Global Thin Wafer Market Size, Trends and Growth opportunity, By wafer size (125mm, 200mm,
300mm), By process (bonding and debonding),By application (MEMS, CMOS Image Sensor, memory,
RF devices, LED, Interposers, Logic and others), By technology (wafer grinding, wafer polishing and
wafer dicing),By region and forecast till 2027
Global Thin Wafer Market
The global thin wafer market was valued at US$7.9 billion in 2021 and it is expected to reach at
US$12.8 billion in 2027 at a CAGR of 7.2% during forecast period 2022-2027.
A thin wafer is a piece of semiconductor material that is used to create integrated circuits. One of
the key factors driving the expansion of the thin wafer market is the rising demand for
semiconductor devices in sectors including telecommunications, consumer electronics, and
MEMS are becoming more and more in demand as portable medical gadgets, communication
systems, and automotive sensor devices come into play. MEMS may be used in almost all electronic
devices due to its small size, which significantly contributes to their widespread use in a range of
applications. The need for thin wafers is also significantly influenced by the shrinkage of electrical
and electronic components. The increasing number of smartphone users throughout the world is
dramatically raising demand for such wafer types in order to minimise the thickness of the devices
Efficiency is the major problem businesses are currently having while using thin wafers. A narrow
wafer has a poor capability for long-wavelength light absorption, particularly if its thickness is less
than 50 mm. Long wavelengths require a significant amount of light travel time before the wafer can
absorb them completely. The primary goal of creating a thin wafer was to provide chip makers
access to all of its advantages, including high performance, low power consumption, and a smaller
The global thin wafer market segmented into wafer size, process, application and technology. On the
basis of wafer size it segmented into 125mm, 200mm, 300mm. On the basis of process it segmented
into temporary bonding and debonding. On the basis of application it segmented into MEMS, CMOS
Image Sensor, memory, RF devices, LED, Interposers, Logic and others. On the basis of technology it
segmented into wafer grinding, wafer polishing and wafer dicing.
The global market segmented into five regions North America, Europe, Latin America, Asia Pacific,
Middle East and Africa. Because of APAC's dominant position, high-end consumer electronics like
wearable and smart home appliances will become more popular in China and Japan. The area has
become a focal point for significant opportunities for investment and commercial growth on a
worldwide scale. A further factor contributing to the region's market progress is the rising number of
investments and ongoing corporate expansion in Asian nations.
Various key players are listed in this report such as Globalwafers Co., Ltd, Shin-Etsu Chemical Co.,
My-Chip Production Gmbh, EV Group, Siltronic AG, Polishing Corporation Of America, Virginia
Semiconductor Inc., ULVAC Gmbh, Brewer Science, Inc., and 3M.
By Wafer Size
CMOS Image Sensor
Key Question Addressed by the Report
What are the Key Opportunities in Global Thin Wafer Market?
What will be the growth rate from 2022 to 2027.
Which segment/region will have highest growth?
What are the factors that will impact/drive the Market?
What is the role of key players in the value chain?
What is the competitive Landscape in the industry?
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