Advanced IC Packaging Market Research Report by Type (2.5D Integrated Circuit, 2D Integrated Circuit, and 3D Integrated Circuit), Application, State (Illinois, California, and Florida) - United States Forecast to 2027 - Cumulative Impact of COVID-19

Advanced IC Packaging Market Research Report by Type (2.5D Integrated Circuit, 2D Integrated Circuit, and 3D Integrated Circuit), Application, State (Illinois, California, and Florida) - United States Forecast to 2027 - Cumulative Impact of COVID-19

The United States Advanced IC Packaging Market size was estimated at USD 7,706.04 million in 2021 and expected to reach USD 8,759.29 million in 2022, and is projected to grow at a CAGR 10.11% to reach USD 13,741.07 million by 2027.

Market Statistics:

The report provides market sizing and forecast across five major currencies - USD, EUR, JPY, GBP, AUD, CAD, and CHF. It helps organization leaders make better decisions when currency exchange data is readily available. In this report, the years 2019 and 2020 are considered historical years, 2021 as the base year, 2022 as the estimated year, and years from 2023 to 2027 are considered the forecast period.

Market Segmentation & Coverage:

This research report categorizes the Advanced IC Packaging to forecast the revenues and analyze the trends in each of the following sub-markets:

Based on Type, the market was studied across 2.5D Integrated Circuit, 2D Integrated Circuit, 3D Integrated Circuit, Fan Out Silicon In Package, Fan Out Wafer Level Package, Flip Chip, and Wafer Level Chip Scale Package.

Based on Application, the market was studied across Aerospace and Defense, Automotive and Transportation, IT and Telecom, and Mobile and Consumer.

Based on State, the market was studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas.

Cumulative Impact of COVID-19:

COVID-19 is an incomparable global public health emergency that has affected almost every industry, and the long-term effects are projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlying COVID-19 issues and potential paths forward. The report delivers insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecasts, considering the COVID-19 impact on the market.

Competitive Strategic Window:

The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies to help the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. It describes the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth during a forecast period.

FPNV Positioning Matrix:

The FPNV Positioning Matrix evaluates and categorizes the vendors in the Advanced IC Packaging Market based on Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.

Market Share Analysis:

The Market Share Analysis offers the analysis of vendors considering their contribution to the overall market. It provides the idea of its revenue generation into the overall market compared to other vendors in the space. It provides insights into how vendors are performing in terms of revenue generation and customer base compared to others. Knowing market share offers an idea of the size and competitiveness of the vendors for the base year. It reveals the market characteristics in terms of accumulation, fragmentation, dominance, and amalgamation traits.

Competitive Scenario:

The Competitive Scenario provides an outlook analysis of the various business growth strategies adopted by the vendors. The news covered in this section deliver valuable thoughts at the different stage while keeping up-to-date with the business and engage stakeholders in the economic debate. The competitive scenario represents press releases or news of the companies categorized into Merger & Acquisition, Agreement, Collaboration, & Partnership, New Product Launch & Enhancement, Investment & Funding, and Award, Recognition, & Expansion. All the news collected help vendor to understand the gaps in the marketplace and competitor’s strength and weakness thereby, providing insights to enhance product and service.

Company Usability Profiles:

The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the United States Advanced IC Packaging Market, including Amkor Technology, Inc., Analog Devices, Inc., FlipChip International, LLC, Intel Corporation, International Business Machines Corporation, Microchip Technology Inc., Palomar Technologies, Qualcomm Technologies, Inc., Texas Instruments, and Veeco Instruments Inc..

The report provides insights on the following pointers:

1. Market Penetration: Provides comprehensive information on the market offered by the key players
2. Market Development: Provides in-depth information about lucrative emerging markets and analyze penetration across mature segments of the markets
3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments
4. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players
5. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments

The report answers questions such as:

1. What is the market size and forecast of the United States Advanced IC Packaging Market?
2. What are the inhibiting factors and impact of COVID-19 shaping the United States Advanced IC Packaging Market during the forecast period?
3. Which are the products/segments/applications/areas to invest in over the forecast period in the United States Advanced IC Packaging Market?
4. What is the competitive strategic window for opportunities in the United States Advanced IC Packaging Market?
5. What are the technology trends and regulatory frameworks in the United States Advanced IC Packaging Market?
6. What is the market share of the leading vendors in the United States Advanced IC Packaging Market?
7. What modes and strategic moves are considered suitable for entering the United States Advanced IC Packaging Market?

Please Note: PDF & Excel + Online Access - 1 Year

Companies Mentioned

Amkor Technology, Inc.
Analog Devices, Inc.
FlipChip International, LLC
Intel Corporation
International Business Machines Corporation
Microchip Technology Inc.
Palomar Technologies
Qualcomm Technologies, Inc.
Texas Instruments
Veeco Instruments Inc.

1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders
2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update
3. Executive Summary
4. Market Overview
5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers Proliferating semiconductor industry in the U.S. resulting in growing adoption of IC packages such as 3D Surge in the demand for consumer electronics and mobile communications in the U.S
5.1.2. Restraints Thermal-associated concerns due to higher level of integration
5.1.3. Opportunities Emerging improvements in packaging density and development of cutting-edge technology Increasing miniaturization of electronic products
5.1.4. Challenges High unit cost of advanced IC packaging such as 2.5D IC and 3D IC packages
5.2. Cumulative Impact of COVID-19
6. Advanced IC Packaging Market, by Type
6.1. Introduction
6.2. 2.5D Integrated Circuit
6.3. 2D Integrated Circuit
6.4. 3D Integrated Circuit
6.5. Fan Out Silicon In Package
6.6. Fan Out Wafer Level Package
6.7. Flip Chip
6.8. Wafer Level Chip Scale Package
7. Advanced IC Packaging Market, by Application
7.1. Introduction
7.2. Aerospace and Defense
7.3. Automotive and Transportation
7.4. IT and Telecom
7.5. Mobile and Consumer
8. California Advanced IC Packaging Market
9. Florida Advanced IC Packaging Market
10. Illinois Advanced IC Packaging Market
11. New York Advanced IC Packaging Market
12. Ohio Advanced IC Packaging Market
13. Pennsylvania Advanced IC Packaging Market
14. Texas Advanced IC Packaging Market
15. Competitive Landscape
15.1. FPNV Positioning Matrix
15.1.1. Quadrants
15.1.2. Business Strategy
15.1.3. Product Satisfaction
15.2. Market Ranking Analysis
15.3. Market Share Analysis, By Key Player
15.4. Competitive Scenario
15.4.1. Merger & Acquisition
15.4.2. Agreement, Collaboration, & Partnership
15.4.3. New Product Launch & Enhancement
15.4.4. Investment & Funding
15.4.5. Award, Recognition, & Expansion
16. Company Usability Profiles
16.1. Amkor Technology, Inc.
16.2. Analog Devices, Inc.
16.3. FlipChip International, LLC
16.4. Intel Corporation
16.5. International Business Machines Corporation
16.6. Microchip Technology Inc.
16.7. Palomar Technologies
16.8. Qualcomm Technologies, Inc.
16.9. Texas Instruments
16.10. Veeco Instruments Inc.
17. Appendix
17.1. Discussion Guide
17.2. License & Pricing

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