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Global Die Bonder Equipment Market Research Report 2017

Global Die Bonder Equipment Market Research Report 2017

This report studies the Die Bonder Equipment market status and outlook of global and major regions, from angles of manufacturers, regions, product types and end industries; this report analyzes the top manufacturers in global and major regions, and splits the Die Bonder Equipment market by product type and applications/end industries.

The global Die Bonder Equipment market is expected to reach $779.89 million by 2022 from $759.63 million in 2017, growing at a CAGR of 0.53% from 2017 to 2022. And Europe market is expected to be the biggest market with output market share of 30.84% in 2022.

The major players in global Die Bonder Equipment market include
Besi
ASM Pacific Technology (ASMPT)
Kulicke & Soffa
Palomar Technologies
Shinkawa
DIAS Automation
Toray Engineering
Panasonic
FASFORD TECHNOLOGY
West-Bond
Hybond

Geographically, this report is segmented into several key Regions, with output/production, consumption, revenue, market share and growth rate of Die Bonder Equipment in these regions, from 2012 to 2022 (forecast), covering
North America
Europe
China
Japan
Southeast Asia
India

On the basis of product, the Die Bonder Equipment market is primarily split into
Fully Automatic
Semi-Automatic
Manual

On the basis on the end users/applications, this report covers
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)


