALD equipment matters strategically and how integrated procurement and engineering choices determine long-term technology impact
Atomic layer deposition equipment is evolving from a specialist enabling technology to a broadly applied industrial tool that underpins advancements in semiconductors, energy storage, sensors, and protective coatings. The combination of material innovation, reactor design evolution, and digital process integration is creating new opportunities while also elevating expectations for serviceability, sustainability, and regional supply chain resilience. As stakeholders navigate these changes, they must balance near-term cost containment with strategic investments in flexible platforms that preserve future optionality.
Looking ahead, organizations that proactively align procurement, engineering, and service strategies will be better positioned to capture value from ALD technologies. Embracing modularity, strengthening regional support structures, and investing in collaborative material-development relationships will reduce time-to-performance and mitigate policy-related disruptions. In sum, ALD equipment is not merely an input to manufacturing; it is a strategic lever that can materially influence product capability and competitive differentiation when deployed with foresight and operational discipline.
Note: PDF & Excel + Online Access - 1 Year
A concise and authoritative orientation to atomic layer deposition equipment, clarifying its expanding role across semiconductor, energy, and advanced coating value chains
Atomic layer deposition equipment stands at the intersection of material science precision and manufacturing scalability, enabling sub-nanometer control over thin films that underpin modern semiconductor nodes, energy devices, sensors, and advanced coatings. This introduction frames the technology’s role as an enabling platform that extends beyond traditional wafer fabs to emerging domains such as battery electrode engineering, diagnostics, and protective barrier applications. The discussion emphasizes process flexibility, material portfolio expansion, and the shifting balance between throughput and film uniformity as central themes that influence capital allocation and engineering road maps.
In recent years, the ALD landscape has matured from a niche research tool to an industrial asset, driven by advances in precursor chemistries, reactor architectures, and process integration strategies. The narrative that follows positions ALD equipment not merely as capital expenditure but as a strategic lever for product differentiation, yield improvement, and lifecycle performance. As customers increasingly demand modularity, tighter process control, and lower total cost of ownership, equipment providers and end users must align on interoperability, serviceability, and data-driven process optimization to seize near-term opportunities and manage long-term technological transitions.
How technological innovation, modular system design, and sustainability priorities are collectively reshaping procurement priorities and operational models across the ALD ecosystem
The landscape for atomic layer deposition equipment is undergoing transformative shifts driven by converging technological, operational, and strategic forces. Process innovation such as plasma-enhanced approaches and novel precursor chemistries has broadened the materials palette and shortened cycle times, enabling applications that demand both high conformity and selective deposition. At the same time, advances in reactor design-including single-wafer architectures and modular platforms-have redefined trade-offs between throughput, footprint, and process reproducibility. These shifts are altering procurement criteria, prompting stakeholders to value flexibility and uptime as highly as raw deposition performance.
Operational paradigms are changing as well. Digitalization and in-situ analytics are being incorporated into process control loops, enabling predictive maintenance and tighter film property consistency. Industry players are responding to heterogeneous demand by offering configurable systems that can be retrofitted or upgraded as processes evolve. Finally, sustainability considerations-such as reduced precursor waste, lower energy consumption, and recycling of process byproducts-are influencing both equipment design and purchasing decisions, accelerating adoption among customers with aggressive environmental and lifecycle targets.
An assessment of how successive tariff measures and trade policy shifts have reshaped procurement, localization, and capital allocation behavior in ALD equipment supply chains
The cumulative regulatory and trade landscape through 2025 has placed tariffs and related trade measures at the forefront of capital planning and supply chain strategy for equipment manufacturers and end users. Tariff-driven cost pressures have increased the effective landed cost of imported capital goods, which in turn affects depreciation calculations, payback expectations, and timing for equipment refresh cycles. Beyond direct cost impacts, tariffs have created incentives to reassess supplier portfolios, prioritize localized manufacturing or final assembly, and cultivate regional service networks to mitigate exposure to cross-border friction.
