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Semiconductor Packaging and Test Market in China 2015-2019

About semiconductor packaging and testing

Semiconductor packaging involves casing of materials such as metal, plastic, glass, or ceramic on the silicon wafer. These casings usually contain one or more semiconductor electronic components. A casing protects the silicon wafer against corrosion and impact, clamps the contact pins or leads used to connect the external circuits to the device, and dissipates heat produced in the device. Though packages are usually made in accordance to industry standards, they meet the specifics of an individual manufacturer.
Wafer testing is executed during the semiconductor device fabrication. This involves the testing of all individual integrated circuits present on the wafer. The individual circuits are tested for functional defects using special test patterns. The testing is carried out using an equipment called a wafer prober or handler. Testing is also carried out using testing methods such as system level tests and burn-in method.

Technavio's analysts forecast the semiconductor packaging and test market in China to grow at a CAGR of 7.05% by revenue over the period 2014-2019.

Covered in this report

The report covers the present scenario and the growth prospects of the semiconductor packaging and test market in China for 2015-2019 along with a market overview. The market has been segmented and sub-segmented on the following basis:
By business type :
IDM (integrated devices manufacturers)
Outsourced semiconductor assembly and test (OSAT)

Technavio's report, Semiconductor Packaging and Test Market in China in 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report focuses on the landscape of semiconductor packaging and test market in China market and its opportunities in the coming years. The report includes a discussion of the key vendors operating in this market.

Key vendors
Amkor
ASE
PowerTech
SPIL
STATS ChipsPAC
UTAC

Other prominent vendors
ChipMos
Greatek
Huanhong
JCET
KYEC
Lingsen Precision
Nepes Corporation
SMIC
Tianshui Huatian
Unisem

Key market driver
Growth of semiconductor chip application market
For a full, detailed list, view our report

Key market challenge
Short lifecycle of semiconductor devices
For a full, detailed list, view our report

Key market trend
Emergence of 3D packaging
For a full, detailed list, view our report

Key questions answered in this report
What will the market size be in 2019 in terms of both revenue and unit shipments and what will the growth rate be
What are the key market trends
What is driving this market
What are the challenges to market growth
Who are the key vendors in this market space
What are the market opportunities and threats faced by the key vendors


Press Release

Technavio Announces the Publication of its Research Report Semiconductor Packaging and Test Market in China 2015-2019

Technavio recognizes the following companies as the key players in the Semiconductor Packaging and Test Market in China: Amkor Technology, ASE, Powertech Technology, Siliconware Precision Industries (SPIL), STATS ChipPAC and UTAC

Other Prominent Vendors in the market are: ChipMos, Greatek, Huahong, JCET, KYEC, Lingsen Precision, Nepes, SMIC, Tianshui Huatian, and Unisem.

Commenting on the report, an analyst from Technavios team said: Use of 3D technology for packaging is becoming popular due to demand from electronic goods manufacturers to reduce the space occupied by chips. This is likely to increase performance, as multiple chips will be stacked together. Growth of the local outsourced semiconductor assembly and testing (OSAT) companies and the use of fan-out wafer level packaging (FOWLP) technology is gaining traction in the market as well.

According to the report, rapid expansion of semiconductor chip application with growing demands from industries such as power, energy, medical, green cars, networking and telecommunications, LED lighting, automobile, consumer applications, military, aerospace and defense, motor control applications, and robotics will drive the market over the forecast period.

Further, the report states that the small life span of the packaging equipment may act as a challenge because the technology used to manufacture semiconductor chips is upgraded constantly and is more optimized.

Companies Mentioned

Amkor Technology, ASE, Powertech Technology, Siliconware Precision Industries (SPIL), STATS ChipPAC, UTAC, ChipMos, Greatek, Huahong, JCET, KYEC, Lingsen Precision, Nepes, SMIC, Tianshui Huatian, Unisem.

  • Executive summary
    • Highlights
  • Scope of the report
    • Market overview
    • Product offerings
  • Market research methodology
    • Research methodology
    • Economic indicators
  • Introduction
    • Key market highlights
  • Market landscape
    • Country profile
      • Table Evolution of semiconductor packaging techniques
      • Table Types of packaging and testing
      • Table Semiconductor packaging and test market
    • Market size and forecast
      • Table Semiconductor packaging and test market size in China ($ billions)
    • Five forces analysis
      • Table Five forces analysis
  • Market segmentation by business type
    • Market size and forecast
      • Table Semiconductor packaging and test market by IDM in China 2014-2019 ($ billions)
    • Market size and forecast
      • Table Semiconductor packaging and test market in China by outsourcing 2014-2019 ($ billions)
  • Market drivers
  • Impact of drivers
    • Table Impact of drivers
  • Market challenges
  • Impact of drivers and challenges
    • Table Impact of drivers and challenges
  • Market trends
  • Vendor landscape
    • Competitive scenario
      • Table Market share in semiconductor packaging and test market in China 2014
    • Other prominent vendors
  • Key vendor analysis
    • Amkor Technology
      • Table Amkor Technology: Product segmentation by revenue 2014
      • Table Amkor Technology: Product segment comparison by revenue 2013 and 2014 ($ billions)
      • Table Amkor Technology: Geographical segmentation by revenue 2014
    • ASE
      • Table ASE: Business segmentation by revenue 2014
      • Table ASE: Business segmentation by revenue 2013 and 2014 ($ billions)
      • Table Company Name: Geographical segmentation by revenue 2013
    • Powertech Technology
      • Table Powertech Technology: Business segmentation
      • Table Powertech Technology: Geographical segmentation by revenue 2014
    • Siliconware Precision Industries (SPIL)
      • Table SPIL: Business segmentation by revenue 2014
      • Table SPIL: Business segmentation by revenue 2013 and 2014 ($ billions)
      • Table SPIL: Geographical segmentation by revenue 2014
    • STATS ChipPAC
      • Table STATS ChipPAC: Product segmentation by revenue 2014
      • Table STATS ChipPAC: Geographical segmentation by revenue 2013
    • UTAC
      • Table UTAC: Business segmentation
  • Appendix
    • List of abbreviations
  • Explore Technavio

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