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3D IC and 2.5D IC Packaging Market by Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power), Packaging Technology (3D Wafer-Level Chip-Scale Packaging, 3D TSV, 2.5D), End-User Industry, and Region - Global Forecast to 2022

3D IC and 2.5D IC Packaging Market by Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power), Packaging Technology (3D Wafer-Level Chip-Scale Packaging, 3D TSV, 2.5D), End-User Industry, and Region - Global Forecast to 2022

“3D IC and 2.5D IC packaging market is projected to grow at a CAGR of 38.30% between 2016 and 2022”
The 3D IC and 2.5D IC packaging market has entered the growth phase and is expected to grow further in the coming years. The market is expected to be worth USD 170.46 billion in 2022, at a CAGR of 38.30% between 2016 and 2022. The drivers for this market are the increasing need for advanced architecture in electronic products, rising trend of miniaturization of electronic devices, and growing market for tablets, smartphones, and gaming devices. The main restraint for this market is created by the thermal issues caused by higher levels of integration.

“3D TSV in 3D IC and 2.5D IC packaging market is estimated to grow at the highest CAGR during the forecast period”
The 3D TSV market is expected to grow at the highest CAGR during the forecast period. The major factors driving the 3D IC and 2.5D IC packaging market for 3D TSV include highest interconnect density and greater space efficiencies in 3D TSV compared to all other types of advanced packaging such as 3D WLCSP and 2.5 D.

“Logic market held the largest share of the 3D IC and 2.5D IC packaging market in 2015”
The demand for 3D IC and 2.5D IC packages in logic is growing because of the high product availability. An increasing number of manufacturers in this market offer innovative products with advanced packaging. For instance, Intel Corp. (U.S.) is driving the market for advanced packaging in field programmable gate arrays (FPGA). Global companies started introducing 3D logic ICs in different programmable logics to ensure operational efficiency with added convenience and increased productivity.

“APAC is expected to be the fastest-growing market for 3D IC and 2.5D IC packaging during the forecast period”
The market in APAC is expected to grow at the highest CAGR because there is a high demand for 3D IC and 2.5D IC packaging technology from the growing consumer electronics sector in this region, particularly for smartphones and tablets. The presence of major 3D IC and 2.5D IC packaging manufacturers and suppliers in this region helps to decrease the time to market for 3D IC and 2.5D IC packaging products. This makes the integration of 3D IC and 2.5D IC packaging technology in the APAC region much easier.

Breakdown of profile of primary participants:
By Company: Tier 1 - 45 %, Tier 2 - 32%, and Tier 3 - 23%
By Designation: C-Level Executives - 25%, Directors - 32%, and Others - 43%
By Region: North America - 25%, Europe - 37%, APAC - 28%, and RoW - 10%

The major players profiled in this report include:
Taiwan Semiconductor Manufacturing Company Limited (Taiwan)
Samsung Electronics Co., Ltd. (South Korea)
Toshiba Corp. (Japan)
Pure Storage Inc. (U.S.)
ASE Group (Taiwan)
Amkor Technology (U.S.)
United Microelectronics Corp. (Taiwan)
STMicroelectronics NV (Switzerland)
Broadcom Ltd. (Singapore)
Intel Corporation. (U.S.)
Jiangsu Changing Electronics Technology Co., Ltd. (China)

Research Coverage
The study segments in the 3D IC and 2.5D IC packages market report are packaging technology which includes 3D wafer-level chip-scale packaging (WLCSP), 3D TSV, and 2.5D; application which includes logic, imaging and optoelectronics, memory, MEMS/sensors, LED, power, analog and mixed signal, RF, and photonics. The study also covers end-user industry and geographic forecast of the market size for various segments with regard to four main regions, namely, Asia-Pacific, North America, Europe, and RoW.
Reasons to buy the report
The report would help the market leaders/new entrants in this market in the following ways:
1. This report segments the 3D IC and 2.5D IC packages market comprehensively and provides the closest approximations of the overall market size and those of the subsegments across different applications and regions.
2. The report helps stakeholders to understand the pulse of the market and provides them information on key market drivers, restraints, challenges, and opportunities.
3. This report would help stakeholders to understand their competitors better and gain more insights to enhance their position in the business. The competitive landscape section includes competitor ecosystem, new product developments, partnerships, and mergers and acquisitions in the market.


