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Molded Interconnect Device (MID) Market by Process (LDS, 2-Shot Molding, Film Techniques), Product (Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting), Industry, and Geography - Global Forecast to 2023

Molded Interconnect Device (MID) Market by Process (LDS, 2-Shot Molding, Film Techniques), Product (Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting), Industry, and Geography - Global Forecast to 2023

MID market to grow at significant rate during 2018-2023
The MID market is expected to reach USD 1,798.3 million by 2023 from USD 894.1 million in 2018, at a CAGR of 15.0% from 2018 to 2023. Key factors driving the growth of the MID market include the increasing use of MID in medical devices, rising demand for miniaturization in the consumer electronics industry, and growing need to reduce e-waste. However, the technological monopoly of LDS equipment manufacturer is a major factor restraining the growth of the market.

Sensors to boost MID market growth during forecast period
MIDs are used in sensors for a variety of industrial and automotive applications. Industrial applications include temperature sensors, motion sensors, pressure sensors, and flow sensors, among others. In automotive, MID-based sensors are used in adaptive cruise control system, central locking, and climate control applications. MID miniaturizes devices, which helps reduce the weight of the overall sensor system and increases functionality, resulting in low-cost end-use devices. The use of MID will increase in sensors, which will further drive the MID market growth in the coming years.

Asia Pacific to account for largest size of MID market during forecast period
APAC is expected to offer lucrative opportunities for the MID market growth owing to the growing base for communication infrastructure, communication devices, and consumer electronics. APAC is one of the key regions for players dealing with smartphones and wearable devices. The trend of miniaturization of components in smartphones and wearables will drive the MID market in this region. This region is expected to witness mass commercialization of 5G by 2020.

Following is the breakup of the profiles of primary participants for the report:
By Company Type: Tier 1 - 20%, Tier 2 - 55%, and Tier 3 - 25%
By Designation: C-Level Executives - 45%, Directors - 30%, and Others - 25%
By Region: North America - 45%, Europe - 30%, APAC - 20%, and RoW - 5%

Key players operating in the MID market are Molex (US), LPKF (Germany), TE Connectivity (Switzerland), HARTING (Germany), APC (US), JOHNAN (Japan), MID Solutions (Germany), 2E mechatronic (Germany), and Multiple Dimensions (Switzerland).

Research Coverage
This research report categorizes the MID market by process, product type, industry, and geography. By process, the market has been segmented into LDS, 2-shot molding, and film techniques. By product type, the MID market has been classified into antennae & connectivity modules, connectors & switches, sensors, lighting, and others. By industry, the market has been segmented into telecommunications, consumer electronics, automotive, medical, and industrial. Moreover, the report covers the market in 4 major regions—North America, Europe, APAC, and RoW.

Key Benefits of Buying This Report
Illustrative segmentation, analysis, and forecast for the market based on process, product type, industry, and geography have been conducted to give an overall view of the MID market.
Major drivers, restraints, opportunities, and challenges pertaining to the MID market have been detailed in this report.
A detailed competitive landscape, including the revenues of key players, has been presented.


