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Worldwide and Taiwanese Semiconductor Packaging & Testing Industry, 2015 and Beyond

Worldwide and Taiwanese Semiconductor Packaging & Testing Industry, 2015 and Beyond

Driven by the development of mobile devices, the worldwide IC packaging and testing industry saw a significant growth in 2014. With leadership in technology and production capacity, the Taiwanese IC packaging and testing industry has enjoyed the highest growth in the world. As the availability of wearable devices and the IoT (Internet of Things) increases, new opportunities and challenges await the Taiwanese IC packaging and testing industry. This report recaps the recent development of the worldwide and Taiwanese IC packaging and testing industry while forecasting their developments in 2015 and beyond from the aspects of market trends and industrial structure.


  • TRENDS IN WORLDWIDE AND TAIWANESE IC PACKAGING AND TESTING INDUSTRIES
    • China's Market Share Sees Fastest Growth
    • Uncertain Market Growth for 2015
  • FUTURE OF WORLDWIDE AND TAIWANESE IC PACKAGING AND TESTING INDUSTRIES
    • Aggressive Expansion
      • Table Worldwide and Taiwanese IC Packaging and Testing Vendor's Capacity Expansion, 2013 – 2015
    • SiP to Become Key Technology
    • Influence of IC Foundries' Development of High-end Heterogeneous Packaging Technologies
  • CONCLUSION
    • Industry's Optimism about the Future on the Wane
    • Enhancement in Technology and Production Capacity as Key to Stay Ahead
  • APPENDIX
    • Glossary of Terms
    • List of Companies

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