  • INTRODUCTION
    • OBJECTIVES OF THE STUDY
    • MARKET DEFINITION
    • STUDY SCOPE
      • MARKETS COVERED
      • YEARS CONSIDERED FOR THE STUDY
    • CURRENCY
    • LIMITATIONS
    • STAKEHOLDERS
  • RESEARCH METHODOLOGY
    • RESEARCH DATA
      • SECONDARY DATA
      • PRIMARY DATA
      • SECONDARY AND PRIMARY RESEARCH
    • MARKET SIZE ESTIMATION
    • BOTTOM-UP APPROACH
    • APPROACH FOR CAPTURING THE MARKET SHARE BY BOTTOM-UP ANALYSIS (DEMAND SIDE)
    • TOP-DOWN APPROACH
      • APPROACH FOR CAPTURING THE MARKET SHARE BY TOP-DOWN ANALYSIS (SUPPLY SIDE)
    • MARKET BREAKDOWN AND DATA TRIANGULATION
    • RESEARCH ASSUMPTIONS
  • EXECUTIVE SUMMARY
  • PREMIUM INSIGHTS
    • 3D IC AND 2.5D IC PACKAGING MARKET OPPORTUNITIES
    • 3D IC AND 2.5D IC PACKAGING MARKET FOR MEMORY APPLICATION, BY END-USER INDUSTRY
    • CONSUMER ELECTRONICS 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY
    • GEOGRAPHIC SNAPSHOT OF THE 3D IC AND 2.5D IC PACKAGING MARKET
    • 3D IC AND 2.5D IC PACKAGING MARKET IN APAC, BY COUNTRY
  • MARKET OVERVIEW
    • INTRODUCTION
    • MARKET SEGMENTATION
      • BY PACKAGING TECHNOLOGY
      • BY APPLICATION
      • BY END-USER INDUSTRY
      • BY REGION
    • MARKET DYNAMICS
      • DRIVERS
      • RESTRAINTS
      • OPPORTUNITIES
      • CHALLENGES
  • INDUSTRY TRENDS
    • INTRODUCTION
    • SUPPLY CHAIN ANALYSIS
    • TECHNOLOGY TRENDS
    • PORTER'S FIVE FORCES ANALYSIS
      • THREAT OF NEW ENTRANTS
      • THREAT 0F SUBSTITUTES
      • BARGAINING POWER OF BUYERS
      • BARGAINING POWER OF SUPPLIERS
      • INTENSITY OF COMPETITIVE RIVALRY
  • MARKET, BY PACKAGING TECHNOLOGY
    • INTRODUCTION
      • Table 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION)
    • 3D WAFER-LEVEL CHIP-SCALE PACKAGING (WLCSP)
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR 3D WLCSP, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
    • 3D TSV
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR 3D TSV, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
    • 2.5D
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR 2.5D, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
  • MARKET, BY APPLICATION
    • INTRODUCTION
      • Table 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2013-2022 (USD MILLION)
      • Table 3D IC AND 2.5D IC WAFER (12" EQ.) MARKET, BY APPLICATION, 2013-2022 (THOUSAND UNITS)
    • LOGIC
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR LOGIC APPLICATION, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
    • IMAGING & OPTOELECTRONICS
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR IMAGING & OPTOELECTRONICS APPLICATION, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
    • MEMORY
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR MEMORY, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
    • MEMS/SENSORS
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR MEMS/SENSORS, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
    • LED
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR LED, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
    • POWER, ANALOG & MIXED SIGNAL, RF, PHOTONICS
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR POWER, ANALOG & MIXED SIGNAL, RF, PHOTONICS, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
  • MARKET, BY END-USER INDUSTRY
    • INTRODUCTION
      • Table 3D IC AND 2.5D IC PACKAGING MARKET, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
    • CONSUMER ELECTRONICS
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR CONSUMER ELECTRONICS, BY APPLICATION, 2013-2022 (USD MILLION)
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR CONSUMER ELECTRONICS, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION)
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR CONSUMER ELECTRONICS, BY REGION, 2013-2022 (USD MILLION)
    • TELECOMMUNICATION
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION, BY APPLICATION, 2013-2022 (USD MILLION)
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION)
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION, BY REGION, 2013-2022 (USD MILLION)
