Silicon on Insulator (SOI) Market by Wafer Size (200 mm and less than 200 mm, 300 mm), Wafer type (RF-SOI, FD-SOI, PD-SOI, Power SOI, Emerging-SOI), Application (Consumer Electronics, Automotive, Datacom, Industrial), Technology - Global Forecast to 2023
“The silicon on insulator (SOI) market is estimated to grow at a CAGR of 21.7% between 2018 and 2023”
The overall SOI market is expected to reach USD 1,832.5 million by 2023 from USD 686.0 million by 2018, at a CAGR of 21.7% during 2018–2023. The increasing use of SOI wafers in consumer electronic devices and effective use of silicon during the manufacture of thin SOI wafers are the key factors contributing to the growth of the SOI market. However, lack of intellectual property (IP) ecosystem is a key restraint for the growth of the SOI market. Growing IC industry and expansion of SOI ecosystem in APAC and increasing use of SOI in IOT are the major opportunities for the studied market.
“The market for FD-SOI is expected to grow at the highest CAGR during the forecast period”
Among the wafer types of SOI, the market for FD-SOI is expected to grow at the highest CAGR during the forecast period. This growth is mainly attributed to the developments such as the introduction of FD-SOI based 12FDX by GlobalFoundries (US) and features offered by FD-SOI wafers such as ultralow voltage operation and high-performance mixed-signal integration.
“The SOI market in APAC is expected to grow at the highest CAGR during the forecast period”
APAC is expected to be the fastest-growing market for SOI during the forecast period owing to the expansion of SOI ecosystem in the region. Moreover, the adoption of SOI wafer-based products in consumer electronic, datacom and telecom, and automotive applications is expected to boost the growth of the SOI market in APAC.
In the process of determining and verifying the market size for several segments and subsegments gathered through secondary research, extensive primary interviews have been conducted with key industry experts. The breakup of the profiles of primary participants has been given below:
By Company Type: Tier 1—30%, Tier 2—45%, and Tier 3—25%
By Designation: Managers—65% and C-Level—35%
By Region: Europe—40%, Americas—27%, and APAC—33%
Key market players profiled in this report are as follows:
Shin-Etsu Chemical (Japan)
STMicroelectronics N.V. (Switzerland)
NXP Semiconductor N.V. (Netherlands)
Murata Manufacturing (Japan)
The report on the SOI market covers the market segmented on the basis of the following segments: wafer size, wafer type, technology, application, product, and geography. The market has been segmented on the basis of wafer size into 200 mm and less than 200 mm, and 300 mm. Based on wafer type, the SOI market has been classified into RF-SOI, PD-SOI, FD-SOI, Power-SOI, and emerging-SOI. Based on technology, the SOI market has been classified into smart cut, bonding, and layer transfer. The market has been segmented on the basis of application, the SOI market has been classified into automotive; consumer electronics; datacom and telecom; military, defense, & aerospace; and industrial. The market has been segmented on the basis of product, RF FEM, MEMS, power, optical communication, and image sensing. The market, on the basis of geography, has been segmented into North America, Europe, and APAC.
Key Benefits of Buying the Report:
Illustrative segmentation, analysis, and forecast for the market on the basis of wafer size, wafer type, technology, application, product, and geography have been conducted to give the overall view of the SOI market.
The value chain analysis is provided to provide an in-depth insight into the SOI market.
Major drivers, restraints, opportunities, and challenges for the SOI market have been detailed in this report.
The report includes a detailed competitive landscape and revenue of the key players.
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