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System in Package Market by Packaging Technology (2D IC, 2.5D IC, 3D IC), Package Type (BGA, SOP), Packaging Method (Flip Chip, Wire Bond), Device (RF Front-End, RF Amplifier), Application (Consumer Electronics, Communications) - Global Forecast to 2023

System in Package Market by Packaging Technology (2D IC, 2.5D IC, 3D IC), Package Type (BGA, SOP), Packaging Method (Flip Chip, Wire Bond), Device (RF Front-End, RF Amplifier), Application (Consumer Electronics, Communications) - Global Forecast to 2023

“System in package market expected to grow at a significant rate between 2017 and 2023”
The system in package market is expected to grow from USD 5.79 billion in 2017 to USD 9.07 billion by 2023, at a CAGR of 9.4% during 2017–2023. The key factors driving the growth of the system in package market are the development strategies such as product launches and developments, mergers and acquisitions, expansions, agreements, collaborations, joint ventures, and partnerships implemented by the players operating in the system in package market, growing demand for miniaturization of electronic devices, and impact of Internet of Things (IoT). However, the major restraining factors for the growth of this market is the higher level of integration that leads to thermal issues.

“3D IC expected to grow at the highest CAGR of the system in package market on the basis of packaging technology during the forecast period”
The 3D IC market is expected to grow at the highest CAGR during the forecast period. The compact structure of 3D IC packaging technology further increases its demand in various smart technologies. Moreover, the major factors driving the system in package market for 3D IC packaging technology include the highest interconnect density and greater space efficiencies in 3D IC compared with all other types of packaging technology such as 2D and 2.5 D.

“Consumer electronics application expected to hold the largest share of the overall system in package market in 2017”
Smartphones and tablets are observed to have the highest adoption among all the consumer electronic devices owing to their small form factor and better performance requirements to operate at a higher bandwidth. As a result, many ICs need to be incorporated into a single chip module for reducing the board space while considering cost and the overall time-to-market. In addition, consumer electronics products, such as mobile phones, tablets, netbook PCs, digital video cameras, and gaming controllers are adopting the advanced architecture. These products address features that increase the demand for miniaturized electronic devices with improved performance in consumer electronics. Owing to these factors, the consumer electronics application expected to hold the largest share of the overall system in package market in 2017.

“System in package market in APAC expected to hold the largest share in 2017”
The overall system in package market in APAC is expected to hold the largest share in 2017, and because of the presence of major IC packaging and wafer suppliers in this region. This makes the integration of 2D, 2.5D, and 3D IC packaging technology in APAC much easier.

The break-up of the profiles of primary participants for the report has been given below.
• By Company Type: Tier 1 = 45%, Tier 2 = 30%, and Tier 3 = 25%
• By Designation: C-Level Executives = 40% and Managers = 60%
• By Region: Americas = 35%, APAC = 45%, Europe = 15%, and RoW = 5%

ASE Group (Taiwan), Amkor Technology (US), SPIL (Taiwan), Powertech Technology (Taiwan), UTAC (Global A&T Electronics) (Singapore), Intel (US), Samsung Electronics (South Korea), JCET (China), Chipmos Technologies (Taiwan), Chipbond Technology (Taiwan), KYEC (Taiwan), Texas Instruments (US), Signetics (South Korea), Unisem (Malaysia), Carsem (Malaysia), FATC (Taiwan), Inari Amertron Berhad (Malaysia), Ardentec (Taiwan), Alchip (Taiwan), Hana-Micron (South Korea), OSE (Taiwan), Greatek Electronics (Taiwan), Tainshui Huatian Technology (China), AOI Electronics (Japan), Lingsen Precision Industry (Taiwan), Nepes (South Korea), Tongfu Microelectronics (China), and Sigurd Microelectronics (Taiwan) are the key players operating in the system in package market.

Research Coverage:
The research report on the system in package market covers the market segmented on the basis of the following segments: packaging technology, package type, packaging method, device, application, and geography. The market has been segmented on the basis of packaging technology into 2D, 2.5D, and 3D IC. Based on package type, the system in package market has been classified into ball grid array, surface mount package, pin grid array, flat package, and small outline package. The market has been segmented on the basis of packaging method into wire bond and die attach, flip chip, and fan-out wafer level packaging. Based on device, the system in package market has been classified into RF front-end, RF power amplifier, PMIC, MEMS, application processor, baseband processor, and others. The market on the basis of application has been segmented into consumer electronics, communications, automotive & transportation, industrial, aerospace & defense, healthcare, and emerging and others.

