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HPECL– Suzhou Mobile Chip and Handset Manufacturing Plant – Anhui - Project Profile

HPECL– Suzhou Mobile Chip and Handset Manufacturing Plant – Anhui - Project Profile

Synopsis

"HPECL– Suzhou Mobile Chip and Handset Manufacturing Plant – Anhui - Project Profile" contains information on the scope of the project including project overview and location. The profile also details project ownership and funding, gives a full project description, as well as information on contracts, tendering and key project contacts.

The "HPECL– Suzhou Mobile Chip and Handset Manufacturing Plant – Anhui - Project Profile" is part of Timetric's database of 82,000+ construction projects. Our database includes a 10+ year archive of completed projects, full coverage of all global projects with a value greater than $25 million and key contact details for project managers, owners, consultants, contractors and bidders.

Summary

Hui Pu Electronics (Shenzhen) Co. Ltd (HPECL) is constructing a mobile chip and handset manufacturing plant on 30,000m2 of land in Suzhou, Anhui, China.

The project involves the construction of production units, assembling units, a research and development unit, a warehouse, packaging units, an administrative building and parking facilities, and the installation of machinery, equipment and safety systems.

Construction activities are underway.

Scope

The project involves the construction of a mobile chip and handset manufacturing plant in Suzhou, Anhui, China.

The US$78 million project includes the following:

1. Construction of production units

2. Construction of assembling units

3. Construction of a warehouse

4. Construction of packaging units

5. Construction of an administrative building

6. Installation of machinery, equipment and safety systemsReasons To Buy

  • Gain insight into the project.
  • Monitor the latest project developments.
  • Identify key project contacts.


1.Key Statistics
2.Key Dates
3.Sector
4.Scope
5.Description
6.Latest update
7.Background
8.Key Contacts
9.General News, Project News
10.Appendix

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