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IC Packaging Market in Taiwan 2015-2019

IC Packaging Market in Taiwan 2015-2019

About IC Packaging

ICs manufactured in the global semiconductor industry are delicate and vulnerable to contamination. To eliminate such eventualities, silicon chips or ICs are protected using packaging materials. Wafer-level packaging is one such packaging that involves the packaging of individual ICs using best-fit packaging processes during the semiconductor production process.

Technavio's analysts forecast the IC packaging market in Taiwan to grow at a CAGR of 2.5% over the period 2014-2019.

Covered in this Report

This report covers the present and future scenarios of the IC packaging market in Taiwan for the period 2015-2019. Technavio uses 2014 as the base year and provides data for the 12 trailing months. To calculate market size, analysts considered the revenue generated by IC packaging vendors in Taiwan. The ICs from both domestic semiconductor and global semiconductor packaging companies were considered for calculating the market size.However, the following were not considered while calculating market size:

  • Revenue from testing services
  • Sales of semiconductor IC packaging equipment
  • Sales of packaging materials
Technavio's report, IC Packaging Market in Taiwan 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the landscape of the IC packaging market in Taiwan and its growth prospects in the coming years. The report includes a discussion on the key vendors operating in this market.

Key Vendors
  • Advanced Semiconductor Engineering
  • Powertech Technology
  • Siliconware Precision Industries
Other Prominent Vendors
  • Amkor Technology
  • ChipMOS Technologies
  • Greatek Electronics
  • King Yuan ELECTRONICS
  • Orient Semiconductor Electronics
  • STATS ChipPAC
  • UTAC
Market Driver
  • Rise in Demand for Smartphones and Tablets
  • For a full, detailed list, view our report
Market Challenge
  • Need for High Capital Investment
  • For a full, detailed list, view our report
Market Trend
  • Short Replacement Cycle of Portable Electronic Devices
  • For a full, detailed list, view our report
Key Questions Answered in this Report
  • What will the market size be in 2019 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?


Press Release

Technavio Announces the Publication of its Research Report – IC Packaging Market in Taiwan 2015-2019

Technavio recognizes the following companies as the key players in the IC Packaging Market in Taiwan: Advanced Semiconductor Engineering, Powertech Technology and Siliconware Precision Industries

Other Prominent Vendors in the market are: Amkor Technology, ChipMOS Technologies, Greatek Electronics, King Yuan ELECTRONICS, Orient Semiconductor Electronics, STATS ChipPAC and UTAC

Commenting on the report, an analyst from Technavio’s team said: “Portable electronic devices such as smartphones and tablets become obsolete after a short time. This is because of rapid launches of next-version models by vendors. The duration of the replacement-cycle period, on average, is 8-12 months. In the past, the replacement period was much longer. Because of the reduction in product-replacement-cycle time, the demand for semiconductor ICs in newly launched devices is expected to rise drastically, and this will increase the demand for IC packaging, leading to the growth of the market.”

According to the report, the availability of low-cost smartphones in Taiwan and increased access to the internet are expected to increase the shipments of smartphones and tablets during the forecast period. With the increasing functionality of smartphones and tablets coupled with the growing LTE infrastructure, consumers are demanding these devices at a higher rate. Semiconductor ICs, an integral part of such devices, will undergo a similar rise in demand, leading to market growth during the forecast period.

Further, the report states that the market requires high capital investment, which is a major challenge for its growth.

Companies Mentioned

Advanced Semiconductor Engineering, Powertech Technology, Siliconware Precision Industries, Amkor Technology, ChipMOS Technologies, Greatek Electronics, King Yuan ELECTRONICS, Orient Semiconductor Electronics, STATS ChipPAC, UTAC

  • Executive Summary
  • List of Abbreviations
  • Scope of the Report
    • Market Overview
    • Product Offerings
  • Market Research Methodology
    • Market Research Process
    • Research Methodology
      • Table Market Research Methodology
  • Introduction
    • Table Workflow: Semiconductor IC Production and Packaging
  • Country Overview
    • Table GDP Composition of Taiwan by Sector of Origin 2014
    • Table GDP Composition of Taiwan by End-user 2014
  • Industry Overview
    • Semiconductor Industry Overview
      • Semiconductor Value Chain
        • Table Semiconductor Value Chain
        • Table Front-end Processes
        • Table Back-end Processes
    • Structure of Semiconductor Market
      • Table Structure of Semiconductor Market
    • Global Semiconductor Market Overview
      • Table Global Semiconductor Market
  • Market Landscape
    • Market Overview
      • Table Global SATS Market Segmentation 2014
    • Market Size and Forecast
      • Table IC Packaging Market in Taiwan 2014-2019 ($ billions)
    • End-user Segmentation
      • Table IC Packaging Market in Taiwan by End-user Applications 2014
      • Communications Segment
      • Consumer Electronics Segment
      • Computer Segment
    • Five Forces Analysis
  • Buying Criteria
    • Table Buying Criteria for Communications Segment
    • Table Buying Criteria for Consumer Electronics Segment
    • Table Buying Criteria for Computer Segment
    • Table Buying Criteria for Others
  • Market Growth Drivers
  • Drivers and their Impact
  • Market Challenges
  • Impact of Drivers and Challenges
  • Market Trends
  • Trends and their Impact
  • Vendor Landscape
    • Competitive Scenario
    • Key Vendors
      • Advanced Semiconductor Engineering
      • Silicon Precision Industries
      • Powertech Technology
        • Table Vendor Ranking of IC Packaging Market in Taiwan
    • Other Prominent Vendors
      • Amkor Technology
      • ChipMOS Technologies
      • Greatek Electronics
      • King Yuan ELECTRONICS
      • Orient Semiconductor Electronics
      • STATS ChipPAC
      • UTAC
  • Key Vendor Analysis
    • Advanced Semiconductor Engineering
      • Key Facts
      • Business Overview
      • Business Segmentation by Revenue 2013
        • Table Advanced Semiconductor Engineering: Business Segmentation by Revenue 2013
      • Business Segmentation by Revenue 2012 and 2013
        • Table Advanced Semiconductor Engineering: Business Segmentation by Revenue 2012 and 2013 (US$ million)
      • Geographical Segmentation by Revenue 2013
        • Table Advanced Semiconductor Engineering: Geographical Segmentation by Revenue 2013
      • Business Strategy
      • Recent Developments
      • SWOT Analysis
    • SPIL
      • Key Facts
      • Business Overview
      • Business Segmentation by Revenue 2013
        • Table SPIL: Business Segmentation by Revenue 2013
      • Business Segmentation by Revenue 2012 and 2013
        • Table SPIL: Business Segmentation by Revenue 2012 and 2013 (US$ million)
      • Geographical Segmentation by Revenue 2013
        • Table SPIL: Geographical Segmentation by Revenue 2013
      • Business Strategy
      • Recent Developments
      • SWOT Analysis
    • Powertech Technology
      • Key Facts
      • Business Overview
      • Business Strategy
      • SWOT Analysis
  • Other Reports in this Series

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