1 Die Bonder Equipment Market Overview
1.1 Product Overview and Scope of Die Bonder Equipment
1.1.1 Definition of Die Bonder Equipment
1.1.1.1 Eutectic Bonding
1.1.1.2 Adhesive Bonding
1.1.1.3 Glass /Silver-Glass Bonding
1.1.2 Specifications of Die Bonder Equipment
1.2 Die Bonder Equipment Segment by Types (Product Category)
1.2.1 Global Die Bonder Equipment Production Comparison by Type (Product Category) (2012-2022)
1.2.2 Global Die Bonder Equipment Production Market Share by Type (Product Category) in 2016
1.2.3 Fully Automatic
1.2.4 Semi-Automatic
1.2.5 Manual
1.3 Global Die Bonder Equipment Segment by Applications
1.3.1 Global Die Bonder Equipment Consumption Comparison by Applications (2012-2022)
1.3.2 Integrated Device Manufacturers (IDMs)
1.3.3 Outsourced Semiconductor Assembly and Test (OSAT)
1.4 Global Die Bonder Equipment Market by Regions (2012-2022)
1.4.1 Global Die Bonder Equipment Output (Unit) Comparison by Regions (2012-2022)
1.4.2 United States Die Bonder Equipment Status and Prospect (2012-2022)
1.4.3 Europe Die Bonder Equipment Status and Prospect (2012-2022)
1.4.4 China Die Bonder Equipment Status and Prospect (2012-2022)
1.4.5 Japan Die Bonder Equipment Status and Prospect (2012-2022)
1.4.6 Southeast Asia Die Bonder Equipment Status and Prospect (2012-2022)
1.4.7 India Die Bonder Equipment Status and Prospect (2012-2022)
1.5 Global Market Size of Die Bonder Equipment (2012-2022)
1.5.1 Global Die Bonder Equipment Revenue (Million USD) Status and Outlook (2012-2022)
1.5.2 Global Die Bonder Equipment Output (Unit) Status and Outlook (2012-2022)
2 Global Die Bonder Equipment Market Competition by Manufacturers
2.1 Global Die Bonder Equipment Capacity, Production and Share by Manufacturers (2012-2017)
2.1.1 Global Die Bonder Equipment Capacity (Units) and Share (%) by Manufacturers (2012-2017)
2.1.2 Global Die Bonder Equipment Production (Units) and Share (%) by Manufacturers (2012-2017)
2.2 Global Die Bonder Equipment Revenue and Share by Manufacturers (2012-2017)
2.3 Global Die Bonder Equipment Average Price by Manufacturers (2012-2017)
2.4 Manufacturers Die Bonder Equipment Manufacturing Base Distribution, Sales Area, Product Types
2.5 Die Bonder Equipment Market Competitive Situation and Trends
2.5.1 Die Bonder Equipment Market Concentration Rate
2.5.2 Die Bonder Equipment Market Share (%) of Top 3 and Top 5 Manufacturers
2.5.3 Mergers & Acquisitions, Expansion
3 Global Die Bonder Equipment Production, Revenue by Regions
3.1 Global Die Bonder Equipment Production and Market Share by Regions (2012-2017)
3.2 Global Die Bonder Equipment Revenue and Market Share by Regions (2012-2017)
3.3 Global Die Bonder Equipment Production (Units), Revenue (Million USD), Price (K USD/Unit) and Gross Margin (%) (2012-2017)
3.4 United States Die Bonder Equipment Production (Units), Revenue (Million USD), Price (K USD/Unit) and Gross Margin (%) (2012-2017)
3.5 EU Die Bonder Equipment Production (Units), Revenue (Million USD), Price (K USD/Unit) and Gross Margin (%) (2012-2017)
3.6 China Die Bonder Equipment Production (Units), Revenue (Million USD), Price (K USD/Unit) and Gross Margin (%) (2012-2017)
3.7 Japan Die Bonder Equipment Production (Units), Revenue (Million USD), Price (K USD/Unit) and Gross Margin (%) (2012-2017)
3.8 Southeast Asia Die Bonder Equipment Production (Units), Revenue (Million USD), Price (K USD/Unit) and Gross Margin (%) (2012-2017)
3.9 India Die Bonder Equipment Production (Units), Revenue (Million USD), Price (K USD/Unit) and Gross Margin (%) (2012-2017)
4 Global Die Bonder Equipment Supply (Production), Consumption, Export, Import by Regions
4.1 Global Die Bonder Equipment Consumption by Regions (2012-2017)
4.2 United States Die Bonder Equipment Production, Consumption, Export, Import (2012-2017)
4.3 EU Die Bonder Equipment Production, Consumption, Export, Import (2012-2017)
4.4 China Die Bonder Equipment Production, Consumption, Export, Import (2012-2017)
4.5 Japan Die Bonder Equipment Production, Consumption, Export, Import (2012-2017)
4.6 Southeast Asia Die Bonder Equipment Production, Consumption, Export, Import (2012-2017)
