Printed Circuit Board (PCB) Inspection Equipment Market in APAC 2017-2021
About Printed Circuit Board (PCB) Inspection Equipment
PCB inspection equipment uses cameras, X-rays, and ultrasonic or UV radiation to detect defects in PCBs. As electronic devices are being miniaturized, PCBs used in these devices also require miniaturized components and interconnections, which leads to the occurrence of many defects. PCB inspection equipment such as automatic optical inspection (AOI), automatic X-ray inspection (AXI), thermography modules, and SAM modules is used widely for detecting defects and ensuring the quality of PCBs.
Technavio’s analysts forecast the printed circuit board (PCB) inspection equipment market in APAC to grow at a CAGR of 14.72% during the period 2017-2021.
Covered in this report
The report covers the present scenario and the growth prospects of the printed circuit board (PCB) inspection equipment market in APAC for 2017-2021. The report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.
The market is divided into the following segments based on geography:
Technavio Announces the Publication of its Research Report – Printed Circuit Board (PCB) Inspection Equipment Market in APAC 2017-2021
Technavio recognizes the following companies as the key players in the printed circuit board (PCB) inspection equipment market in APAC: Gardien, Manncorp, Nordson, OMRON, and Vision Engineering.
Other Prominent Vendors in the market are: Bruker, Glenbrook Technologies, HB Technology, KohYoung Technology, Mirtec, SAKI, and TRI.
Commenting on the report, an analyst from Technavio’s team said: “One trend in the market is emergence of Industry 4.0. The major focus of Industry 4.0 or the Fourth Industrial Revolution is to develop smart factories and IoT for industries. The adoption of Industry 4.0 has allowed for industrial advances in technology with the help of advanced computing, analytics, low-cost sensing, and the new levels of connectivity enabled through Internet.”
According to the report, one driver in the market is increasing use of X-ray systems for inspection due to advent of BGAs, chip-scale packages, and flip-chips. The use of BGAs and chip-scale packages mostly in consumer electronics has helped in increasing functionality and reducing the size of products. The growth of the telecom industry in recent years has reinvigorated the need for using X-ray inspection systems while manufacturing PCBs. Owing to the very small size of BGAs, chip-scale packages, and flip-chips, they are invisible to the naked eye. Hence, X-ray inspection systems are employed as they can detect joint quality underneath these packages without the need to destroy the PCB equipment for testing and inspection.
Further, the report states that one challenge in the market is increasing complexity in fault detection due to mounting of miniaturized components. Miniaturization in component packaging helps in reducing the size of PCBs, thereby making components more efficient and powerful while in operations. Owing to advances in SMT, components are placed or mounted directly on the PCB surface in the form of BGAs. The smaller size of these components makes them invisible to the human eye, which has in turn increased complexity in testing and inspecting faults. Some of the common faults that arise due to mounting miniaturized components on the surface of PCBs are dry joints, BGA voiding, BGA bridging, BGA missing balls, BGA poor wetting, BGA poor reflow, SOT SOIC lead lifts, solder balls, PTH solder poor fill, PTH poor lead wetting, plastic encapsulated delamination, missing component, flipped, solder short, and heat plane delamination.
Gardien, Manncorp, Nordson, OMRON, Vision Engineering, Bruker, Glenbrook Technologies, HB Technology, KohYoung Technology, Mirtec, SAKI, and TRI.
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