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Global Embedded Die Packaging Technology Market Research Report Insights, Opportunity Analysis, Market Shares and Forecast, 2017 - 2023

Global Embedded Die Packaging Technology Market Research Report Insights, Opportunity Analysis, Market Shares and Forecast, 2017 - 2023

Embedded die packaging technology is the process of embedding semiconductor dies in the inner layer of a chip package, organic circuit board or module. The global embedded die packaging technology market is expected to rise at a CAGR of 14.8 % during the forecast period 2016-2023. Embedded die packaging technology provides many advantages such as improved electrical and thermal performance, compact size, opportunity for cost reduction, heterogeneous integration, streamlined logistics for Original Equipment Manufacturers (OEMs) etc. The key factor driving the growth of global embedded die packaging technology market is the increasing number of portable electronic devices.

North America is the largest market region for global embedded die packaging technology market in terms of market revenue share. The key factors driving the growth of North American embedded die packaging technology market are the surging demand and adoption of IoT devices, growing telecommunication and automotive industry. Embedded die packaging technology is extensively used in embedded systems such as microcontroller chips and integrated circuits, digital signal processor. These electronic components are then used in mobile phones, mp3 players, digital cameras etc. Furthermore, North America has the largest number of smartphone users. Thus, increasing smartphone user in North America drives the demand for embedded die packaging technology thereby contributing to the market growth in North America. Asia Pacific is expected to emerge as the fastest growing market region owing to the presence of key market players such as Fujikura, ASE group, Taiwan semiconductor manufacturing company etc. in Asia Pacific region.

The global embedded die packaging technology market is influenced by the presence of leading semiconductor companies such as Amkor technology, ASE group, Fujikura ltd, General Electric Corporation, Infineon technologies and others. Product launch, joint ventures, mergers and acquisition are some of the crucial strategies adopted by the key market players to gain competitive advantage.

Global embedded die packaging technology market report covers segmentation analysis of platform type and end users. Report further covers segments of platform types which include embedded die in IC package substrate, embedded die in rigid board and embedded die in flexible board. Embedded die in IC package substrate is the leading platform type segment owing to its increased adoption in DC-DC converters and camera modules which are used in smartphones. Whereas, end users of embedded die packaging technology include consumer electronics, IT & telecommunication, automotive, healthcare etc. The IT and telecommunication is the dominating end user segment as embedded die packaging technology are widely used in smartphones, routers, etc.

