Middle East & Africa Semiconductor Bonding Market Forecast to 2028 - COVID-19 Impact and Regional Analysis by Type (Die Bonder, Wafer Bonder, and Flip Chip Bonder) and Application (RF Devices, MEMS and Sensors, LED, CMOS Image Sensors, and 3D NAND)
The semiconductor bonding market in Middle East & Africa is expected to grow from US$ 28.03 million in 2022 to US$ 34.70 million by 2028. It is estimated to grow at a CAGR of 3.6% from 2022 to 2028.
Rising Demand for Hybrid Bonding
The growing need for I/O density and faster connections between chips is transforming system designs that include 3D architectures and hybrid bonding. Hybrid bonding connects power and signal-carrying copper pads and the surrounding dielectric through die-to-wafer or wafer-to-wafer connections, providing up to 1,000X more connections than copper microbumps. While accelerating bump density by three orders of magnitude above 2.5D integration techniques, it reduces signal delay to approximately nonexistent levels. Hybrid bonding is currently only used in a few high-end applications, such as processor/cache and HBM (High Bandwidth Memory), but it is expected that its adoption will increase in 3D DRAM, RF modems, and GaN/Si bonding for microLEDs. Hybrid bonding presents a practical alternative to transistor node scaling, where high performance is required. Thus, to meet the enormous demand from high-end processors, HBM, microLED, and other applications, hybrid bonding will create a lucrative opportunity for the growth of the Middle East & Africa semiconductor bonding market during the forecast period. Moreover, various market players are forming joint ventures and agreements to cater to the growing demand for hybrid bonding. Thus, various collaborative approaches by the market players in bringing forward the hybrid bonding technology will further lead to the growth of the Middle East & Africa semiconductor bonding market during the forecast period.
South Africa, Saudi Arabia, UAE, and the Rest of Middle East & Africa are the key contributors to the semiconductor bonding market in the Middle East & Africa. The prominent industries across the region are aerospace & defense, consumer electronics, healthcare, automotive, and telecommunications. In 2020, Saudi Arabia exported US$ 3.16 million and imported US$ 54.7 million of semiconductor devices, making it the 66th and 63rd largest exporter of semiconductor devices across the world. The usage of semiconductor bonding equipment has increased in the LED lighting industry. Furthermore, as per the International Energy Agency (IEA), smart lighting systems could save up to 35% of the energy associated with conventional lighting systems. Lighting consumes most of the commercial, residential, and industrial electricity. It accounts for 15% of the total electricity consumption and 5% of the total greenhouse gas emissions in this region, which can be reduced by the implementation of LEDs. The usage of electricity is expected to increase by more than 50% in the next 20-25 years, which is likely to boost the demand for LED lighting in Saudi Arabia. Thus, developments in the LED sector will boost the overall automotive sector, which is likely to fuel the Middle East & Africa semiconductor bonding market growth.
Middle East & Africa Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)
Middle East & Africa Semiconductor Bonding Market Segmentation
The Middle East & Africa semiconductor bonding market is segmented into type, application, and country.
Based on type, the market is segmented into die bonder, wafer bonder, and flip chip bonder. The wafer bonder segment registered the largest market share in 2022.
Based on application, the market is segmented into RF devices, MEMS and sensors, LED, CMOS image sensors, and 3D NAND. The MEMS and sensors segment held the largest market share in 2022.
Based on country, the market is segmented into South Africa, Saudi Arabia, the UAE, and the Rest of Middle East & Africa. UAE dominated the market share in 2022.
ASMPT; EV Group; Kulicke & Soffa Industries, Inc.; Palomar Technologies; Panasonic Corporation; Toray Industries Inc; WestBond, Inc.; and Yamaha Motor Corporation are the leading companies operating in the semiconductor bonding market in the Middle East & Africa region.
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