Key Benefits of Buying the Report:
Illustrative segmentation, analysis, and forecast for the market on the basis of packaging technology, package type, packaging method, device, application, and geography have been conducted to give the overall view of the system in package market.
The value chain analysis is provided to provide an in-depth insight into the system in package market.
The major drivers, restraints, opportunities, and challenges for the system in package market have been detailed in this report.
The report includes a detailed competitive landscape, in-depth DIVE analysis, and revenue of the key players.


  • INTRODUCTION
    • OBJECTIVES OF THE STUDY
    • DEFINITION
    • MARKET SEGMENTATION
      • MARKETS COVERED
      • GEOGRAPHIC SCOPE
      • YEARS CONSIDERED FOR THE STUDY
    • CURRENCY
    • LIMITATIONS
    • MARKET STAKEHOLDERS
  • RESEARCH METHODOLOGY
    • RESEARCH DATA
      • SECONDARY DATA
      • PRIMARY DATA
    • MARKET SIZE ESTIMATION
      • BOTTOM-UP APPROACH
      • TOP-DOWN APPROACH
    • MARKET BREAKDOWN AND DATA TRIANGULATION
    • RESEARCH ASSUMPTIONS
  • EXECUTIVE SUMMARY
  • PREMIUM INSIGHTS
    • ATTRACTIVE OPPORTUNITIES IN THE SIP MARKET
    • SIP MARKET, BY PACKAGING TECHNOLOGY
    • SIP MARKET, BY REGION AND APPLICATION
    • SIP MARKET, BY REGION
    • SIP MARKET SIZE, BY PACKAGING METHOD, 2017-2023
    • SIP MARKET, BY PACKAGE TYPE
  • MARKET OVERVIEW
    • INTRODUCTION
    • MARKET DYNAMICS
      • DRIVERS
        • Table RECENT IOT ACQUISITION
      • RESTRAINTS
      • OPPORTUNITIES
      • CHALLENGES
    • VALUE CHAIN ANALYSIS
    • COMPARISON OF TECHNOLOGY
      • BENCHMARKING OF SIP AND SOC
      • MARKET TRENDS FOR SIP
      • MARKET TRENDS FOR SOC
  • SIP MARKET, BY PACKAGING TECHNOLOGY
    • INTRODUCTION
      • Table SIP MARKET, BY PACKAGING TECHNOLOGY, 2015 2023 (USD MILLION)
    • 2D IC PACKAGING TECHNOLOGY
    • 2.5D IC PACKAGING TECHNOLOGY
    • 3D IC PACKAGING TECHNOLOGY
  • SIP MARKET, BY PACKAGE TYPE
    • INTRODUCTION
      • Table SIP MARKET, BY PACKAGE TYPE, 2015 2023 (USD MILLION)
    • BALL GRID ARRAY (BGA)
      • PLASTIC BALL GRID ARRAY (PBGA)
      • SUPER BALL GRID ARRAY (SBGA)
      • FINE PITCH BALL GRID ARRAY (FBGA)
      • FLIP CHIP BALL GRID ARRAY (FCBGA)
      • OTHERS
        • Table SIP MARKET FOR BGA, BY PACKAGE SUBTYPE, 2015 2023 (USD MILLION)
    • SURFACE MOUNT PACKAGE
      • LAND GRID ARRAY (LGA)
      • CERAMIC COLUMN GRID ARRAY (CCGA)
      • OTHERS
        • Table SIP MARKET FOR SMT, BY PACKAGE SUBTYPE, 2015 2023 (USD MILLION)
    • PIN GRID ARRAY (PGA)
      • FLIP CHIP PIN GRID ARRAY (PGA)
      • CERAMIC PIN GRID ARRAY (CPGA)
      • OTHERS
        • Table SIP MARKET FOR PGA, BY PACKAGE SUBTYPE, 2015 2023 (USD MILLION)
    • FLAT PACKAGE (FP)