These dynamics also influence the cadence of innovation adoption. When import-related uncertainties rise, buyers often delay nonessential upgrades and favor flexible, upgradeable platforms that stretch existing investments. Conversely, strategic programs that are tightly coupled to national technology priorities-such as domestic semiconductor initiatives or energy storage resilience projects-may receive expedited support and localized procurement preferences. In response, manufacturers are adapting by diversifying supplier bases, offering enhanced after-sales support, and exploring joint ventures or local partnerships to align with shifting policy and procurement landscapes.
Distinct segmentation pathways that clarify equipment trade-offs and application-specific requirements across technology choices, applications, and end-user industries
Segmentation analysis reveals distinct commercial and technical pathways that both suppliers and end users must navigate. Based on equipment type, there are clear operational trade-offs between batch ALD equipment, which offers economies of scale for compatible substrates; modular ALD equipment, which emphasizes flexibility and phased capacity expansion; and single-wafer ALD equipment, which targets highest uniformity and tight process control for advanced node semiconductor and critical sensor applications. These equipment choices translate directly into factory layouts, maintenance models, and integration costs that procurement teams must evaluate in light of process road maps.
Based on technology type, process differentiation between plasma-enhanced ALD and thermal ALD defines key material and performance boundaries: plasma-enhanced approaches often enable lower-temperature processes and enhanced reactivity for certain materials, whereas thermal ALD remains a robust choice where precursor stability and simplicity are paramount. Based on application, the technology’s reach spans battery applications, diagnostics equipment, energy cells, protective coatings, semiconductor manufacturing, sensor coatings, and thin film and display markets, each with unique film specifications, contamination tolerances, and throughput expectations. Based on end-user industry, adoption patterns differ significantly across aerospace, automotive, electronics and semiconductor, energy and power, and textile sectors, where regulatory regimes, production scales, and lifecycle expectations drive distinct purchasing behaviors and service demands.
How differing industrial priorities and supply chain structures across the Americas, Europe Middle East & Africa, and Asia-Pacific are influencing equipment adoption and service models
Regional dynamics play a pivotal role in shaping investment, adoption, and supplier strategies across the ALD landscape. In the Americas, demand is often driven by high-value semiconductor fabs, energy storage innovation clusters, and advanced research institutions that prize rapid iteration and strong local service ecosystems. Investment tends to prioritize advanced single-wafer systems and turnkey solutions that integrate readily with existing fab automation and quality management systems, and local suppliers and service partners are frequently engaged to reduce lead times.
Across Europe, the Middle East and Africa, disparate industrial priorities and regulatory environments create heterogeneous pockets of adoption. Western European manufacturing centers emphasize sustainability, materials traceability, and precision engineering, which supports both modular and single-wafer system deployment. In parts of the Middle East and Africa, targeted infrastructure investments and industrial diversification programs can stimulate demand for protective coatings and energy-focused applications. In the Asia-Pacific region, the market is shaped by a broad spectrum of activities from high-volume semiconductor fabs to consumer electronics and display manufacturing, which collectively drive large-scale adoption of both batch and single-wafer platforms and encourage rapid supplier scale-up and localization strategies.
Clarifying competitive differentiators among equipment suppliers, service models, and integrated material partnerships that determine long-term operational resilience
Competitive dynamics among equipment providers are defined by technology leadership, service networks, and the ability to deliver reproducible, scalable processes that meet demanding film specifications. Leading vendors differentiate through proprietary reactor geometries, precursor partnerships, and software-enabled process control that reduce cycle variability and accelerate process ramp. At the same time, nimble entrants and regional equipment makers compete on modularity, lower total cost of ownership, and closer proximity to end-user service teams, creating layered competition that benefits buyers seeking tailored solutions.
Strategic cooperation between equipment manufacturers and materials suppliers has become increasingly important, as co-developed precursor-reaction packages shorten integration timelines and improve process yield. After-sales service capability, parts availability, and remote diagnostics increasingly factor into purchasing decisions, especially when uptime directly affects high-value manufacturing lines. Observing these dynamics, investors and strategic buyers should weigh long-term supportability and upgrade pathways as heavily as initial equipment specifications when selecting partners for critical deployments.
