Global Wireless Chipset Market 2017-2021
About Wireless Chipset
The wireless chipset is an internal piece of hardware located inside a wireless communication device. Devices like wireless adapters and external video adapters use wireless chipsets. A wireless chipset is an internal hardware that allows a device to connect to another wireless-enabled device. They are also known as wireless Internet cards or LAN cards. These cards are of two types, namely, internal and external cards.
Technavio’s analysts forecast the global wireless chipset market to grow at a CAGR of 3.98% during the period 2017-2021.
Covered in this report
The report covers the present scenario and the growth prospects of the global wireless chipset market for 2017-2021. To calculate the market size, the report considers the revenue generated through the sales of wireless chipsets.
The market is divided into the following segments based on geography:
Technavio Announces the Publication of its Research Report – Global Wireless Chipset Market 2017-2021
Technavio recognizes the following companies as the key players in the global wireless chipset market: Altair Semiconductor, Atmel, Broadcom, NXP Semiconductors, Gainspan, Intel, and Qualcomm.
Other Prominent Vendors in the market are: Sequans Communications, Lattice Semiconductor, Silicon Laboratories, and Texas Instruments.
Commenting on the report, an analyst from Technavio’s team said: “One trend in the market is Li-Fi advanced wireless technologies. Li-Fi is one of the latest wireless communication technologies, which is likely to experience an increased adoption during the forecast period. Li-Fi uses light communication technology, which enables high-speed data transfer between devices.”
According to the report, one driver in the market is increasing emergence of various standards to support IoT devices. Home automation, energy management, PCs, smartphones, and tablets use IoT applications. Any device can directly connect with another wireless-enabled device through the application server. It consists of IP networks that use protocols such as Bluetooth, Z-Wave, or ZigBee. IoT devices can sense the environment and communicate with each other in a connected environment.
Further, the report states that one challenge in the market is changing design architecture and form factors. Design issue of chipsets is one of the major challenges for the market. Several form factors are becoming available with the launch of new wireless connectivity technologies such as LTE. Thus, the wireless chip designs are becoming complex. Vendors are focusing on embedding the latest wireless connectivity, such as LTE and 5G, into the wireless chipsets, but these products are likely to take more time to get launched.
Altair Semiconductor, Atmel, Broadcom, NXP Semiconductors, Gainspan, Intel, Qualcomm, Sequans Communications, Lattice Semiconductor, Silicon Laboratories, and Texas Instruments.