4.7 India Die Bonder Equipment Production, Consumption, Export, Import (2012-2017)
5 Global Die Bonder Equipment Production, Revenue, Price Trend by Types
5.1 Global Die Bonder Equipment Production (Units) and Market Share (%) by Types (2012-2017)
5.2 Global Die Bonder Equipment Revenue (Million USD) and Market Share (%) by Types (2012-2017)
5.3 Global Die Bonder Equipment Price (K USD/Unit) by Type (2012-2017)
5.4 Global Die Bonder Equipment Production Growth (%) by Type (2012-2017)
6 Global Die Bonder Equipment Market Analysis by Applications
6.1 Global Die Bonder Equipment Consumption and Market Share by Applications (2012-2017)
6.2 Global Die Bonder Equipment Consumption Growth Rate by Applications (2012-2017)
6.3 Market Drivers and Opportunities
6.3.1 Potential Applications
6.3.1.1 Driving Improvements in Mobile Technology/ New Advanced Packaging Solutions
6.3.1.2 New Smart Phone Features Expand Bonder Equipment Market
6.3.1.3 Increased Automotive Electronic Content Also Drives Assembly Solutions
6.3.2 Emerging Markets/Countries
7 Global Die Bonder Equipment Manufacturers Profiles/Analysis
7.1 Besi (NL)
7.1.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.1.2 Die Bonder Equipment Product Introduction of Besi
7.1.3 Besi Die Bonder Equipment Capacity, Production, Revenue, Price and Gross Margin (%) (2012-2017)
7.1.4 Main Business/Business Overview
7.2 ASM Pacific Technology (ASMPT) (HK)
7.2.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.2.2 Die Bonder Equipment Product Introduction of ASM Pacific Technology (ASMPT)
7.2.3 ASM Pacific Technology (ASMPT) Die Bonder Equipment Capacity, Production, Revenue, Price and Gross Margin (%) (2012-2017)
7.2.4 Main Business/Business Overview
7.3 Kulicke & Soffa (US)
7.3.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.3.2 Die Bonder Equipment Product Introduction of Kulicke & Soffa
7.3.3 Kulicke & Soffa Die Bonder Equipment Capacity, Production, Revenue, Price and Gross Margin (%) (2012-2017)
7.3.4 Main Business/Business Overview
7.4 Palomar Technologies (US)
7.4.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.4.2 Die Bonder Equipment Product Introduction of Palomar Technologies
7.4.3 Palomar Technologies Die Bonder Equipment Capacity, Production, Revenue, Price and Gross Margin (%) (2012-2017)
7.4.4 Main Business/Business Overview
7.5 Shinkawa (JP)
7.5.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.5.2 Die Bonder Equipment Product Introduction of Shinkawa
7.5.3 Shinkawa Die Bonder Equipment Capacity, Production, Revenue, Price and Gross Margin (%) (2012-2017)
7.5.4 Main Business/Business Overview
7.6 DIAS Automation (HK)
7.6.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.6.2 Die Bonder Equipment Product Introduction of DIAS Automation
7.6.3 DIAS Automation Die Bonder Equipment Capacity, Production, Revenue, Price and Gross Margin (%) (2012-2017)
7.6.4 Main Business/Business Overview
7.7 Toray Engineering (JP)
7.7.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.7.2 Die Bonder Equipment Product Introduction of Toray Engineering
7.7.3 Toray Engineering Die Bonder Equipment Capacity, Production, Revenue, Price and Gross Margin (%) (2012-2017)
7.7.4 Main Business/Business Overview
7.8 Panasonic (JP)
7.8.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.8.2 Die Bonder Equipment Product Introduction of Panasonic
7.8.3 Panasonic Die Bonder Equipment Capacity, Production, Revenue, Price and Gross Margin (%) (2012-2017)
7.8.4 Main Business/Business Overview
7.9 FASFORD TECHNOLOGY (JP)
7.9.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.9.2 Die Bonder Equipment Product Introduction of FASFORD TECHNOLOGY
7.9.3 FASFORD TECHNOLOGY Die Bonder Equipment Capacity, Production, Revenue, Price and Gross Margin (%) (2012-2017)
7.9.4 Main Business/Business Overview
7.10 West-Bond (US)
7.10.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.10.2 Die Bonder Equipment Product Introduction of West-Bond
7.10.3 West-Bond Die Bonder Equipment Capacity, Production, Revenue, Price and Gross Margin (%) (2012-2017)
7.10.4 Main Business/Business Overview
7.11 Hybond (US)
