Global 3D TSV and 2.5D Market - Segmented by Technology (DDR2, DDR3, and DDR4), Application (Mobile Devices, Computing Devices, and Networking Devices), and Geography - Growth, Trends, and Forecast (2018 - 2023)
The global 3D TSV and 2.5D market is expected to project a growth rate of 35.2% during the forecast period (2018 - 2023).
Connected devices and other wireless technologies like Wi-Fi and Bluetooth, are some of the features integrated in smart gadgets and devices for communicating with other devices. Several integrated circuits need to be incorporated in a single chip module for reducing the board space and cost. Miniaturization of electronic devices and the rapid growth of smartphones and tablets are also expected to influence the demand of the market.
Expanding Market for Smartphones, Tablets, and Gaming Devices
Advanced transformations of the consumer electronics require manufacturers to improve the offerings in terms of design, processing power, power consumption, and user interface, frequently. Such upgrades in consumer electronics will require the use of robust technology. 3D TSV is the core of integrated chip packaging on a nanometer scale ensuring robust hardware for technology. Shipments of smartphones is expected to reach 2 billion units by 2020, majorly due to the availability of low-cost smartphones in developing nations, such as China and India.
Asia-Pacific to Occupy a Significant Market Share
Countries, like China, Japan, South Korea, Indonesia, Singapore, and Australia have recorded high levels of manufacturing in the consumer electronics, automotive, and transportation sectors, which a key source of demand for 3D TSV and 2.5D market in the region. The rising popularity of smartphones and demand for new memory technologies has increased the growth of computationally intensive consumer electronics, thereby creating a wide range of opportunities in this region. Asia-Pacific is one of the most active manufacturing hubs in the world.
Key Developments in the Market