    • INDUSTRIAL SECTOR
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR INDUSTRIAL SECTOR, BY APPLICATION, 2013-2022 (USD MILLION)
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR INDUSTRIAL SECTOR, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION)
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR INDUSTRIAL SECTOR, BY REGION, 2013-2022 (USD MILLION)
    • AUTOMOTIVE
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR AUTOMOTIVE, BY APPLICATION, 2013-2022 (USD MILLION)
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR AUTOMOTIVE, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION)
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR AUTOMOTIVE, BY REGION, 2013-2022 (USD MILLION)
    • MILITARY & AEROSPACE
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR MILITARY & AEROSPACE, BY APPLICATION, 2013-2022 (USD MILLION)
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR MILITARY & AEROSPACE, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION)
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR MILITARY & AEROSPACE, BY REGION, 2013-2022 (USD MILLION)
    • SMART TECHNOLOGIES
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FO R SMART TECHNOLOGIES, BY APPLICATION, 2013-2022 (USD MILLION)
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR SMART TECHNOLOGIES, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION)
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR SMART TECHNOLOGIES, BY REGION, 2013-2022 (USD MILLION)
    • MEDICAL DEVICES
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR MEDICAL DEVICES, BY APPLICATION, 2013-2022 (USD MILLION)
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR MEDICAL DEVICES, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION)
      • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR MEDICAL DEVICES, BY REGION, 2013-2022 (USD MILLION)
  • GEOGRAPHIC ANALYSIS
    • INTRODUCTION
      • Table 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2013-2022 (USD MILLION)
    • APAC
      • CHINA
      • JAPAN
      • TAIWAN
      • SOUTH KOREA
      • REST OF APAC
        • Table 3D IC AND 2.5D IC PACKAGING MARKET IN APAC, BY COUNTRY, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET IN APAC, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR CONSUMER ELECTRONICS IN APAC, BY COUNTRY, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION IN APAC, BY COUNTRY, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR INDUSTRIAL SECTOR IN APAC, BY COUNTRY, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR AUTOMOTIVE IN APAC, BY COUNTRY, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR MILITARY & AEROSPACE IN APAC, BY COUNTRY, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR SMART TECHNOLOGIES IN APAC, BY COUNTRY, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR MEDICAL DEVICES IN APAC, BY COUNTRY, 2013-2022 (USD MILLION)
    • NORTH AMERICA
      • Table 3D IC AND 2.5D IC PACKAGING MARKET IN NORTH AMERICA, BY COUNTRY, 2013-2022 (USD MILLION)
      • Table 3D IC AND 2.5D IC PACKAGING MARKET IN NORTH AMERICA, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
      • U.S.
      • CANADA
      • MEXICO
        • Table CONSUMER ELECTRONICS 3D IC AND 2.5D IC PACKAGING MARKET IN NORTH AMERICA, BY COUNTRY, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION IN NORTH AMERICA, BY COUNTRY, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR INDUSTRIAL SECTOR IN NORTH AMERICA, BY COUNTRY, 2013-2022 (USD MILLION)
        • Table AUTOMOTIVE 3D IC AND 2.5D IC PACKAGING MARKET IN NORTH AMERICA, BY COUNTRY, 2013-2022 (USD MILLION)
        • Table MILITARY & AEROSPACE 3D IC AND 2.5D IC PACKAGING MARKET IN NORTH AMERICA, BY COUNTRY, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR SMART TECHNOLOGIES IN CANADA EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR SMART TECHNOLOGIES IN NORTH AMERICA, BY COUNTRY, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR MEDICAL DEVICES IN NORTH AMERICA, BY COUNTRY, 2013-2022 (USD MILLION)
    • EUROPE