7.11.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.11.2 Die Bonder Equipment Product Introduction of Hybond
7.11.3 Hybond Die Bonder Equipment Capacity, Production, Revenue, Price and Gross Margin (%) (2012-2017)
7.11.4 Main Business/Business Overview
8 Die Bonder Equipment Manufacturing Cost Analysis
8.1 Die Bonder Equipment Key Raw Materials Analysis
8.1.1 Key Raw Materials of Die Bonder Equipment
8.1.2 Price Trend of Key Raw Materials
8.1.3 Key Suppliers of Raw Materials
8.1.4 Market Concentration Rate of Raw Materials
8.2 Proportion of Manufacturing Cost Structure
8.2.1 Raw Materials
8.2.2 Labor Cost
8.2.2.1 USA Labor Cost Analysis
8.2.2.2 European Union Costs Analysis
8.2.2.3 China Labor Costs Analysis
8.2.2.4 Japan Labor Costs Analysis
8.2.3 Manufacturing Expenses
8.3 Manufacturing Process Analysis of Die Bonder Equipment
9 Industrial Chain, Sourcing Strategy and Downstream Buyers
9.1 Die Bonder Equipment Industrial Chain Analysis
9.2 Upstream Raw Materials Sourcing
9.3 Raw Materials Sources of Die Bonder Equipment Major Manufacturers in 2016
9.4 Downstream Buyers
10 Marketing Strategy Analysis, Distributors
10.1 Marketing Channel
10.1.1 Marketing Channel Analysis
10.1.2 Marketing Channel Development Trend
10.2 Market Positioning
10.2.1 Pricing Strategy
10.2.2 Brand Strategy
10.2.3 Target Client
10.3 Distributors/Traders List
11 Market Effect Factors Analysis
11.1 Technology Progress/Risk
11.1.1 Substitutes Threat
11.1.2 Technology Progress in Related Industry
11.2 Consumer Needs/Customer Preference Change
11.3 Economic/Political Environmental Change
12 Global Die Bonder Equipment Market Forecast
12.1 Global Die Bonder Equipment Capacity, Production, Revenue Forecast (2017-2022)
12.1.1 Global Die Bonder Equipment Capacity, Production (Units) and Growth Rate (%) Forecast (2017-2022)
12.1.2 Global Die Bonder Equipment Revenue and Growth Rate Forecast (2017-2022)
12.1.3 Global Die Bonder Equipment Price and Trend Forecast (2017-2022)
12.2 Global Die Bonder Equipment Production, Consumption, Import and Export Forecast by Regions (2017-2022)
12.2.1 United States Die Bonder Equipment Production Forecast (2017-2022)
12.2.2 EU Die Bonder Equipment Production Forecast (2017-2022)
12.2.3 China Die Bonder Equipment Production Forecast (2017-2022)
12.2.4 Japan Die Bonder Equipment Production Forecast (2017-2022)
12.2.5 Southeast Asia Die Bonder Equipment Production Forecast (2017-2022)
12.2.6 India Die Bonder Equipment Production Forecast (2017-2022)
12.3 Global Die Bonder Equipment Production Forecast by Type (2017-2022)
12.4 Global Die Bonder Equipment Consumption Forecast by Application (2017-2022)
13 Research Findings and Conclusion
14 Methodology and Data Source
14.1 Methodology/Research Approach
14.1.1 Research Programs/Design
14.1.2 Market Size Estimation
14.1.3 Market Breakdown and Data Triangulation
14.2 Data Source
14.2.1 Secondary Sources
14.2.2 Primary Sources
14.3 Disclaimer
14.4 Author List
List of Tables and Figures
Figure Picture of Die Bonder Equipment
Table Some Typical Preform Materials
Table Pros and Cons of Eutectic Bonding
Table Typical Adhesives
Table Pros and Cons of Table Pros and Cons of
Table Typical Glass Die Attach Material
Table Pros and Cons of Glass /Silver-Glass Bonding
Figure Global Die Bonder Equipment Production Comparison by Type (Product Category) (2012-2022)
Figure Global Die Bonder Equipment Production Market Share by Type (Product Category) in 2016
Figure Fully Automatic Die Bonder Equipment Picture
Figure Semi-Automatic Die Bonder Equipment Picture
Figure Manual Die Bonder Equipment Picture
Table Global Die Bonder Equipment Consumption (Unit) Comparison by Applications (2012-2022)
Figure Global Die Bonder Equipment Consumption Market Share (%) by Applications in 2016
Table Integrated Device Manufacturers (IDMs) Examples
Table Outsourced Semiconductor Assembly and Test (OSAT) Examples
Figure Global Die Bonder Equipment Output (Unit) Comparison by Regions (2012-2022)
Figure United States Die Bonder Equipment Output (Unit) and Growth Rate (2012-2022)

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