Global Semiconductor Wafer Polishing and Grinding Equipment Market - Segmented by Equipment (Deposition, Lithography, and Ion Implant), End User (Foundries, Interlevel Dielectric Material (IDM), and Memory Manufacturers), and Geography - Growth, Trends, and Forecast (2018 - 2023)
The semiconductor wafer polishing and grinding equipment market is expected to register a CAGR of 6.68% over the forecast period (2018 - 2023).
The scope of the report, includes insights about several products offered by major players. The end-user segment, includes foundries, Interlevel Dielectric Material (IDM), and memory manufacturers. The regions included in this study are North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa.
Traditional polishing and grinding equipment are becoming obsolete, and vendors are anticipating one stop solutions that could slice, probe, and polish in a single assembly line, instead of using multiple machines that occupy a lot of land space and require high budget installation and heavy maintenance. Although such solutions are less prevalent in the market currently, they are expected to be the next generation of wafer polishing and grinding equipment, over the forecast period.
Increasing Demand from Third Party Vendors
In the current market scenario, semiconductor companies are increasingly leaning toward distinguishing their products in new ways. In order to achieve this, many wafer vendors are in direct contact with downstream players to avoid any intermediate players. This is the biggest factors that helps achieve this differentiation. Association of huge companies, like companies Google, Amazon, Tesla, Microsoft, and AMD, and several major foundries in the market indicates the shift in market trends.
This trend is increasingly creating demand for polishing and grinding services rather than creating a direct demand for the equipment. Companies are increasingly preferring to outsource theses polishing and grinding operations, rather than procuring high priced semiconductor wafer polishing and grinding equipment and setting up highly complicated manufacturing establishments for their operations. This scenario is creating a demand for semiconductor wafer polishing and grinding equipment immensely from the third party manufacturers, who aim to benefit from the outsourcing activities of the key companies. Although the demand for these equipment is expected to grow at a very slow pace, in case of key players, considerably moderate consumption is expected from the third-party players over the forecast period.
Key Developments in the Market