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1. INTRODUCTION
1.1. EXECUTIVE SUMMARY
1.2. ESTIMATION METHODOLOGY
2. MARKET OVERVIEW
2.1. GLOBAL EMBEDDED DIE PACKAGING TECHNOLOGY MARKET : EVOLUTION & TRANSITION
2.2. MARKET DEFINITION & SCOPE
2.3. INDUSTRY STRUCTURE
2.4. REGULATORY FRAMEWORK
2.5. TOTAL MARKET ANALYSIS
2.5.1. TOP 5 FINDINGS
2.5.2. TOP 5 OPPORTUNITY MARKETS
2.5.3. TOP 5 COMPANIES
2.5.4. TOP 3 COMPETITIVE STRATEGIES
2.6. ESTIMATION ANALYSIS
2.7. STRATEGIC ANALYSIS
2.7.1. INVESTMENT VS. ADOPTION MODEL
2.7.2. 360-DEGREE INDUSTRY ANALYSIS
2.7.3. PORTERS 5 FORCE MODEL
2.7.4. SEE-SAW ANALYSIS
2.7.5. CONSUMER ANALYSIS AND KEY BUYING CRITERIA
2.8. COMPETITIVE ANALYSIS
2.8.1. KEY STRATEGIES & ANALYSIS
2.8.2. MARKET SHARE ANALYSIS AND TOP COMPANY ANALYSIS
2.9. STRATEGIC RECOMMENDATIONS & KEY CONCLUSIONS
2.9.1. INVESTMENT OPPORTUNITIES BY REGIONS
2.9.2. OPPORTUNITIES IN EMERGING APPLICATIONS
2.9.3. INVESTMENT OPPORTUNITY IN FASTEST GROWING SEGMENT
3. MARKET DETERMINANTS
3.1. MARKET DRIVERS
3.1.1. INCREASE IN NUMBER OF PORTABLE ELECTRONIC DEVICES
3.1.2. RISE IN APPLICATION OF HEALTHCARE AND AUTOMOTIVE DEVICES
3.1.3. ADVANTAGES OF EMBEDDED DIE PACKAGING TECHNOLOGY
3.2. MARKET RESTRAINTS
3.2.1. HIGH COST OF EMBEDDED DIE PACKAGING
3.2.2. REQUIREMENT OF HIGH INITIAL CAPITAL INVESTMENT
3.3. MARKET OPPORTUNITIES
3.3.1. IMPENDING NEED FOR CIRCUIT MINIATURIZATION IN MICROELECTRONIC DEVICES
3.3.2. TECHNOLOGY ADVANCEMENTS
3.4. MARKET CHALLENGES
3.4.1. WARPAGE CONTROL ISSUES
3.4.2. DIFFICULT TO IMPLEMENT VERY THIN SUBSTRATE
4. MARKET SEGMENTATION
4.1. GLOBAL EMBEDDED DIE PACKAGING TECHNOLOGY MARKET BY PLATFORM TYPE
4.1.1. MARKET DEFINITION AND SCOPE
4.1.2. DECISION SUPPORT DATABASE & ESTIMATION METHODOLOGY
4.1.3. COMPARATIVE ANALYSIS ACROSS MARKET SEGMENTS
4.1.4. OPPORTUNITY MATRIX
4.1.5. MARKET SEGMENTATION
4.1.5.1. GLOBAL EMBEDDED DIE IN IC PACKAGE SUBSTRATE MARKET
4.1.5.1.1. ADOPTION SCENARIO & MARKET DETERMINANTS
4.1.5.1.2. MARKET ESTIMATIONS AND FORECASTS 2014-2023 ($ MILLION)
4.1.5.1.3. KEY PLAYERS & KEY PRODUCTS
4.1.5.1.4. KEY CONCLUSIONS
4.1.5.2. GLOBAL EMBEDDED DIE IN RIGID BOARD MARKET
4.1.5.2.1. ADOPTION SCENARIO & MARKET DETERMINANTS
4.1.5.2.2. MARKET ESTIMATIONS AND FORECASTS 2014-2023 ($ MILLION)
4.1.5.2.3. KEY PLAYERS & KEY PRODUCTS
4.1.5.2.4. KEY CONCLUSIONS
4.1.5.3. GLOBAL EMBEDDED DIE IN FLEXIBLE BOARD MARKET
4.1.5.3.1. ADOPTION SCENARIO & MARKET DETERMINANTS
