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TMC – Fab 6 Semiconductor Fabrication Facility – Mie Prefecture - Project Profile

TMC – Fab 6 Semiconductor Fabrication Facility – Mie Prefecture - Project Profile

Synopsis

"TMC – Fab 6 Semiconductor Fabrication Facility – Mie Prefecture - Project Profile" contains information on the scope of the project including project overview and location. The profile also details project ownership and funding, gives a full project description, as well as information on contracts, tendering and key project contacts.

The "TMC – Fab 6 Semiconductor Fabrication Facility – Mie Prefecture - Project Profile" is part of Timetric's database of 82,000+ construction projects. Our database includes a 10+ year archive of completed projects, full coverage of all global projects with a value greater than $25 million and key contact details for project managers, owners, consultants, contractors and bidders.

Summary

Toshiba Memory Corporation (TMC), a subsidiary of Toshiba Corporation (TOSHIBA) is undertaking the construction of a semiconductor fabrication facility in Mie prefecture, Japan.

The project involves the construction of a semiconductor fabrication facility. It will be developed in two phases.

It includes the construction of a new research and development (R&D) center, a memory R&D center, parking spaces, production units, warehouse, packing and distribution units, the installation of related machinery and equipment.

On February 9, 2017, construction works commenced on the first phase of Fab 6 and the memory R&D center.

On June 28, 2017, TMC approved the funding of US$1,600 million into the project. The investment will cover installation of manufacturing facilities in the first phase and the construction of the second phase of the Fab 6. The investment in Fab 6 will enable TMC to install manufacturing equipment for 96-layer 3D flash memories, including deposition and etching equipment.

Construction activities are underway. Work on the memory R&D center is scheduled to be completed in December 2017, while the first phase will be completed by the third quarter of 2018.

Construction on the second phase of Fab 6 is scheduled to start in September 2017, with a completion target at the end of 2018.

Scope

The Fab 6 involves the construction of a semiconductor fabrication facility in Yokkaichi, Mie prefecture, Japan.

The US$2,000 million project includes the following:

1. Construction of a new research and development (R&D) center

2. Construction of a memory R&D center

3. Construction of production units

4. Construction of a warehouse

5. Construction of packing and distribution units

6. Installation of related machinery and equipmentReasons To Buy

  • Gain insight into the project.
  • Monitor the latest project developments.
  • Identify key project contacts.


1.Key Statistics
2.Key Dates
3.Sector
4.Scope
5.Description
6.Latest update
7.Background
8.Key Contacts
9.General News, Project News
10.Appendix

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