  • INTRODUCTION
    • STUDY OBJECTIVES
    • DEFINITION
    • STUDY SCOPE
      • YEARS CONSIDERED FOR STUDY
    • CURRENCY
    • STAKEHOLDERS
  • RESEARCH METHODOLOGY
    • RESEARCH DATA
      • SECONDARY DATA
      • PRIMARY DATA
    • MARKET SIZE ESTIMATION
      • BOTTOM-UP APPROACH
      • TOP-DOWN APPROACH
    • MARKET BREAKDOWN AND DATA TRIANGULATION
    • RESEARCH ASSUMPTIONS
  • EXECUTIVE SUMMARY
  • PREMIUM INSIGHT
    • ATTRACTIVE OPPORTUNITIES FOR MOLDED INTERCONNECT DEVICE MARKET GROWTH
    • MOLDED INTERCONNECT DEVICE MARKET FOR CONSUMER ELECTRONICS INDUSTRY, BY PRODUCT TYPE
    • MOLDED INTERCONNECT DEVICE MARKET FOR ANTENNAE AND CONNECTIVITY MODULES, BY INDUSTRY
    • MOLDED INTERCONNECT DEVICE MARKET IN EUROPE, BY PROCESS
    • MOLDED INTERCONNECT DEVICE MARKET, BY REGION
  • MARKET OVERVIEW
    • INTRODUCTION
    • MARKET DYNAMICS
      • DRIVERS
      • RESTRAINTS
      • OPPORTUNITIES
      • CHALLENGES
  • INDUSTRY TRENDS
    • INTRODUCTION
    • IN-MOLD ELECTRONICS (IME)
      • APPLICATIONS
      • BUILDING BLOCKS
  • MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS
    • INTRODUCTION
      • Table MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS, 2015-2023 (USD MILLION)
    • LASER DIRECT STRUCTURING
    • 2-SHOT MOLDING
    • FILM TECHNIQUES
  • MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE
    • INTRODUCTION
      • Table MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE, 2015-2023 (USD MILLION)
    • ANTENNAE AND CONNECTIVITY MODULES
      • Table MOLDED INTERCONNECT DEVICE MARKET FOR ANTENNAE AND CONNECTIVITY MODULES, BY INDUSTRY, 2015-2023 (USD MILLION)
    • SENSORS
      • Table MOLDED INTERCONNECT DEVICE MARKET FOR SENSORS, BY INDUSTRY, 2015-2023 (USD MILLION)
    • CONNECTORS AND SWITCHES
      • Table MOLDED INTERCONNECT DEVICE MARKET FOR CONNECTORS AND SWITCHES, BY INDUSTRY, 2015-2023 (USD MILLION)
    • LIGHTING
      • Table MOLDED INTERCONNECT DEVICE MARKET FOR LIGHTING, BY INDUSTRY, 2015-2023 (USD MILLION)
    • OTHERS
      • Table MOLDED INTERCONNECT DEVICE MARKET FOR OTHERS, BY INDUSTRY, 2015-2023 (USD MILLION)
  • MOLDED INTERCONNECT DEVICE MARKET, BY INDUSTRY
    • INTRODUCTION
      • Table MOLDED INTERCONNECT DEVICE MARKET, BY INDUSTRY, 2015-2023 (USD MILLION)
    • TELECOMMUNICATIONS
      • Table MOLDED INTERCONNECT DEVICE MARKET FOR TELECOMMUNICATIONS, BY PRODUCT TYPE, 2015-2023 (USD MILLION)
    • CONSUMER ELECTRONICS
      • Table MOLDED INTERCONNECT DEVICE MARKET FOR CONSUMER ELECTRONICS, BY PRODUCT TYPE, 2015-2023 (USD MILLION)
    • AUTOMOTIVE
      • Table MOLDED INTERCONNECT DEVICE MARKET FOR AUTOMOTIVE, BY PRODUCT TYPE, 2015-2023 (USD MILLION)
    • MEDICAL
      • Table MOLDED INTERCONNECT DEVICE MARKET FOR MEDICAL, BY PRODUCT TYPE, 2015-2023 (USD MILLION)
    • INDUSTRIAL
      • Table MOLDED INTERCONNECT DEVICE MARKET FOR INDUSTRIAL, BY PRODUCT TYPE, 2015-2023 (USD MILLION)
  • GEOGRAPHIC ANALYSIS
    • INTRODUCTION
      • Table MOLDED INTERCONNECT DEVICE MARKET, BY REGION, 2015-2023 (USD MILLION)
    • NORTH AMERICA
      • Table MOLDED INTERCONNECT DEVICE MARKET IN NORTH AMERICA, BY COUNTRY, 2015-2023 (USD MILLION)
      • Table MOLDED INTERCONNECT DEVICE MARKET IN NORTH AMERICA, BY PROCESS, 2015-2023 (USD MILLION)
      • Table MOLDED INTERCONNECT DEVICE MARKET IN NORTH AMERICA, BY INDUSTRY, 2015-2023 (USD MILLION)
      • US
      • CANADA
    • EUROPE
      • Table MOLDED INTERCONNECT DEVICE MARKET IN EUROPE, BY COUNTRY, 2015-2023 (USD MILLION)
      • Table MOLDED INTERCONNECT DEVICE MARKET IN EUROPE, BY PROCESS, 2015-2023 (USD MILLION)
      • Table MOLDED INTERCONNECT DEVICE MARKET IN EUROPE, BY INDUSTRY, 2015-2023 (USD MILLION)
      • GERMANY
      • SWITZERLAND
      • FRANCE
      • REST OF EUROPE
    • ASIA PACIFIC (APAC)
      • Table MOLDED INTERCONNECT DEVICE MARKET IN APAC, BY COUNTRY, 2015-2023 (USD MILLION)
      • Table MOLDED INTERCONNECT DEVICE MARKET IN APAC, BY PROCESS, 2015-2023 (USD MILLION)
      • Table MOLDED INTERCONNECT DEVICE MARKET IN APAC, BY INDUSTRY, 2015-2023 (USD MILLION)
      • CHINA
      • JAPAN
      • SOUTH KOREA
      • REST OF APAC
    • REST OF THE WORLD (ROW)
      • Table MOLDED INTERCONNECT DEVICE MARKET IN ROW, BY REGION, 2015-2023 (USD MILLION)
      • Table MOLDED INTERCONNECT DEVICE MARKET IN ROW, BY PROCESS, 2015-2023 (USD MILLION)
      • Table MOLDED INTERCONNECT DEVICE MARKET IN ROW, BY INDUSTRY, 2015-2023 (USD MILLION)
      • SOUTH AMERICA
      • MIDDLE EAST AND AFRICA
  • COMPETITIVE LANDSCAPE
    • INTRODUCTION
    • MARKET PLAYER RANKING ANALYSIS
      • Table RANKING OF KEY PLAYERS IN MOLDED INTERCONNECT DEVICE MARKET (2017)
    • COMPETITIVE SITUATIONS AND TRENDS
      • EXPANSIONS
        • Table EXPANSIONS 2017-2018
      • MERGER AND ACQUISITIONS
        • Table MERGER AND ACQUISITIONS, 2015-2017
      • PRODUCT DEVELOPMENT
        • Table PRODUCT DEVELOPMENT, 2017
      • AGREEMENT
        • Table AGREEMENT, 2017
  • COMPANY PROFILES
    • INTRODUCTION
    • KEY PLAYERS
      • MOLEX
      • LPKF LASER & ELECTRONICS
      • TE CONNECTIVITY
      • HARTING
      • ARLINGTON PLATING COMPANY
      • JOHNAN
      • MID SOLUTIONS
      • 2E MECHATRONIC
      • MULTIPLE DIMENSIONS
    • OTHER IMPORTANT PLAYERS
      • LASER MICRONICS
      • TEPROSA
      • AXON CABLE
      • S2P
      • SUZHOU CICOR TECHNOLOGY CO. LTD
      • IME VENDORS
  • APPENDIX
    • INSIGHTS OF INDUSTRY EXPERTS
    • DISCUSSION GUIDE
    • KNOWLEDGE STORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
    • AVAILABLE CUSTOMIZATIONS
    • RELATED REPORTS
    • AUTHOR DETAILS

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