4.1.5.3.2. MARKET ESTIMATIONS AND FORECASTS 2014-2023 ($ MILLION)
4.1.5.3.3. KEY PLAYERS & KEY PRODUCTS
4.1.5.3.4. KEY CONCLUSIONS
4.2. GLOBAL EMBEDDED DIE PACKAGING TECHNOLOGY MARKET BY END USERS
4.2.1. MARKET DEFINITION AND SCOPE
4.2.2. DECISION SUPPORT DATABASE & ESTIMATION METHODOLOGY
4.2.3. COMPARATIVE ANALYSIS ACROSS MARKET SEGMENTS
4.2.4. OPPORTUNITY MATRIX
4.2.5. MARKET SEGMENTATION
4.2.5.1. GLOBAL CONSUMER ELECTRONICS MARKET
4.2.5.1.1. ADOPTION SCENARIO & MARKET DETERMINANTS
4.2.5.1.2. MARKET ESTIMATIONS AND FORECASTS 2014-2023 ($ MILLION)
4.2.5.1.3. KEY PLAYERS & KEY PRODUCTS
4.2.5.1.4. KEY CONCLUSIONS
4.2.5.2. GLOBAL IT & TELECOMMUNICATION MARKET
4.2.5.2.1. ADOPTION SCENARIO & MARKET DETERMINANTS
4.2.5.2.2. MARKET ESTIMATIONS AND FORECASTS 2014-2023 ($ MILLION)
4.2.5.2.3. KEY PLAYERS & KEY PRODUCTS
4.2.5.2.4. KEY CONCLUSIONS
4.2.5.3. GLOBAL AUTOMOTIVE MARKET
4.2.5.3.1. ADOPTION SCENARIO & MARKET DETERMINANTS
4.2.5.3.2. MARKET ESTIMATIONS AND FORECASTS 2014-2023 ($ MILLION)
4.2.5.3.3. KEY PLAYERS & KEY PRODUCTS
4.2.5.3.4. KEY CONCLUSIONS
4.2.5.4. GLOBAL HEALTHCARE MARKET
4.2.5.4.1. ADOPTION SCENARIO & MARKET DETERMINANTS
4.2.5.4.2. MARKET ESTIMATIONS AND FORECASTS 2014-2023 ($ MILLION)
4.2.5.4.3. KEY PLAYERS & KEY PRODUCTS
4.2.5.4.4. KEY CONCLUSIONS
4.2.5.5. GLOBAL OTHER END USERS MARKET
4.2.5.5.1. ADOPTION SCENARIO & MARKET DETERMINANTS
4.2.5.5.2. MARKET ESTIMATIONS AND FORECASTS 2014-2023 ($ MILLION)
4.2.5.5.3. KEY PLAYERS & KEY PRODUCTS
4.2.5.5.4. KEY CONCLUSIONS
5. COMPETITIVE LANDSCAPE
5.1. KEY STRATEGIES
5.1.1. LIST OF MERGERS AND ACQUISITION
5.1.2. LIST OF JOINT VENTURES
5.1.3. LIST OF PRODUCT LAUNCHES
5.1.4. LIST OF PARTNERSHIPS
6. GEOGRAPHICAL ANALYSIS
6.1. DECISION SUPPORT DATABASE & ESTIMATION METHODOLOGY
6.2. COMPARATIVE ANALYSIS ACROSS MARKET SEGMENTS
6.3. OPPORTUNITY MATRIX
6.4. GLOBAL EMBEDDED DIE PACKAGING TECHNOLOG MARKET BY REGION 2014-2023 ($ MILLION)
6.4.1. NORTH AMERICA
6.4.1.1. INDUSTRY ANALYSIS 2014-2023 ($ MILLION)
6.4.1.2. TOP COUNTRY ANALYSIS
6.4.1.2.1. U.S.
6.4.1.2.1.1. MARKET ESTIMATIONS AND FORECASTS 2014-2023 ($ MILLION)
6.4.1.2.1.2. KEY PLAYERS & KEY PRODUCTS
6.4.1.2.1.3. KEY CONCLUSIONS
6.4.1.2.2. CANADA
6.4.1.2.2.1. MARKET ESTIMATIONS AND FORECASTS 2014-2023 ($ MILLION)
6.4.1.2.2.2. KEY PLAYERS & KEY PRODUCTS
6.4.1.2.2.3. KEY CONCLUSIONS
6.4.2. EUROPE
6.4.2.1. INDUSTRY ANALYSIS 2014-2023 ($ MILLION)
6.4.2.2. TOP COUNTRY ANALYSIS