      • QUAD FLAT NO-LEADS (QFN)
      • ULTRA THIN QUAD FLAT NO-LEADS (UTQFN)
      • OTHERS
        • Table SIP MARKET FOR FP, BY PACKAGE SUBTYPE, 2015 2023 (USD MILLION)
    • SMALL OUTLINE PACKAGE
      • THIN SMALL OUTLINE PACKAGE (TSOP)
      • THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
      • OTHERS
        • Table SIP MARKET FOR SOP, BY PACKAGE SUBTYPE, 2015 2023 (USD MILLION)
  • SIP MARKET, BY PACKAGING METHOD
    • INTRODUCTION
      • Table SIP MARKET, BY PACKAGING METHOD, 2015 2023 (USD MILLION)
    • WIRE BOND AND DIE ATTACH
      • Table SIP MARKET FOR WIRE BOND AND DIE ATTACH, BY DEVICE, 2015 2023 (USD MILLION)
    • FLIP CHIP
      • Table SIP MARKET FOR FLIP CHIP, BY DEVICE, 2015 2023 (USD MILLION)
    • FAN-OUT WAFER LEVEL PACKAGING (FOWLP)
      • Table SIP MARKET FOR FOWLP, BY DEVICE, 2015 2023 (USD MILLION)
    • COMPARISON OF WIRE BOND, FLIP CHIP, AND FOWLP PACKAGING METHODS
    • ADVANTAGES AND LIMITATIONS OF WIRE BOND, FLIP CHIP, AND FOWLP PACKAGING METHODS
    • TRENDS IN EACH PACKAGING METHOD
  • SIP MARKET, BY DEVICE
    • INTRODUCTION
      • Table SIP MARKET, BY DEVICE, 2015 2023 (BILLION UNITS)
      • Table SIP MARKET, BY DEVICE, 2015 2023 (USD MILLION)
    • POWER MANAGEMENT INTEGRATED CIRCUIT (PMIC)
      • Table SIP MARKET SIZE FOR PMIC, BY APPLICATION, 2015 2023 (USD MILLION)
      • Table SIP MARKET SIZE FOR PMIC, BY PACKAGING METHOD, 2015 2023 (USD MILLION)
    • MICROELECTROMECHANICAL SYSTEMS (MEMS)
      • Table SIP MARKET SIZE FOR MEMS, BY APPLICATION, 2015 2023 (USD MILLION)
      • Table SIP MARKET SIZE FOR MEMS, BY PACKAGING METHOD, 2015 2023 (USD MILLION)
    • RF FRONT-END
      • Table SIP MARKET SIZE FOR RF FRONT-END, BY APPLICATION, 2015 2023 (USD MILLION)
      • Table SIP MARKET SIZE FOR RF FRONT-END, BY PACKAGING METHOD, 2015 2023 (USD MILLION)
    • RF POWER AMPLIFIER
      • Table SIP MARKET SIZE FOR RF POWER AMPLIFIER, BY APPLICATION, 2015 2023 (USD MILLION)
      • Table SIP MARKET SIZE FOR RF POWER AMPLIFIER, BY PACKAGING METHOD, 2015 2023 (USD MILLION)
    • BASEBAND PROCESSOR
      • Table SIP MARKET SIZE FOR BASEBAND PROCESSOR, BY APPLICATION, 2015 2023 (USD MILLION)
      • Table SIP MARKET SIZE FOR BASEBAND PROCESSOR, BY PACKAGING METHOD, 2015 2023 (USD MILLION)
    • APPLICATION PROCESSOR
      • Table SIP MARKET SIZE FOR APPLICATION PROCESSOR, BY APPLICATION, 2015 2023 (USD MILLION)
      • Table SIP MARKET SIZE FOR APPLICATION PROCESSOR, BY PACKAGING METHOD, 2015 2023 (USD MILLION)
    • OTHERS
      • Table SIP MARKET SIZE FOR OTHERS, BY APPLICATION, 2015 2023 (USD MILLION)
      • Table SIP MARKET SIZE FOR OTHERS, BY PACKAGING METHOD, 2015 2023 (USD MILLION)
  • SIP MARKET, BY APPLICATION
    • INTRODUCTION
      • Table SIP MARKET, BY APPLICATION, 2015 2023 (USD MILLION)