Practical and implementable strategic steps that manufacturers, integrators, and procurement teams can take to lower operational risk and accelerate ALD deployment impact
Industry leaders can take concrete actions to convert market complexity into competitive advantage. First, aligning procurement strategy with modularity and upgradeability reduces stranded capital risk and allows rapid response to evolving process requirements. Rather than committing to monolithic platforms, organizations should prioritize equipment that supports incremental performance upgrades and interoperable control systems. Second, strengthening regional service and parts ecosystems through local partnerships or authorized service centers mitigates lead-time risk and increases effective equipment availability, which is critical for high-value production lines.
Third, companies should invest in digital process controls and in-situ metrology that enable predictive maintenance and tighter process windows, thereby improving yield and lowering overall cost per good unit. Fourth, materials and precursor co-development arrangements can shorten ramp cycles and reduce integration friction; decision-makers should formalize preferred supplier arrangements and collaborative development clauses in procurement contracts. Finally, risk management should explicitly account for trade policy variability by diversifying supplier bases and considering localized assembly or joint ventures in strategic regions, thereby maintaining operational continuity under shifting regulatory environments.
A rigorous mixed-methods approach blending primary stakeholder engagement, technical literature review, patent analysis, and trade data triangulation to validate findings
The research methodology underpinning this analysis combines primary and secondary approaches to ensure robust, triangulated findings. Primary research consisted of structured interviews with equipment OEMs, process engineers in semiconductor and energy sectors, materials suppliers, and service providers to capture first-hand perspectives on technology performance, adoption barriers, and service expectations. These insights were complemented by site visits and demonstrations where feasible, providing practical validation of claimed throughput, uptime metrics, and upgrade pathways.
Secondary research included a systematic review of patent filings, technical conference proceedings, peer-reviewed literature, and publicly available regulatory documents to track innovation trajectories and material developments. Trade data and customs trends were synthesized to understand cross-border flows and policy impacts. Throughout, qualitative findings were validated through cross-referencing multiple independent sources, and any thematic assertions were tested against operational realities reported by end users to minimize bias and ensure practical relevance.
A concise synthesis of why ALD equipment matters strategically and how integrated procurement and engineering choices determine long-term technology impact
Atomic layer deposition equipment is evolving from a specialist enabling technology to a broadly applied industrial tool that underpins advancements in semiconductors, energy storage, sensors, and protective coatings. The combination of material innovation, reactor design evolution, and digital process integration is creating new opportunities while also elevating expectations for serviceability, sustainability, and regional supply chain resilience. As stakeholders navigate these changes, they must balance near-term cost containment with strategic investments in flexible platforms that preserve future optionality.
Looking ahead, organizations that proactively align procurement, engineering, and service strategies will be better positioned to capture value from ALD technologies. Embracing modularity, strengthening regional support structures, and investing in collaborative material-development relationships will reduce time-to-performance and mitigate policy-related disruptions. In sum, ALD equipment is not merely an input to manufacturing; it is a strategic lever that can materially influence product capability and competitive differentiation when deployed with foresight and operational discipline.