6.4.2.2.1. UK
6.4.2.2.1.1. MARKET ESTIMATIONS AND FORECASTS 2014-2023 ($ MILLION)
6.4.2.2.1.2. KEY PLAYERS & KEY PRODUCTS
6.4.2.2.1.3. KEY CONCLUSIONS
6.4.2.2.2. FRANCE
6.4.2.2.2.1. MARKET ESTIMATIONS AND FORECASTS 2014-2023 ($ MILLION)
6.4.2.2.2.2. KEY PLAYERS & KEY PRODUCTS
6.4.2.2.2.3. KEY CONCLUSIONS
6.4.2.2.3. GERMANY
6.4.2.2.3.1. MARKET ESTIMATIONS AND FORECASTS 2014-2023 ($ MILLION)
6.4.2.2.3.2. KEY PLAYERS & KEY PRODUCTS
6.4.2.2.3.3. KEY CONCLUSIONS
6.4.2.2.4. SPAIN
6.4.2.2.4.1. MARKET ESTIMATIONS AND FORECASTS 2014-2023 ($ MILLION)
6.4.2.2.4.2. KEY PLAYERS & KEY PRODUCTS
6.4.2.2.4.3. KEY CONCLUSIONS
6.4.2.2.5. REST OF EUROPE
6.4.2.2.5.1. MARKET ESTIMATIONS AND FORECASTS 2014-2023 ($ MILLION)
6.4.2.2.5.2. KEY PLAYERS & KEY PRODUCTS
6.4.2.2.5.3. KEY CONCLUSIONS
6.4.3. ASIA PACIFIC
6.4.3.1. INDUSTRY ANALYSIS 2014-2023 ($ MILLION)
6.4.3.2. TOP COUNTRY ANALYSIS
6.4.3.2.1. CHINA
6.4.3.2.1.1. MARKET ESTIMATIONS AND FORECASTS 2014-2023 ($ MILLION)
6.4.3.2.1.2. KEY PLAYERS & KEY PRODUCTS
6.4.3.2.1.3. KEY CONCLUSIONS
6.4.3.2.2. INDIA
6.4.3.2.2.1. MARKET ESTIMATIONS AND FORECASTS 2014-2023 ($ MILLION)
6.4.3.2.2.2. KEY PLAYERS & KEY PRODUCTS
6.4.3.2.2.3. KEY CONCLUSIONS
6.4.3.2.3. JAPAN
6.4.3.2.3.1. MARKET ESTIMATIONS AND FORECASTS 2014-2023 ($ MILLION)
6.4.3.2.3.2. KEY PLAYERS & KEY PRODUCTS
6.4.3.2.3.3. KEY CONCLUSIONS
6.4.3.2.4. AUSTRALIA
6.4.3.2.4.1. MARKET ESTIMATIONS AND FORECASTS 2014-2023 ($ MILLION)
6.4.3.2.4.2. KEY PLAYERS & KEY PRODUCTS
6.4.3.2.4.3. KEY CONCLUSIONS
6.4.3.2.5. REST OF ASIA PACIFIC
6.4.3.2.5.1. MARKET ESTIMATIONS AND FORECASTS 2014-2023 ($ MILLION)
6.4.3.2.5.2. KEY PLAYERS & KEY PRODUCTS
6.4.3.2.5.3. KEY CONCLUSIONS
6.4.4. ROW
6.4.4.1. INDUSTRY ANALYSIS 2014-2023 ($ MILLION)
6.4.4.2. TOP COUNTRY ANALYSIS
6.4.4.2.1. LATIN AMERICA
6.4.4.2.1.1. MARKET ESTIMATIONS AND FORECASTS 2014-2023 ($ MILLION)
6.4.4.2.1.2. KEY PLAYERS & KEY PRODUCTS
6.4.4.2.1.3. KEY CONCLUSIONS
6.4.4.2.2. MIDDLE EAST & AFRICA
6.4.4.2.2.1. MARKET ESTIMATIONS AND FORECASTS 2014-2023 ($ MILLION)
6.4.4.2.2.2. KEY PLAYERS & KEY PRODUCTS
6.4.4.2.2.3. KEY CONCLUSIONS
7. COMPANY PROFILES
7.1. AMKOR TECHNOLOGY (U.S.)
7.1.1. OVERVIEW
7.1.2. PRODUCT PORTFOLIO
7.1.3. STRATEGIC INITIATIVES
7.1.4. SCOT ANALYSIS
7.1.5. STRATEGIC ANALYSIS
7.2. ASE GROUP (TAIWAN)
7.2.1. OVERVIEW
7.2.2. PRODUCT PORTFOLIO
7.2.3. STRATEGIC INITIATIVES
7.2.4. SCOT ANALYSIS
7.2.5. STRATEGIC ANALYSIS
7.3. AT & S (AUSTRIA)