    • CONSUMER ELECTRONICS
      • Table SIP MARKET FOR CONSUMER ELECTRONICS, BY DEVICE, 2015 2023 (USD MILLION)
      • Table SIP MARKET FOR CONSUMER ELECTRONICS, BY REGION, 2015 2023 (USD MILLION)
    • COMMUNICATIONS
      • Table SIP MARKET FOR COMMUNICATIONS, BY DEVICE, 2015 2023 (USD MILLION)
      • Table SIP MARKET FOR COMMUNICATIONS, BY REGION, 2015 2023 (USD MILLION)
    • INDUSTRIAL
      • Table SIP MARKET FOR INDUSTRIAL, BY DEVICE, 2015 2023 (USD MILLION)
      • Table SIP MARKET FOR INDUSTRIAL, BY REGION, 2015 2023 (USD MILLION)
    • AUTOMOTIVE & TRANSPORTATION
      • Table SIP MARKET FOR AUTOMOTIVE & TRANSPORTATION, BY DEVICE, 2015 2023 (USD MILLION)
      • Table SIP MARKET FOR AUTOMOTIVE & TRANSPORTATION, BY REGION, 2015 2023 (USD MILLION)
    • AEROSPACE & DEFENSE
      • Table SIP MARKET FOR AEROSPACE & DEFENSE, BY DEVICE, 2015 2023 (USD MILLION)
      • Table SIP MARKET FOR AEROSPACE & DEFENSE, BY REGION, 2015 2023 (USD MILLION)
    • HEALTHCARE
      • Table SIP MARKET FOR HEALTHCARE, BY DEVICE, 2015 2023 (USD MILLION)
      • Table SIP MARKET FOR HEALTHCARE, BY REGION, 2015 2023 (USD MILLION)
    • EMERGING & OTHERS
      • Table SIP MARKET FOR EMERGING & OTHERS, BY DEVICE, 2015 2023 (USD MILLION)
      • Table SIP MARKET FOR EMERGING & OTHERS, BY REGION, 2015 2023 (USD MILLION)
  • SIP MARKET, BY GEOGRAPHY
    • INTRODUCTION
      • Table SIP MARKET, BY GEOGRAPHY, 2015 2023 (USD MILLION)
    • APAC
      • Table SIP MARKET SIZE IN APAC, BY COUNTRY, 2015 2023 (USD MILLION)
      • Table SIP MARKET SIZE IN APAC, BY APPLICATION, 2015 2023 (USD MILLION)
      • CHINA AND TAIWAN
      • JAPAN
      • SOUTH KOREA
      • REST OF APAC
    • NORTH AMERICA
      • Table SIP MARKET SIZE IN NORTH AMERICA, BY COUNTRY, 2015 2023 (USD MILLION)
      • Table SIP MARKET SIZE IN NORTH AMERICA, BY APPLICATION, 2015 2023 (USD MILLION)
      • US
      • CANADA
      • MEXICO
    • EUROPE
      • Table SIP MARKET SIZE IN EUROPE, BY COUNTRY, 2015 2023 (USD MILLION)
      • Table SIP MARKET SIZE IN EUROPE, BY APPLICATION, 2015 2023 (USD MILLION)
      • GERMANY
      • FRANCE
      • REST OF EUROPE
    • ROW
      • Table SIP MARKET SIZE IN ROW, BY COUNTRY, 2015 2023 (USD MILLION)
      • Table SIP MARKET SIZE IN ROW, BY APPLICATION, 2015 2023 (USD MILLION)
      • MIDDLE EAST AND AFRICA
      • SOUTH AMERICA
  • COMPETITIVE LANDSCAPE
    • INTRODUCTION
    • RANKING ANALYSIS OF MARKET PLAYERS
      • Table RANKING OF TOP 5 PLAYERS IN THE SIP MARKET, 2016
    • COMPETITIVE SCENARIO
      • BATTLE FOR THE MARKET SHARE
      • PRODUCT LAUNCHES AND DEVELOPMENTS
        • Table 10 KEY PRODUCT LAUNCHES, PRODUCT DEVELOPMENTS, AND TECHNOLOGY DEVELOPMENTS
      • AGREEMENTS, COLLABORATIONS, PARTNERSHIPS, AND JOINT VENTURES
