Growth Opportunities for Adhesives in the Global Electronics Industry 2016-2021:
According to a new market report published by Lucintel, the future of the global electronicsadhesive market looks good with opportunities in the printed circuit board and semiconductorpackaging. Adhesives in the global electronics industry is expected to reach an estimated $3.8billion by 2021. The global electronics adhesive market is forecast to grow at a CAGR of 4% from2016 to 2021. The major growth drivers for this market are the growth in the production of printedcircuit board, semiconductors, and miniaturization of electronic devices.
In this market, epoxy, silicone, acrylic, and polyurethane adhesives are the major polymer typesof electronic adhesives. On the basis of its comprehensive research, Lucintel forecasts that epoxyadhesives are expected to show above-average growth during the forecast period.
Within the global electronics adhesive market, the epoxy adhesive segment is expected to remainas the largest market. Increasing production of printed circuit boards, semiconductors, andminiaturization of electronic devices are expected to drive adhesive demand, which would spurgrowth for this segment over the forecast period.
Asia Pacific is expected to remain the largest market due to an increase in the production ofprinted circuit board in China, Taiwan, Japan, and South Korea and the use of electronicsadhesives in the assembly and packaging of electronic circuits.
Asia Pacific and Rest of the World are expected to witness above-average growth over theforecast period due to new technological developments and growing demand for printed circuitboard from telecommunication, computer/peripherals, consumer, and microelectronic assemblyapplications.
For business expansion, the report suggests innovation and new product development on fastcure and high temperature resistant adhesives. The report further suggests the development ofpartnerships with customers to create win-win situations and the development of low-costsolutions for end users.
Emerging trends, which have a direct impact on the dynamics of the market, includes the newsilicone-based electrically conductive adhesives in automotive sensor applications, developmentof fast cure and high temperature resistant adhesives, and replacement of lead solder withelectrically conductive adhesives. Henkel AG & Co KGaA, 3M Company, H.B Fuller, KyoceraChemical Corporation, and Hitachi Chemical are among the major suppliers of electronicsadhesives. There are some companies that are opting for merger & acquisition as strategicinitiatives for driving growth.
Lucintel, a leading global strategic consulting and market research firm, has analyzed growthopportunities for adhesives in the global electronics industry by application type, polymer type,product type, region, and product form and has come up with a comprehensive research report,“Growth Opportunities for Adhesives in the Global Electronics Industry 2016-2021: Trends,Forecast, and Opportunity Analysis.” The Lucintel report serves as a spring board for growthstrategy as it provides a comprehensive data and analysis on trends, key drivers, and directions.The study includes a forecast for adhesives in the global electronics industry by application type,polymer type, product type, region, and product form as follows:
By application type [Volume (Million Pounds) and $ Million shipment from 2010 to 2021]:
Printed Circuit Board
Semiconductor PackagingBy polymer type [Volume (Million Pounds) and $ Million shipment from 2010 to 2021]:
Epoxy based electronics adhesive
Silicone based electronics adhesive
Acrylic based electronics adhesive
Polyurethane based electronics adhesive
OthersBy product type [Volume (Million Pounds) and $ Million shipment from 2010 to 2021]:
Thermally conductive adhesives
Electrically conductive adhesives
OthersBy region [Volume (Million Pounds) and $ Million shipment from 2010 to 2021]:
Rest of WorldBy product form [$ Million shipment for 2015]:
FilmThis report answers following 11 key questions:
Q.1 What are some of the most promising, high-growth opportunities for the electronicsadhesives market by application type, polymer type, product type, product form and regions?
Q.2 Which product segments will grow at a faster pace and why?
Q.3 Which region will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers andchallenges of the market?
Q.5 What are the business risks and competitive threats in this market?
Q.6 What are emerging trends in this market and reasons behind them?
Q.7 What are some changing demands of customers in the market?
Q.8 What are the new developments in the market? Which companies are leading thesedevelopments?
Q.9 Who are the major players in this market? What strategic initiatives are beingimplemented by key players for business growth?
Q.10 What are some of the competitive products and processes in this area and how big of athreat do they pose for loss of market share via materials / product substitution?
Q.11 What M & A activity has transpired in the last 5 years in this market and what is itsimpact on the industry?This unique report from Lucintel will provide you with valuable information, insights, and toolsneeded to identify new growth opportunities and operate your business successfully in thismarket. This report will save hundreds of hours of your own personal research time and willsignificantly benefit you in expanding your business in this market. In today’s stringent economy,you need every advantage that you can find.
Features of This Report:
To make business, investment, and strategic decisions, you need timely, useful information. Thismarket report fulfills this core need and is an indispensable reference guide for multinationalmaterials suppliers, product manufacturers, investors, executives, distributors, and many morethat operate in this market.
Some of the features of “Growth Opportunities for Adhesives in the Global ElectronicsIndustry 2016-2021: Trends, Forecast, and Opportunity Analysis” include:
Market size estimates: Growth opportunities for adhesives in the global electronicsIndustry size estimation in terms of value ($B) and volume (million pounds) shipment.
Trend and forecast analysis: Adhesives in the global electronics industry trend (2010-2015) and forecast (2016-2021) by region and segment.
Segmentation analysis: Adhesives in the global electronics industry size by variousapplications such as printed circuit board and semiconductor packaging in terms of valueand volume shipment, by polymer type segments such as epoxy based, silicone based,acrylic based, polyurethane based, and other adhesives in terms of value and volumeshipment, by product type segments such as thermally conductive, electricallyconductive, and other adhesives in terms of value and volume shipment, and by productform such as paste, liquid, and film in terms of value shipment.
Regional analysis: adhesives in global electronics industry breakdown by key regionssuch as North America, Europe, Asia Pacific, and Rest of World.
Growth opportunities: Analysis on growth opportunities in different applications,polymer type, product type, product form, and regions.
Strategic analysis: This includes M&A, new product development, competitivelandscape, and expansion strategies of adhesives in the global electronics adhesivesmarket suppliers.
Emerging applications: Emerging applications of global electronics adhesives invarious segments.
Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
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