      • Table 3D IC AND 2.5D IC PACKAGING MARKET IN EUROPE, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
      • Table 3D IC AND 2.5D IC PACKAGING MARKET IN EUROPE, BY COUNTRY, 2013-2022 (USD MILLION)
      • U.K.
      • GERMANY
      • FRANCE
      • REST OF EUROPE
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR CONSUMER ELECTRONICS IN EUROPE, BY COUNTRY, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION IN EUROPE, BY COUNTRY, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET IN EUROPE FOR INDUSTRIAL SECTOR, BY COUNTRY, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR AUTOMOTIVE IN EUROPE, BY COUNTRY, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR MILITARY & AEROSPACE IN EUROPE, BY COUNTRY, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR SMART TECHNOLOGIES IN EUROPE, BY COUNTRY, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR MEDICAL DEVICES IN EUROPE, BY COUNTRY, 2013-2022 (USD MILLION)
    • REST OF THE WORLD
      • MIDDLE EAST & AFRICA
      • SOUTH AMERICA
        • Table 3D IC AND 2.5D IC PACKAGING MARKET IN ROW, BY REGION, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET IN ROW, BY END-USER INDUSTRY, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR CONSUMER ELECTRONICS IN ROW, BY REGION, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR TELECOMMUNICATION IN ROW, BY REGION, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR INDUSTRIAL SECTOR IN ROW, BY REGION, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR AUTOMOTIVE IN ROW, BY REGION, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR MILITARY & AEROSPACE IN ROW, BY REGION, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR SMART TECHNOLOGIES IN ROW, BY REGION, 2013-2022 (USD MILLION)
        • Table 3D IC AND 2.5D IC PACKAGING MARKET FOR MEDICAL DEVICES IN ROW, BY REGION, 2013-2022 (USD MILLION)
  • COMPETITIVE LANDSCAPE
    • OVERVIEW
    • KEY PLAYERS IN THE 3D IC AND 2.5D IC PACKAGING MARKET
    • COMPETITIVE SITUATIONS AND TRENDS
      • PARTNERSHIPS, AGREEMENTS, JOINT VENTURES, AND COLLABORATIONS
        • Table PARTNERSHIPS, AGREEMENTS, JOINT VENTURES, AND COLLABORATIONS (2014-2016)
      • NEW PRODUCT LAUNCHES AND DEVELOPMENTS
        • Table NEW PRODUCT LAUNCHES AND DEVELOPMENTS (2013-2016)
      • INVESTMENTS AND EXPANSIONS
        • Table INVESTMENTS AND EXPANSIONS (2013-2016)
      • ACQUISITIONS
        • Table ACQUISITIONS (2015-2016)
  • COMPANY PROFILES
    • INTRODUCTION
    • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED (TAIWAN)
      • BUSINESS OVERVIEW
      • SERVICES OFFERED
      • RECENT DEVELOPMENTS
      • MNM VIEW
    • SAMSUNG ELECTRONICS CO., LTD. (SOUTH KOREA)
      • BUSINESS OVERVIEW
      • PRODUCTS OFFERED
      • RECENT DEVELOPMENTS
      • MNM VIEW
    • TOSHIBA CORP. (JAPAN)
      • BUSINESS OVERVIEW
      • PRODUCTS AND SERVICES
      • RECENT DEVELOPMENTS
      • MNM VIEW
    • ASE GROUP (TAIWAN)
      • BUSINESS OVERVIEW
      • SOLUTIONS OFFERED
      • RECENT DEVELOPMENTS
      • MNM VIEW
    • AMKOR TECHNOLOGY (U.S.)
      • BUSINESS OVERVIEW
      • PRODUCTS AND SERVICES
      • RECENT DEVELOPMENTS
      • MNM VIEW
    • UNITED MICROELECTRONICS CORP. (TAIWAN)
      • BUSINESS OVERVIEW
      • SERVICES
      • RECENT DEVELOPMENTS
    • STMICROELECTRONICS NV (SWITZERLAND).
      • BUSINESS OVERVIEW
      • PRODUCTS OFFERED
      • RECENT DEVELOPMENTS
    • BROADCOM LTD. (SINGAPORE)
      • BUSINESS OVERVIEW
      • PRODUCT AND SERVICES
      • RECENT DEVELOPMENTS
    • INTEL CORPORATION. (U.S.)
      • BUSINESS OVERVIEW
      • PRODUCTS OFFERED
      • RECENT DEVELOPMENTS
    • JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD (CHINA)
      • BUSINESS OVERVIEW
      • PRODUCTS AND SERVICES
      • RECENT DEVELOPMENTS
  • APPENDIX
    • INSIGHTS OF INDUSTRY EXPERTS
    • QUESTIONNAIRE
    • KNOWLEDGE STORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
    • INTRODUCING RT: REAL TIME MARKET INTELLIGENCE
    • AVAILABLE CUSTOMIZATIONS
    • RELATED REPORT
    • AUTHOR DETAILS

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