Asia Pacific Thermal Interface Material Market Forecast 2018-2026
KEY FINDINGS The thermal interface material Asia Pacific market generated $ 746.4 million in 2017. The region holds the highest share and is dominating the global market at a CAGR of 12.79% during the years 2018-2026.
MARKET INSIGHTS Growing demand for uninterrupted connectivity is one of the drivers proliferating the market in the region. India, China, South Korea, Japan, and rest of Asia Pacific are the countries mentioned in the Asia Pacific thermal interface material market. Application as Nanodiamonds and increased usage of phase change materials are some of the opportunities that are expected to increase the demand for thermal interface material in the coming years.
COMPETITIVE INSIGHTS 3M Company, Wakefield-Vette, Inc., The Bergquist Company, Inc., Stockwell Elastomeric, Inc., Henkel Ag & Co. Kgaa, Epic Resins, Dow Corning Corporation, Master Bond, Momentive Performance Materials Inc., Laird Technologies, Inc., Aavid Thermalloy LIC, Parker Hannifin Corporation, Zalman Tech Co., Ltd, Honeywell International Inc., and Indium Corporation are the key companies in the thermal interface material market.