        • Table 10 KEY AGREEMENTS, COLLABORATIONS, PARTNERSHIPS, AND JOINT VENTURES
      • ACQUISITIONS AND EXPANSIONS
        • Table 5 KEY ACQUISITIONS AND EXPANSIONS
  • COMPANY PROFILES
    • AMKOR TECHNOLOGY
      • OVERVIEW
      • SERVICE OFFERED
      • STRENGTH OF SERVICE PORTFOLIO
      • BUSINESS STRATEGY EXCELLENCE
      • RECENT DEVELOPMENTS
      • KEY RELATIONSHIPS
    • ASE GROUP
      • OVERVIEW
      • SERVICE OFFERED
      • STRENGTH OF SERVICE PORTFOLIO
      • BUSINESS STRATEGY EXCELLENCE
      • RECENT DEVELOPMENTS
      • KEY RELATIONSHIPS
    • CHIPBOND TECHNOLOGY
      • OVERVIEW
      • SERVICE OFFERED
      • STRENGTH OF SERVICE PORTFOLIO
      • BUSINESS STRATEGY EXCELLENCE
      • RECENT DEVELOPMENTS
      • KEY RELATIONSHIPS
    • CHIPMOS TECHNOLOGIES
      • OVERVIEW
      • SERVICE OFFERED
      • STRENGTH OF SERVICE PORTFOLIO
      • BUSINESS STRATEGY EXCELLENCE
      • RECENT DEVELOPMENTS
    • FATC
      • OVERVIEW
      • SERVICE OFFERED
      • STRENGTH OF SERVICE PORTFOLIO
      • BUSINESS STRATEGY EXCELLENCE
    • INTEL
      • OVERVIEW
      • SERVICE OFFERED
      • STRENGTH OF SERVICE PORTFOLIO
      • BUSINESS STRATEGY EXCELLENCE
      • RECENT DEVELOPMENTS
      • KEY RELATIONSHIPS
    • JCET
      • OVERVIEW
      • SERVICE OFFERED
      • STRENGTH OF SERVICE PORTFOLIO
      • BUSINESS STRATEGY EXCELLENCE
      • RECENT DEVELOPMENTS
      • KEY RELATIONSHIPS
    • POWERTECH TECHNOLOGY
      • OVERVIEW
      • SERVICE OFFERED
      • STRENGTH OF SERVICE PORTFOLIO
      • BUSINESS STRATEGY EXCELLENCE
      • RECENT DEVELOPMENTS
      • KEY RELATIONSHIPS
    • SAMSUNG ELECTRONICS
      • OVERVIEW
      • SERVICE OFFERED
      • STRENGTH OF SERVICE PORTFOLIO
      • BUSINESS STRATEGY EXCELLENCE
      • RECENT DEVELOPMENTS
      • KEY RELATIONSHIPS
    • SPIL
      • OVERVIEW
      • SERVICE OFFERED
      • STRENGTH OF SERVICE PORTFOLIO
      • BUSINESS STRATEGY EXCELLENCE
      • RECENT DEVELOPMENTS
      • KEY RELATIONSHIPS
    • TEXAS INSTRUMENTS
      • OVERVIEW
      • STRENGTH OF SERVICE PORTFOLIO
      • BUSINESS STRATEGY EXCELLENCE
      • RECENT DEVELOPMENTS
      • KEY RELATIONSHIPS
    • UNISEM
      • OVERVIEW
      • SERVICE OFFERED
      • STRENGTH OF SERVICE PORTFOLIO
      • BUSINESS STRATEGY EXCELLENCE
    • UTAC (GLOBAL A&T ELECTRONICS)
      • OVERVIEW
      • SERVICE OFFERED
      • STRENGTH OF SERVICE PORTFOLIO
      • BUSINESS STRATEGY EXCELLENCE
      • RECENT DEVELOPMENTS
      • KEY RELATIONSHIPS
  • APPENDIX
    • DISCUSSION GUIDE
    • KNOWLEDGE STORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
    • INTRODUCING RT: REAL-TIME MARKET INTELLIGENCE
    • AVAILABLE CUSTOMIZATIONS
    • RELATED REPORTS
    • AUTHOR DETAILS

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