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Global Electronics Adhesives Market

Global Electronics Adhesives Market

The global electronic adhesives market is expected to be valued at USD XX million in 2016 and is likely to reach USD XX million by 2021, growing at an estimated CAGR of XX% during the forecast period, 2016-2021.

Electronic adhesives are widely used in the manufacture and assembly of electronic circuits and products. They are mostly used in bonding the surface-mount components, wire tacking, and encapsulating components. They help in the miniaturization of electronics components, and the longstanding trend of reducing the size of electronics is driving this market. In addition, the demand for these adhesives is increasing with the growing use of electronics in the automotive sector.

Market Dynamics

The market is mainly driven by factors such as increasing usage in automotive industry, growing demand in the electronics industry in Asia-Pacific, etc. The factors like volatility in raw material prices act as a restraint on the market growth, globally.

Market Segmentation

The market is divided based on the product type into electrically conductive, thermal conductive, UV curing and others. The UV-curing adhesives segment is expected to experience the fastest-growth during the forecast period, owing to the solvent-free and environment-friendly characteristics of the adhesives. Electrically conductive adhesives account for the highest share in the market, in terms of revenue, closely followed by thermally conductive adhesives. The global market share, by product type, in 2016, is shown below:


The market has been further divided geographically into Asia-Pacific, North America, South America, Europe and the Middle East & Africa. Asia-Pacific accounted for the highest share in the market, by revenue, in 2016 and is expected to witness the highest CAGR during the forecast period.

Opportunities and Major Players

The increasing new local players and growing technologies and innovative applications act as opportunities to the market. Few major players in the market are:

H B Fuller
Dow Chemicals
Key Deliverables in the Study

Market analysis for the global electronics adhesives market, with region-specific assessments and competition analysis on a global and regional scale.
Market definition along with the identification of factors instrumental in changing the market scenario and prospective opportunities.
Extensively researched competitive landscape section with profiles of major companies along with their market share.
Identification and analysis of the macro and micro factors that affect the global electronics adhesives market on both, global and regional scales.
A comprehensive list of key market players along with the analysis of their current strategic interests and key financial information.
Insights on the major countries/regions where this industry is growing and to identify the regions that are still untapped.

1. Introduction
1.1 Description
1.2 Research Methodology
1.3 Scope of the Report
2. Executive Summary
3. Market Insights
3.1 Current Market Scenario
3.2 Industry Value Chain Analysis
3.3 Industry Attractiveness – Porter’s Five Force Analysis
3.3.1 Bargaining Power of Suppliers
3.3.2 Bargaining Power of Consumers
3.3.3 Threat of New Entrants
3.3.4 Threat of Substitute Products and Services
3.3.5 Degree of Competition
4. Market Dynamics
4.1 Drivers
4.1.1 Increasing Use of Electronics in Automotive
4.1.2 Growing Demand for Miniaturized, Lightweight and Transparent electronics
4.1.3 Increasing Demand from the Electronics Industry in the Asia-Pacific Region
4.2 Restraints
4.2.1 Volatility in Availability and Price of Raw Material
4.2.2 Incompatible Electronic and Thermally Conductive Properties of These Adhesives in Some Applications
4.3 Opportunities
4.3.1 Expansion and Acquisition of Local Businesses
4.3.2 Development of New Products & Applications
5. Market Segmentation and Analysis
5.1 By Material Type
5.1.1 Acrylics
5.1.2 Epoxies
5.1.3 Polyurethanes
5.1.4 Silicones
5.1.5 Others
5.2 By Product Type
5.2.1 Electrically Conductive Adhesives
5.2.2 Thermally Conductive Adhesives
5.2.3 UV Curing Adhesives
5.2.4 Others
5.3 By Application
5.3.1 Surface Mounting
5.3.2 Conformal Coatings
5.3.3 Wire Tacking
5.3.4 Potting & Encapsulation
6. Regional Market Analysis (Market Size, Growth and Forecast)
6.1 Asia-Pacific
6.1.1 China
6.1.2 India
6.1.3 Japan
6.1.4 South Korea
6.1.5 ASEAN
6.1.6 Rest of Asia-Pacific
6.2 North America
6.2.1 United States
6.2.2 Canada
6.2.3 Mexico
6.2.4 Rest of North America
6.3 Europe
6.3.1 Germany
6.3.2 United Kingdom
6.3.3 Italy
6.3.4 France
6.3.5 Rest of Europe
6.4 South America
6.4.1 Brazil
6.4.2 Argentina
6.4.5 Rest of South America
6.5 Middle East & Africa
6.5.1 Saudi Arabia
6.5.2 South Africa
6.5.3 Rest of Middle East & Africa
7. Competitive Landscape
7.1 Mergers & Acquisitions
7.2 Joint Ventures, Collaborations and Agreements
7.3 Market Share Analysis
7.4 Strategies Adopted by Leading Players
8. Company Profiles (Overview, Products & Services, Financials, Recent Developments)
8.2 Covestro
8.3 3M Company
8.4 Bostik Sa
8.5 Avery Dennison Corporation
8.6 Dow Chemical Company
8.7 Royal Adhesives and Sealants
8.8 Sika Ag
8.9 Ashland Inc.
8.10 ITW Performance Polymers (Illinois Tool Works Inc.)
8.11 H.B. Fuller Company
8.12 RPM International Inc.
8.13 Adhesives Research Inc.
8.14 Beardow & Adams (Adhesives) Ltd.
8.15 Chemence Inc.
8.16 Henkel
8.17 Huntsman Corporation
8.18 Pidilite Industries
8.19 Mapei Spa
8.20 Super Glue Corporation
8.21 Heng Ying Adhesive Co., Ltd.
8.22 Ninghai Dingcheng Adhesive Co., Ltd.
8.23 American Biltrite, Inc.
9. Disclaimer

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