7.3.1. OVERVIEW
7.3.2. PRODUCT PORTFOLIO
7.3.3. STRATEGIC INITIATIVES
7.3.4. SCOT ANALYSIS
7.3.5. STRATEGIC ANALYSIS
7.4. DOW CORNING CORPORATION(U.S.)
7.4.1. OVERVIEW
7.4.2. PRODUCT PORTFOLIO
7.4.3. STRATEGIC INITIATIVES
7.4.4. SCOT ANALYSIS
7.4.5. STRATEGIC ANALYSIS
7.5. EV GROUP (TAIWAN)
7.5.1. OVERVIEW
7.5.2. PRODUCT PORTFOLIO
7.5.3. STRATEGIC INITIATIVES
7.5.4. SCOT ANALYSIS
7.5.5. STRATEGIC ANALYSIS
7.6. FUJIKURA LTD. (JAPAN)
7.6.1. OVERVIEW
7.6.2. PRODUCT PORTFOLIO
7.6.3. STRATEGIC INITIATIVES
7.6.4. SCOT ANALYSIS
7.6.5. STRATEGIC ANALYSIS
7.7. GENERAL ELECTRIC CORPORATION (U.S.)
7.7.1. OVERVIEW
7.7.2. PRODUCT PORTFOLIO
7.7.3. STRATEGIC INITIATIVES
7.7.4. SCOT ANALYSIS
7.7.5. STRATEGIC ANALYSIS
7.8. INFINEON TECHNOLOGIES AS (GERMANY)
7.8.1. OVERVIEW
7.8.2. PRODUCT PORTFOLIO
7.8.3. STRATEGIC INITIATIVES
7.8.4. SCOT ANALYSIS
7.8.5. STRATEGIC ANALYSIS
7.9. MICROSEMI CORPORATION (U.S.)
7.9.1. OVERVIEW
7.9.2. PRODUCT PORTFOLIO
7.9.3. STRATEGIC INITIATIVES
7.9.4. SCOT ANALYSIS
7.9.5. STRATEGIC ANALYSIS
7.10. MICROVISION INC. (U.S.)
7.10.1. OVERVIEW
7.10.2. PRODUCT PORTFOLIO
7.10.3. STRATEGIC INITIATIVES
7.10.4. SCOT ANALYSIS
7.10.5. STRATEGIC ANALYSIS
7.11. SCHWEIZER ELECTRONICS AG (GERMANY)
7.11.1. OVERVIEW
7.11.2. PRODUCT PORTFOLIO
7.11.3. STRATEGIC INITIATIVES
7.11.4. SCOT ANALYSIS
7.11.5. STRATEGIC ANALYSIS
7.12. SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION (AUSTRIA)
7.12.1. OVERVIEW
7.12.2. PRODUCT PORTFOLIO
7.12.3. STRATEGIC INITIATIVES
7.12.4. SCOT ANALYSIS
7.12.5. STRATEGIC ANALYSIS
7.13. SUSS MICROTEC (GERMANY)
7.13.1. OVERVIEW
7.13.2. PRODUCT PORTFOLIO
7.13.3. STRATEGIC INITIATIVES
7.13.4. SCOT ANALYSIS
7.13.5. STRATEGIC ANALYSIS
7.14. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED (TAIWAN)
7.14.1. OVERVIEW
7.14.2. PRODUCT PORTFOLIO
7.14.3. STRATEGIC INITIATIVES
7.14.4. SCOT ANALYSIS
7.14.5. STRATEGIC ANALYSIS
7.15. TDK CORPORATION (JAPAN)
7.15.1. OVERVIEW
7.15.2. PRODUCT PORTFOLIO
7.15.3. STRATEGIC INITIATIVES
7.15.4. SCOT ANALYSIS
7.15.5. STRATEGIC ANALYSIS
LIST OF TABLES
GLOBAL EMBEDDED DIE PACKAGING TECHNOLOGY MARKET BY PLATFORM TYPE 2014-2023 ($ MILLION)
GLOBAL EMBEDDED DIE IN IC PACKAGE SUBSTRATE MARKET BY GEOGRAPHY 2014-2023 ($ MILLION)
GLOBAL EMBEDDED DIE IN RIGID BOARD MARKET BY GEOGRAPHY 2014-2023 ($ MILLION)
GLOBAL EMBEDDED DIE IN FLEXIBLE BOARD MARKET BY GEOGRAPHY 2014-2023 ($ MILLION)
GLOBAL EMBEDDED DIE PACKAGING TECHNOLOGY MARKET BY END USERS 2014-2023 ($ MILLION)