Note: PDF & Excel + Online Access - 1 Year
Table of Contents
184 Pages
- 1. Preface
- 1.1. Objectives of the Study
- 1.2. Market Segmentation & Coverage
- 1.3. Years Considered for the Study
- 1.4. Currency
- 1.5. Language
- 1.6. Stakeholders
- 2. Research Methodology
- 3. Executive Summary
- 4. Market Overview
- 5. Market Insights
- 5.1. Rising adoption of high-throughput spatial atomic layer deposition tools for advanced semiconductor nodes exceeding 3 nm
- 5.2. Integration of AI-driven process control in plasma enhanced atomic layer deposition equipment to optimize film uniformity across 300 mm wafers
- 5.3. Development of low-temperature atomic layer deposition processes for organic semiconductor encapsulation in flexible display manufacturing
- 5.4. Implementation of roll-to-roll atomic layer deposition systems for large-area flexible electronics and wearable sensor substrates
- 5.5. Emergence of modular multi-chamber atomic layer deposition platforms enabling rapid customization of deposition flow for diverse material stacks
- 5.6. Growing use of atomic layer deposition for solid-state battery electrolyte coatings to improve energy density and cycle life
- 5.7. Increased focus on green precursor chemistries and closed-loop solvent recycling in atomic layer deposition to reduce environmental footprint
- 5.8. Adoption of ALD equipment for two dimensional material deposition targeting transistor gate dielectrics in next generation nanodevices
- 5.9. Expansion of plasma enhanced atomic layer deposition techniques for forming high-k gate dielectrics in 5G RF device manufacturing
- 5.10. Integration of advanced wafer handling robotics and glovebox interfaces in ALD tools to support moisture sensitive material processes
- 6. Cumulative Impact of United States Tariffs 2025
- 7. Cumulative Impact of Artificial Intelligence 2025
- 8. Atomic Layer Deposition Equipment Market, by Equipment Type
- 8.1. Batch ALD Equipment
- 8.2. Modular ALD Equipment
- 8.3. Single-Wafer ALD Equipment
- 9. Atomic Layer Deposition Equipment Market, by Technology Type
- 9.1. Plasma-Enhanced ALD
- 9.2. Thermal ALD
- 10. Atomic Layer Deposition Equipment Market, by Application
- 10.1. Battery Applications
- 10.2. Diagnostics Equipment
- 10.3. Energy Cells
- 10.4. Protective Coatings
- 10.5. Semiconductor Manufacturing
- 10.6. Sensor Coatings
- 10.7. Thin Film & Display
- 11. Atomic Layer Deposition Equipment Market, by End-User Industry
- 11.1. Aerospace
- 11.2. Automotive
- 11.3. Electronics & Semiconductor
- 11.4. Energy & Power
- 11.5. Textile
- 12. Atomic Layer Deposition Equipment Market, by Region
- 12.1. Americas
- 12.1.1. North America
- 12.1.2. Latin America
- 12.2. Europe, Middle East & Africa
- 12.2.1. Europe
- 12.2.2. Middle East
- 12.2.3. Africa
- 12.3. Asia-Pacific
- 13. Atomic Layer Deposition Equipment Market, by Group
- 13.1. ASEAN
- 13.2. GCC
- 13.3. European Union
- 13.4. BRICS
- 13.5. G7
- 13.6. NATO
- 14. Atomic Layer Deposition Equipment Market, by Country
- 14.1. United States
- 14.2. Canada
- 14.3. Mexico
- 14.4. Brazil
- 14.5. United Kingdom
- 14.6. Germany
- 14.7. France
- 14.8. Russia
- 14.9. Italy
- 14.10. Spain
- 14.11. China
- 14.12. India
- 14.13. Japan
- 14.14. Australia
- 14.15. South Korea
- 15. Competitive Landscape
- 15.1. Market Share Analysis, 2024
- 15.2. FPNV Positioning Matrix, 2024
- 15.3. Competitive Analysis
- 15.3.1. ANRIC Technologies
- 15.3.2. Applied Materials, Inc.
- 15.3.3. Arradiance LLC
- 15.3.4. ASM International N.V.
- 15.3.5. Beneq Oy
- 15.3.6. CVD Equipment Corporation
- 15.3.7. Encapsulix SAS
- 15.3.8. Eugenus, Inc.
- 15.3.9. Forge Nano Inc.
- 15.3.10. Horiba, Ltd.
- 15.3.11. Jacomex SAS
- 15.3.12. Kurt J. Lesker Company
- 15.3.13. Lam Research Corporation
- 15.3.14. Lotus Applied Technology
- 15.3.15. NANO-MASTER, Inc.
- 15.3.16. NCD Co., Ltd.
- 15.3.17. Optorun Co., Ltd.
- 15.3.18. Oxford Instruments PLC
- 15.3.19. Photon Export Thin Films & Patents SL
- 15.3.20. Picosun Oy
- 15.3.21. Samco Inc.
- 15.3.22. SENTECH Instruments GmbH
- 15.3.23. Showa Shinku Co., Ltd.
- 15.3.24. SVT Associates, Inc.
- 15.3.25. Tokyo Electron Limited
- 15.3.26. Veeco Instruments Inc.
- 15.3.27. Wonik IPS Co., Ltd.
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