GLOBAL CONSUMER ELECTRONICSMARKET BY GEOGRAPHY 2014-2023 ($ MILLION)
GLOBAL IT & TELECOMMUNICATION MARKET BY GEOGRAPHY 2014-2023 ($ MILLION)
GLOBAL AUTOMOTIVE MARKET BY GEOGRAPHY 2014-2023 ($ MILLION)
GLOBAL HEALTHCARE MARKET BY GEOGRAPHY 2014-2023 ($ MILLION)
GLOBAL OTHER END USERS MARKET BY GEOGRAPHY 2014-2023 ($ MILLION)
NORTH AMERICA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET 2014-2023 ($ MILLION)
EUROPE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET 2014-2023 ($ MILLION)
ASIA PACIFIC EMBEDDED DIE PACKAGING TECHNOLOGY MARKET 2014-2023 ($ MILLION)
REST OF THE WORLD EMBEDDED DIE PACKAGING TECHNOLOGY MARKET 2014-2023 ($ MILLION)
LIST OF FIGURES
GLOBAL EMBEDDED DIE PACKAGING TECHNOLOGY MARKET 2014-2023 ($ MILLION)
GLOBAL EMBEDDED DIE IN IC PACKAGE SUBSTRATE MARKET 2014-2023 ($ MILLION)
GLOBAL EMBEDDED DIE IN RIGID BOARD MARKET 2014-2023 ($ MILLION)
GLOBAL EMBEDDED DIE IN FLEXIBLE BOARD MARKET 2014-2023 ($ MILLION)
GLOBAL CONSUMER ELECTRONICS MARKET 2014-2023 ($ MILLION)
GLOBAL IT & TELECOMMUNICATION MARKET 2014-2023 ($ MILLION)
GLOBAL AUTOMOTIVE MARKET 2014-2023 ($ MILLION)
GLOBAL HEALTHCARE MARKET 2014-2023 ($ MILLION)
GLOBAL OTHER END USERS MARKET 2014-2023 ($ MILLION)
UNITED STATES (U.S.) EMBEDDED DIE PACKAGING TECHNOLOGY MARKET 2014-2023 ($ MILLION)
CANADA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET 2014-2023 ($ MILLION)
UNITED KINGDOM (UK) EMBEDDED DIE PACKAGING TECHNOLOGY MARKET 2014-2023 ($ MILLION)
FRANCE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET 2014-2023 ($ MILLION)
GERMANY EMBEDDED DIE PACKAGING TECHNOLOGY MARKET 2014-2023 ($ MILLION)
SPAIN EMBEDDED DIE PACKAGING TECHNOLOGY MARKET 2014-2023 ($ MILLION)
ROE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET 2014-2023 ($ MILLION)
INDIA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET 2014-2023 ($ MILLION)
CHINA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET 2014-2023 ($ MILLION)
JAPAN EMBEDDED DIE PACKAGING TECHNOLOGY MARKET 2014-2023 ($ MILLION)
AUSTRALIA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET 2014-2023 ($ MILLION)
ROAPAC EMBEDDED DIE PACKAGING TECHNOLOGY MARKET 2014-2023 ($ MILLION)
LATIN AMERICA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET 2014-2023 ($ MILLION)
MENA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET 2014-2023 ($ MILLION)

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